Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2010
01/07/2010US20100003784 Method for mounting electronic component on printed circuit board
01/07/2010US20100003783 Semiconductor device and manufacturing method thereof
01/07/2010US20100003782 Methods Of Forming A Non-Volatile Resistive Oxide Memory Cell And Methods Of Forming A Non-Volatile Resistive Oxide Memory Array
01/07/2010US20100003780 Methods and apparatus for depositing a microcrystalline silicon film for photovoltaic device
01/07/2010US20100003779 Method of producing solid-state imaging device
01/07/2010US20100003775 Method of fabricating array substrate for in-plane switching mode liquid crystal display device having double-layered metal patterns
01/07/2010US20100003774 Method for fabricating pixel structure
01/07/2010US20100003773 Method for manufacturing liquid discharge head
01/07/2010US20100003772 Wafer level hermetic bond using metal alloy with raised feature
01/07/2010US20100003771 Production method of semiconductor device and bonding film
01/07/2010US20100003770 Elemental analysis method and semiconductor device manufacturing method
01/07/2010US20100003769 Method relating to the accurate positioning of a semiconductor wafer
01/07/2010US20100003768 System and method for processing substrates with detachable mask
01/07/2010US20100003767 Magnetic tunnel junction device, memory cell having the same, and method for fabricating the same
01/07/2010US20100003620 Exposure method
01/07/2010US20100003608 Method for generating mask pattern data and method for manufacturing mask
01/07/2010US20100003600 Solid-state structure comprising a battery and a variable resistor of which the resistance is controlled by variation of the concentration of active species in electrodes of the battery
01/07/2010US20100003573 Method for processing portions of walls of an opening formed in a silicon substrate
01/07/2010US20100003516 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
01/07/2010US20100003513 Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
01/07/2010US20100003512 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device
01/07/2010US20100003468 Method of forming microfined resist pattern
01/07/2010US20100003181 Method For Forming Amorphous Silica-Based Coating Film With Low Dielectric Constant And Thus Obtained Amorphous Silica-Based Coating Film
01/07/2010US20100003119 Method for picking up device attached with adhesive tape
01/07/2010US20100003111 Substrate processing apparatus and method for transferring substrate for the apparatus
01/07/2010US20100003110 Suction holding apparatus and suction holding method
01/07/2010US20100002563 Media with tetragonally-strained recording layer having improved surface roughness
01/07/2010US20100002516 Integrated Circuit Memory Devices Having Vertically Arranged Strings of Memory Cells Therein and Methods of Operating Same
01/07/2010US20100002501 MRAM Device Structure Employing Thermally-Assisted Write Operations and Thermally-Unassisted Self-Referencing Operations
01/07/2010US20100002355 Wafer support device and component used for the same
01/07/2010US20100002354 Electrostatic chuck device
01/07/2010US20100002227 Inspection method and inspection apparatus
01/07/2010US20100002219 Illuminant distribution evaluation method, optical member manufacturing method, illumination optical device, exposure apparatus, and exposure method
01/07/2010US20100002175 Transparent display device and manufacturing method thereof
01/07/2010US20100002108 Solid state imaging device, method for producing the same, and electronic apparatus
01/07/2010US20100001930 Display device and method of driving the same
01/07/2010US20100001787 Dynamically-driven deep n-well circuit
01/07/2010US20100001785 Semiconductor component and method of determining temperature
01/07/2010US20100001724 IC Microfluidic Platform With Integrated Magnetic Resonance Probe
01/07/2010US20100001449 Holding and turning device for touch-sensitive flat objects
01/07/2010US20100001432 Apparatus for passivating a component and method for producing the apparatus
01/07/2010US20100001416 Wafer laser-marking method and die fabricated using the same
01/07/2010US20100001414 Manufacturing a semiconductor device via etching a semiconductor chip to a first layer
01/07/2010US20100001413 Semiconductor Device and Semiconductor Device Manufacturing Method
01/07/2010US20100001411 Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates
01/07/2010US20100001410 Flip chip overmold package
01/07/2010US20100001409 Semiconductor device and method of manufacturing thereof
01/07/2010US20100001408 Semiconductor device and method of manufacturing semiconductor device
01/07/2010US20100001407 Galvanic mask
01/07/2010US20100001406 Artificially tilted via connection
01/07/2010US20100001405 Integrated circuit structure
01/07/2010US20100001403 Method for designing semiconductor integrated circuit which includes metallic wiring connected to gate electrode and satisfies antenna criterion
01/07/2010US20100001402 Multiple Patterning Method
01/07/2010US20100001400 Solder contact
01/07/2010US20100001399 Semiconductor Chip Passivation Structures and Methods of Making the Same
01/07/2010US20100001396 Repairable semiconductor device and method
01/07/2010US20100001389 Package structure for radio frequency module and manufacturing method thereof
01/07/2010US20100001388 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device
01/07/2010US20100001387 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device
01/07/2010US20100001386 Semiconductor device and manufacturing method therefor
01/07/2010US20100001385 Integrated circuit package system with bumped lead and nonbumped lead
01/07/2010US20100001382 Manufacturing method for integrating a shunt resistor into a semiconductor package
01/07/2010US20100001380 Semiconductor device and method of manufacturing the same
01/07/2010US20100001379 Multi-chip package (MCP) having three dimensional mesh-based power distribution network, and power distribution method of the MCP
01/07/2010US20100001378 Through-substrate vias and method of fabricating same
01/07/2010US20100001376 Method for manufacturing nitride semiconductor self-supporting substrate and nitride semiconductor self-supporting substrate
01/07/2010US20100001374 Epitaxial lift off stack having a multi-layered handle and methods thereof
01/07/2010US20100001373 Corresponding capacitor arrangement and method for making the same
01/07/2010US20100001372 Semiconductor device and manufacturing method thereof
01/07/2010US20100001371 Semiconductor device having capacitor including a high dielectric film and manufacture method of the same
01/07/2010US20100001370 Integrated circuit system employing alternating conductive layers
01/07/2010US20100001369 Device layout for gate last process
01/07/2010US20100001368 Microelectromechanical device packaging with an anchored cap and its manufacture
01/07/2010US20100001367 Method and Resulting Structure DRAM Cell with Selected Inverse Narrow Width Effect
01/07/2010US20100001365 Isolation technique allowing both very high and low voltage circuits to be fabricated on the same chip
01/07/2010US20100001364 Semiconductor Device Having Improved Oxide Thickness at a Shallow Trench Isolation Edge and Method of Manufacture Thereof
01/07/2010US20100001363 Semiconductor Device and Method of Providing Electrostatic Discharge Protection for Integrated Passive Devices
01/07/2010US20100001361 Suspended getter material-based structure
01/07/2010US20100001360 Level posture sensing chip and its manufacturing method, level posture sensor
01/07/2010US20100001359 Transparent conductive layer and method of manufacturing the same
01/07/2010US20100001357 Integrated circuit package, notably for image sensor, and method of positioning
01/07/2010US20100001356 Magnetic memory device and method for manufacturing the same
01/07/2010US20100001355 RF MEMS Switch
01/07/2010US20100001354 Self aligned mos structure with polysilicon contact
01/07/2010US20100001353 SANOS Memory Cell Structure
01/07/2010US20100001352 Semiconductor device and method of manufacturing the same
01/07/2010US20100001350 Semiconductor integrated circuit device
01/07/2010US20100001348 Semiconductor device and fabrication method for the same
01/07/2010US20100001346 Treatment of Gate Dielectric for Making High Performance Metal Oxide and Metal Oxynitride Thin Film Transistors
01/07/2010US20100001344 Semiconductor device and method of forming a semiconductor device
01/07/2010US20100001343 High voltage semiconductor device including field shaping layer and method of fabricating the same
01/07/2010US20100001342 Method for manufacturing semiconductor device and semiconductor device
01/07/2010US20100001340 Semiconductor device and method for fabricating the same
01/07/2010US20100001338 Non-volatile semiconductor memory device, and manufacture method for non-volatile semiconductor memory device
01/07/2010US20100001336 Sonos-nand device having a storage region separated between cells
01/07/2010US20100001334 Atomic layer deposition epitaxial silicon growth for tft flash memory cell
01/07/2010US20100001333 Semiconductor device and fabrication method therefor
01/07/2010US20100001332 Integrating a capacitor in a metal gate last process
01/07/2010US20100001331 Semiconductor device and manufacturing method thereof
01/07/2010US20100001330 Semiconductor device, data element thereof and method of fabricating the same