Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2010
01/21/2010US20100015759 POP Semiconductor Device Manufacturing Method
01/21/2010US20100015758 Nonvolatile Memory Device and Fabrication Method Thereof
01/21/2010US20100015757 Bridge resistance random access memory device and method with a singular contact structure
01/21/2010US20100015756 Hybrid heterojunction solar cell fabrication using a doping layer mask
01/21/2010US20100015755 Manufacturing method of semiconductor memory device
01/21/2010US20100015754 Method and apparatus to form thin layers of photovoltaic absorbers
01/21/2010US20100015753 High Power Efficiency, Large Substrate, Polycrystalline CdTe Thin Film Semiconductor Photovoltaic Cell Structures Grown by Molecular Beam Epitaxy at High Deposition Rate for Use in Solar Electricity Generation
01/21/2010US20100015752 Methods of Preparing Photovoltaic Modules
01/21/2010US20100015751 Hybrid heterojunction solar cell fabrication using a metal layer mask
01/21/2010US20100015750 Process of manufacturing solar cell
01/21/2010US20100015748 Image Sensor and Method for Manufacturing the Same
01/21/2010US20100015746 Method of Manufacturing Image Sensor
01/21/2010US20100015744 Micro-Electromechanical Device and Method of Making the Same
01/21/2010US20100015743 Etched-facet ridge lasers with etch-stop
01/21/2010US20100015742 Method for fabricating light emitting diode chip
01/21/2010US20100015741 Fabrication process for silicon ridge waveguide ring resonator
01/21/2010US20100015740 Liquid crystal display device and fabricating method thereof
01/21/2010US20100015737 Semiconductor device, method of manufacturing thereof, and method of manufacturing base material
01/21/2010US20100015736 Method of fabricating a chip
01/21/2010US20100015735 Observation method of wafer ion implantation defect
01/21/2010US20100015734 Formation of Through-Wafer Electrical Interconnections and Other Structures Using a Thin Dielectric Membrane
01/21/2010US20100015733 Method and device for monitoring a heat treatment of a microtechnological substrate
01/21/2010US20100015732 Semiconductor chip repair by stacking of a base semiconductor chip and a repair semiconductor chip
01/21/2010US20100015731 Method of low-k dielectric film repair
01/21/2010US20100015730 Magnetic self-assembly for integrated circuit packages
01/21/2010US20100015729 Methods of forming a thin ferroelectric layer and methods of manufacturing a semiconductor device including the same
01/21/2010US20100015537 Beam dose computing method and writing method and record carrier body and writing apparatus
01/21/2010US20100015440 Planar laminate substrate and method for fabricating organic laminate substrate PCBS, semiconductors, semiconductor wafers and semiconductor devices having miniaturized electrical pathways
01/21/2010US20100015402 Method for depositing a layer on a semiconductor wafer by means of cvd and chamber for carrying out the method
01/21/2010US20100014949 Conveying device
01/21/2010US20100014948 Stacking tray supply unit and supply method, and component mounting apparatus and method
01/21/2010US20100014945 Semiconductor processing apparatus having all-round type wafer handling chamber
01/21/2010US20100014805 Zinc oxide diodes for optical interconnections
01/21/2010US20100014546 Optical pulse generating apparatus using photoelectric effect of surface plasmon resonance photons and its manufacturing method
01/21/2010US20100014269 Semiconductor module and method
01/21/2010US20100014261 Printed circuit board and method of manufacturing printed circuit board
01/21/2010US20100014208 Substrate holder
01/21/2010US20100014061 Lithographic apparatus and device manufacturing method
01/21/2010US20100014059 Lithographic Apparatus and Device Manufacturing Method
01/21/2010US20100014044 Liquid crystal display panel and fabrication method thereof
01/21/2010US20100014036 Alignment layer of liquid crystals deposited and rubbed before making microstructures
01/21/2010US20100013574 Micro-Electro-Mechanical Transducer Having a Surface Plate
01/21/2010US20100013515 Electrostatic discharge protection device, method of manufacturing the same, method of testing the same
01/21/2010US20100013506 Probe pad, substrate having a semiconductor device, method of testing a semiconductor device and tester for testing a semiconductor device
01/21/2010US20100013107 Interconnect structures for integration of multi-layered integrated circuit devices and methods for forming the same
01/21/2010US20100013106 Stacked semiconductor chips
01/21/2010US20100013104 Integrated circuit hard mask processing system
01/21/2010US20100013103 Semiconductor embedded module and method for producing the same
01/21/2010US20100013102 Semiconductor Device and Method of Providing a Thermal Dissipation Path Through RDL and Conductive Via
01/21/2010US20100013100 Method and System for Forming Conductive Bumping with Copper Interconnection
01/21/2010US20100013099 Mechanically stable diffusion barrier stack and method for fabricating the same
01/21/2010US20100013098 Method of forming an interconnect structure on an integrated circuit die
01/21/2010US20100013095 Semiconductor device, production method for the same, and substrate
01/21/2010US20100013092 Semiconductor device and manufacturing method therefor
01/21/2010US20100013091 Semiconductor device including a copolymer layer
01/21/2010US20100013090 Silicide formation on a wafer
01/21/2010US20100013089 Semiconductor component and manufacturing method of semiconductor component
01/21/2010US20100013088 Method for packaging semiconductors at a wafer level
01/21/2010US20100013087 Embedded die package and process flow using a pre-molded carrier
01/21/2010US20100013081 Packaging structural member
01/21/2010US20100013072 Stacked package and method for forming stacked package
01/21/2010US20100013071 Organic light emitting device and manufacturing method thereof
01/21/2010US20100013069 Semiconductor device, lead frame and method of manufacturing semiconductor device
01/21/2010US20100013068 Chip package carrier and fabrication method thereof
01/21/2010US20100013064 Semiconductor device packages with electromagnetic interference shielding
01/21/2010US20100013063 Thin-film device, method for manufacturing the same, and electronic apparatus
01/21/2010US20100013062 Nonvolatile memory cell
01/21/2010US20100013060 Method of forming a conductive trench in a silicon wafer and silicon wafer comprising such trench
01/21/2010US20100013059 Diffusion region routing for narrow scribe-line devices
01/21/2010US20100013057 Semiconductor substrate suitable for the realisation of electronic and/or optoelectronic devices and relative manufacturing process
01/21/2010US20100013056 Semiconductor device and method of manufacturing the same
01/21/2010US20100013053 Method for manufacturing iii-v compound semiconductor substrate, method for manufacturing epitaxial wafer, iii-v compound semiconductor substrate, and epitaxial wafer
01/21/2010US20100013052 Dual chamber system providing simultaneous etch and deposition on opposing substrate sides for growing low defect density epitaxial layers
01/21/2010US20100013051 Method Of Forming A Bipolar Transistor And Semiconductor Component Thereof
01/21/2010US20100013049 Semiconductor memory device and method for manufacturing same
01/21/2010US20100013048 Interconnect line selectively isolated from an underlying contact plug
01/21/2010US20100013047 Integrated circuit and method of manufacturing the same
01/21/2010US20100013045 Method of Integrating an Element
01/21/2010US20100013044 Three-dimensional silicon on oxide device isolation
01/21/2010US20100013043 Crackstop structures and methods of making same
01/21/2010US20100013041 Microelectronic imager packages with covers having non-planar surface features
01/21/2010US20100013039 Backside-illuminated imaging sensor including backside passivation
01/21/2010US20100013038 Photo-semiconductor device and method of manufacturing the same
01/21/2010US20100013036 Thin Sacrificial Masking Films for Protecting Semiconductors From Pulsed Laser Process
01/21/2010US20100013034 Electromechanical device comprising electronic components and at least one nanotube-based interface, and manufacturing method
01/21/2010US20100013033 Enablement of IC devices during assembly
01/21/2010US20100013032 Method for Housing an Electronic Component in a Device Package and an Electronic Component Housed in the Device Package
01/21/2010US20100013031 MEMS Substrates, Devices, and Methods of Manufacture Thereof
01/21/2010US20100013030 Biosensor, manufacturing method thereof, and biosensing apparatus including the same
01/21/2010US20100013029 Structure and a Method of Manufacture for Low Resistance NiSix
01/21/2010US20100013028 Semiconductor device and method for manufacturing semiconductor device
01/21/2010US20100013027 Semiconductor device and method of manufacturing the same
01/21/2010US20100013026 Integrated circuits comprising resistors having different sheet resistances and methods of fabricating the same
01/21/2010US20100013025 Semiconductor device and manufacturing method thereof
01/21/2010US20100013024 High performance stress-enhance mosfet and method of manufacture
01/21/2010US20100013023 Method for manufacturing semiconductor device, and semiconductor device
01/21/2010US20100013021 METHOD TO REDUCE THRESHOLD VOLTAGE (Vt) IN SILICON GERMANIUM (SIGE), HIGH-K DIELECTRIC-METAL GATE, P-TYPE METAL OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTORS
01/21/2010US20100013019 Stressed dielectric devices and methods of fabricating same
01/21/2010US20100013017 Method of manufacturing semiconductor device, and semiconductor device
01/21/2010US20100013014 Field effect transistor having source and/or drain forming schottky or schottky-like contact with strained semiconductor substrate