Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2010
01/26/2010US7651896 Method for manufacturing semiconductor device
01/26/2010US7651895 Transistor, method for manufacturing thereof, substrate for an electrooptical device
01/26/2010US7651894 Method for manufacturing semiconductor device
01/26/2010US7651893 Metal electrical fuse structure
01/26/2010US7651892 Electrical programmable metal resistor
01/26/2010US7651891 Integrated circuit package with stress reduction
01/26/2010US7651889 Electromagnetic shield formation for integrated circuit die package
01/26/2010US7651888 Wafer lever fixture and method for packaging micro-electro-mechanical-system devices
01/26/2010US7651887 Optical semiconductor device and method of manufacturing thereof
01/26/2010US7651886 Semiconductor device and manufacturing process thereof
01/26/2010US7651883 High energy implant photodiode stack
01/26/2010US7651882 RFID tag circuit die with shielding layer to control I/O bump flow
01/26/2010US7651881 Solid-state imaging device and method for manufacturing the same
01/26/2010US7651879 Surface acoustic wave pressure sensors
01/26/2010US7651878 Wafer-level chip-scale package of image sensor and method of manufacturing the same
01/26/2010US7651877 Two-dimensional image detecting apparatus and method for manufacturing the same
01/26/2010US7651876 Semiconductor structures and method for fabricating the same
01/26/2010US7651874 Method and apparatus for localizing production errors in a semiconductor component part
01/26/2010US7651873 Method relating to the accurate positioning of a semiconductor wafer
01/26/2010US7651872 Discrete nano-textured structures in biomolecular arrays, and method of use
01/26/2010US7651831 Acrylic terpolymer with fluorosulfonamide-containing unit e.g. 2-trifluoromethanesulfonylaminoethyl methacrylate, a second unit having pendant acid labile group, and a third unit having a lactone moiety, and an acid generator; good etch resistance and dissolution properties; use making semiconductors
01/26/2010US7651829 Positive resist material and pattern formation method using the same
01/26/2010US7651823 Optically semitransmissive film, photomask blank and photomask, and method for designing optically semitransmissive film
01/26/2010US7651761 Polishing layer is closed-cell resin foam, wherein number of closed cells in polishing layer is 200 to 600 per mm2, and average diameter of closed cells is 30 to 60 mu m, wherein resin constituting resin foam consists of polyurethane resin; for polishing silicone wafers, glass or aluminum substrates
01/26/2010US7651733 Forming film on a surface of a tabular substrate such as a semiconductor wafer with a high uniformity, by a plurality of source gases including an organic-metal including gas
01/26/2010US7651725 Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond
01/26/2010US7651724 Sealing substrate, wafter; cost efficiency
01/26/2010US7651723 Microelectronic fabrication system components and method for processing a wafer using such components
01/26/2010US7651594 Silicon oxide or silicon oxynitride layers on substrates; high barrier property and better transparency; used as a wrapping material for foods, drugs, a packaging material for electronic devices
01/26/2010US7651587 Two-piece dome with separate RF coils for inductively coupled plasma reactors
01/26/2010US7651586 Particle removal apparatus and method and plasma processing apparatus
01/26/2010US7651585 Apparatus for the removal of an edge polymer from a substrate and methods therefor
01/26/2010US7651584 Processing apparatus
01/26/2010US7651583 Processing system and method for treating a substrate
01/26/2010US7651571 Susceptor
01/26/2010US7651568 Plasma enhanced atomic layer deposition system
01/26/2010US7651567 Mask for sequential lateral solidification and crystallization method using thereof
01/26/2010US7651365 Outlet adapter with EL elements, receptacles for other electric devices, and prongs for supplying power from a power source to the receptacles and EL elements
01/26/2010US7651315 Large area substrate transferring method for aligning with horizontal actuation of lever arm
01/26/2010US7651306 Cartesian robot cluster tool architecture
01/26/2010US7651284 Development apparatus and development method
01/26/2010US7651197 Method of manufacturing an inkjet head through the anodic bonding of silicon members
01/26/2010US7651022 Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
01/26/2010US7650982 Production system
01/26/2010US7650897 Nozzle arrangement
01/26/2010US7650853 Device for applying electromagnetic microwave radiation in a plasma cavity
01/26/2010US7650762 Cooling air flow control valve for burn-in system
01/26/2010US7650691 Component supply head device and component mounting head device
01/26/2010US7650688 Bonding tool for mounting semiconductor chips
01/26/2010CA2520972C Cmos-compatible integration of silicon-based optical devices with electronic devices
01/26/2010CA2464078C Semiconductor device and method of manufacturing the same
01/26/2010CA2309738C Method of molecular-scale pattern imprinting at surfaces
01/25/2010CA2673705A1 Interface-infused nanotube interconnect
01/21/2010WO2010009323A2 Phase mask and method of fabrication
01/21/2010WO2010009268A2 Methods of preparing photovoltaic modules
01/21/2010WO2010009253A1 Systems and methods for detecting scratches on non-semiconductor wafer surfaces
01/21/2010WO2010009050A2 Substrate lift pin sensor
01/21/2010WO2010009048A2 Tube diffuser for load lock chamber
01/21/2010WO2010009013A2 Test head docking system and method
01/21/2010WO2010008967A2 Improvement of organic line width roughness with h2 plasma treatment
01/21/2010WO2010008959A2 Dc test resource sharing for electronic device testing
01/21/2010WO2010008938A1 Electronic devices including carbon-based films having sidewall liners, and methods of forming such devices
01/21/2010WO2010008930A2 Methods to promote adhesion between barrier layer and porous low-k film deposited from multiple liquid precursors
01/21/2010WO2010008929A1 Work-piece transfer systems and methods
01/21/2010WO2010008827A2 Pedestal heater for low temperature pecvd application
01/21/2010WO2010008824A2 Closed-loop control for effective pad conditioning
01/21/2010WO2010008754A2 Methods for forming an amorphous silicon film in display devices
01/21/2010WO2010008752A2 Gold-tin-indium solder for processing compatibility with lead-free tin-based solder
01/21/2010WO2010008748A1 Spacer fill structure, method and design structure for reducing device variation
01/21/2010WO2010008747A2 Big foot lift pin
01/21/2010WO2010008721A2 Substrate temperature measurement by infrared transmission in an etch process
01/21/2010WO2010008711A2 Cathode with inner and outer electrodes at different heights
01/21/2010WO2010008703A2 Liquid phase molecular self-assembly for barrier deposition and structures formed thereby
01/21/2010WO2010008700A2 Method and system for growing a thin film using a gas cluster ion beam
01/21/2010WO2010008673A2 Methods and systems for packaging integrated circuits with thin metal contacts
01/21/2010WO2010008672A1 Semiconducting polymers
01/21/2010WO2010008617A1 Mosfet switch with embedded electrostatic charge
01/21/2010WO2010008517A2 Deposition apparatus for improving the uniformity of material processed over a substrate and method of using the apparatus
01/21/2010WO2010008508A1 Inner cavity system for nano-imprint lithography
01/21/2010WO2010008389A1 Method for making an electronic assembly
01/21/2010WO2010008383A1 Thin sacrificial masking films for protecting semiconductors from pulsed laser process
01/21/2010WO2010008287A1 Method for encapsulating electronic components with a controllable closing force
01/21/2010WO2010008257A2 A spring assembly and a test socket using the same
01/21/2010WO2010008212A2 Magazine for semiconductor package
01/21/2010WO2010008211A2 Batch-type heat treatment device and heater used therein
01/21/2010WO2010008116A2 Method and chamber for inductively coupled plasma processing for cylinderical material with three-dimensional surface
01/21/2010WO2010008102A1 Cleaning method of apparatus for depositing carbon containing film
01/21/2010WO2010008085A1 Screen plate, interlayer insulation film, circuit board, active matrix circuit board, and image display apparatus
01/21/2010WO2010008076A1 Power introduction terminal for plasma processing device and plasma processing device
01/21/2010WO2010008066A1 Compound having a plurality of tetraphenylmethane backbones, film-forming composition, insulating film and electronic device
01/21/2010WO2010008037A1 Algan bulk crystal manufacturing method and algan substrate manufacturing method
01/21/2010WO2010008021A1 Plasma treatment method and plasma treatment device
01/21/2010WO2010008006A1 Plasma processing apparatus and plasma processing method
01/21/2010WO2010007993A1 Positive-type radiation-sensitive composition, and resist pattern formation method
01/21/2010WO2010007991A1 Cu wiring film forming method
01/21/2010WO2010007983A1 Method for growing gan crystal
01/21/2010WO2010007981A1 Film-forming apparatus and powder evaporation apparatus
01/21/2010WO2010007976A1 Resin composition for making resist pattern insoluble, and method for formation of resist pattern by using the same
01/21/2010WO2010007971A1 Radiation-sensitive resin composition
01/21/2010WO2010007955A1 Reflective mask blank for euv lithography and reflective mask for euv lithography