| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/14/2010 | US20100009529 Method of manufacturing a semiconductor device |
| 01/14/2010 | US20100009528 Method for Rapid Thermal Treatment Using High Energy Electromagnetic Radiation of a Semiconductor Substrate for Formation of Dielectric Films |
| 01/14/2010 | US20100009527 Integrated circuit system employing single mask layer technique for well formation |
| 01/14/2010 | US20100009526 Fabrication method and fabrication apparatus of group iii nitride crystal substance |
| 01/14/2010 | US20100009525 Method including producing a monocrystalline layer |
| 01/14/2010 | US20100009524 Method for improving semiconductor surfaces |
| 01/14/2010 | US20100009523 making a high K (dielectric constant) film using an ultra-high purity hafnium containing silicate film in a metal-oxide-semiconductor (CMOS) field effect transistor (FET) or MOSFET |
| 01/14/2010 | US20100009522 Method for Forming Chalcogenide Switch with Crystallized Thin Film Diode Isolation |
| 01/14/2010 | US20100009521 Method of producing semiconductor wafer |
| 01/14/2010 | US20100009520 Wafer processing method for improving gettering capabilities of wafers made therefrom |
| 01/14/2010 | US20100009519 Method of thinning a semiconductor wafer |
| 01/14/2010 | US20100009518 Particle Free Wafer Separation |
| 01/14/2010 | US20100009517 Process for Inhibiting Corrosion and Removing Contaminant from a Surface During Wafer Dicing and Composition Useful Therefor |
| 01/14/2010 | US20100009516 METHOD FOR GROWTH OF GaN SINGLE CRYSTAL, METHOD FOR PREPARATION OF GaN SUBSTRATE, PROCESS FOR PRODUCING GaN-BASED ELEMENT, AND GaN-BASED ELEMENT |
| 01/14/2010 | US20100009515 Laser lift-off method |
| 01/14/2010 | US20100009514 Method of fabricating micro-vertical structure |
| 01/14/2010 | US20100009513 Semiconductor device and method of manufacturing the same |
| 01/14/2010 | US20100009512 Methods of forming a plurality of capacitors |
| 01/14/2010 | US20100009511 Programmable capacitor associated with an input/output pad |
| 01/14/2010 | US20100009510 Method of manufacturing semiconductor device |
| 01/14/2010 | US20100009509 Dual-damascene process to fabricate thick wire structure |
| 01/14/2010 | US20100009508 Methods of fabricating stack type capacitors of semiconductor devices |
| 01/14/2010 | US20100009507 Method of constructing cmos device tubs |
| 01/14/2010 | US20100009506 Dopant implantation method and integrated circuits formed thereby |
| 01/14/2010 | US20100009505 Semiconductor device having a vertical transistor and method for manufacturing the same |
| 01/14/2010 | US20100009504 Systems and methods for a high density, compact memory array |
| 01/14/2010 | US20100009503 Method of forming dielectric layer above floating gate for reducing leakage current |
| 01/14/2010 | US20100009502 Semiconductor Fabrication Process Including An SiGe Rework Method |
| 01/14/2010 | US20100009501 Packaging structure, method for manufacturing the same, and method for using the same |
| 01/14/2010 | US20100009500 Aluminum Leadframes for Semiconductor QFN/SON Devices |
| 01/14/2010 | US20100009499 Stacked microelectronic layer and module with three-axis channel t-connects |
| 01/14/2010 | US20100009495 Anti-reflective device having an anti-reflective surface formed of silicon spikes with nano-tips |
| 01/14/2010 | US20100009492 Method for production of thin semiconductor solar cells and integrated circuits |
| 01/14/2010 | US20100009490 Method for fabricating a solid-state imaging device |
| 01/14/2010 | US20100009489 Method and system for producing a solar cell using atmospheric pressure plasma chemical vapor deposition |
| 01/14/2010 | US20100009488 Method to form a photovoltaic cell comprising a thin lamina |
| 01/14/2010 | US20100009487 ONO Spacer Etch Process to Reduce Dark Current |
| 01/14/2010 | US20100009482 Photoresist composition, method of forming a metal pattern, and method of manufacturing a display substrate using the same |
| 01/14/2010 | US20100009481 Method for fabricating thin film transistor array substrate |
| 01/14/2010 | US20100009480 Method for fabricating liquid crystal display device |
| 01/14/2010 | US20100009478 Ips mode liquid crystal display device and method for fabricating thereof |
| 01/14/2010 | US20100009476 Substrate structure and method of removing the substrate structure |
| 01/14/2010 | US20100009475 Disk Laser Including an Amplified Spontaneous Emission (ASE) Suppression Feature |
| 01/14/2010 | US20100009474 Method of growing carbon nanotubes and method of manufacturing field emission device using the same |
| 01/14/2010 | US20100009473 Method for manufacturing semiconductor device |
| 01/14/2010 | US20100009472 Edge Exclusion Zone Patterning For Solar Cells And The Like |
| 01/14/2010 | US20100009471 Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device |
| 01/14/2010 | US20100009470 Within-sequence metrology based process tuning for adaptive self-aligned double patterning |
| 01/14/2010 | US20100009469 Plasma doping method and apparatus |
| 01/14/2010 | US20100009468 Method of manufacture for semiconductor package with flow controller |
| 01/14/2010 | US20100009466 Semiconductor device and manufacturing method of the same |
| 01/14/2010 | US20100009272 Mask fabrication method, exposure method, device fabrication method, and recording medium |
| 01/14/2010 | US20100009271 Resist patterning process and manufacturing photo mask |
| 01/14/2010 | US20100009155 Semiconductor wafer and production method thereof |
| 01/14/2010 | US20100008748 Apparatus for loading and unloading semiconductor substrate platelets |
| 01/14/2010 | US20100008203 Semiconductor device, its manufacturing method and optical pickup module |
| 01/14/2010 | US20100008128 Resistive nonvolatile memory element, and production method of the same |
| 01/14/2010 | US20100008124 Cross point memory cell with distributed diodes and method of making same |
| 01/14/2010 | US20100008123 Multiple series passive element matrix cell for three-dimensional arrays |
| 01/14/2010 | US20100008122 Memory Device And Method For Making Same |
| 01/14/2010 | US20100008016 Electrostatic chuck assembly with capacitive sense feature, and related operating method |
| 01/14/2010 | US20100008015 Capacitively-coupled electrostatic (cce) probe arrangement for detecting dechucking in a plasma processing chamber and methods thereof |
| 01/14/2010 | US20100008014 Method and apparatus for sucurely dechucking wafers |
| 01/14/2010 | US20100008013 Method and apparatus for safely dechucking wafers |
| 01/14/2010 | US20100007944 Optical semiconductor device and manufacturing method therefor |
| 01/14/2010 | US20100007872 Surface inspecting method and device |
| 01/14/2010 | US20100007840 Method for forming pad electrode, method for manufacturing liquid crystal display device using the same, and liquid crystal display device manufactured by the method |
| 01/14/2010 | US20100007825 Display Substrate, Method of Manufacturing the Display Substrate and Liquid Crystal Display Device Having the Display Substrate |
| 01/14/2010 | US20100007812 Active matrix substrate and repair method of pixel unit |
| 01/14/2010 | US20100007621 Touch screen panel and method of fabricating the same |
| 01/14/2010 | US20100007379 Programmable logic devices with function-specific blocks |
| 01/14/2010 | US20100007271 Organic light emitting diode display apparatus and method of manufacturing the same |
| 01/14/2010 | US20100007035 Semiconductor device and method of manufacturing the same |
| 01/14/2010 | US20100007034 Lens support and wirebond protector |
| 01/14/2010 | US20100007033 Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates |
| 01/14/2010 | US20100007032 Flip chip semiconductor device having workpiece adhesion promoter layer for improved underfill adhesion |
| 01/14/2010 | US20100007031 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device |
| 01/14/2010 | US20100007030 Semiconductor device, method for manufacturing semiconductor device, method for manufacturing semiconductor package |
| 01/14/2010 | US20100007029 Semiconductor device and method of forming stepped-down rdl and recessed thv in peripheral region of the device |
| 01/14/2010 | US20100007028 Device including an imide layer with non-contact openings and method |
| 01/14/2010 | US20100007026 Semiconductor device and method of manufacturing the same |
| 01/14/2010 | US20100007025 Organic silica film and method for forming same, composition for forming insulating film of semiconductor device and method for producing same, wiring structure and semiconductor device |
| 01/14/2010 | US20100007024 Semiconductor device and method of manufacturing the same |
| 01/14/2010 | US20100007023 Manufacture method for semiconductor device having improved copper diffusion preventive function of plugs and wirings made of copper or copper alloy |
| 01/14/2010 | US20100007022 Semiconductor device and manufacturing method thereof |
| 01/14/2010 | US20100007021 Methods of Fabricating Semiconductor Devices Including Porous Insulating Layers |
| 01/14/2010 | US20100007020 Semiconductor device and method of manufacturing the same |
| 01/14/2010 | US20100007019 Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection |
| 01/14/2010 | US20100007018 Process for coating a bumped semiconductor wafer |
| 01/14/2010 | US20100007017 Inter-connecting structure for semiconductor package and method for the same |
| 01/14/2010 | US20100007016 Device with contact elements |
| 01/14/2010 | US20100007015 Integrated circuit device with improved underfill coverage |
| 01/14/2010 | US20100007011 Semiconductor package and method for packaging a semiconductor package |
| 01/14/2010 | US20100007010 Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package |
| 01/14/2010 | US20100007009 Semiconductor package and method for processing and bonding a wire |
| 01/14/2010 | US20100007002 Multi-layer semiconductor package |
| 01/14/2010 | US20100007001 Semiconductor package structure and method for manufacturing the same |
| 01/14/2010 | US20100006999 Substrate bonding method and electronic component thereof |
| 01/14/2010 | US20100006998 Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package |
| 01/14/2010 | US20100006996 Carrier for bonding a semiconductor ship onto and a method of contracting a semiconductor chip to a carrier |