Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2010
01/20/2010EP2146250A1 Water-soluble resin composition for the formation of micropatterns and process for the formation of micropatterns with the same
01/20/2010EP2146249A1 Program and exposure method
01/20/2010EP2146247A1 Resist patterning process and manufacturing photo mask
01/20/2010EP2146244A1 Photomask substrate, photomask substrate forming member, photomask substrate manufacturing method, photomask, and exposure method using photomask
01/20/2010EP2146212A1 Method and apparatus for selectively compacting test responses
01/20/2010EP2145350A2 Print processing for patterned conductor, semiconductor and dielectric materials
01/20/2010EP2145348A1 Method for forming thermoelectric device from particulate raw materials
01/20/2010EP1606983B1 Structural unit and method for the production of a structural unit
01/20/2010EP1449256B1 A field effect transistor semiconductor device
01/20/2010EP1393381B1 Method for soi device with reduced junction capacitance
01/20/2010EP1324022B1 Apparatus for inspecting wafer surface and method for inspecting wafer surface
01/20/2010EP1309995B1 Method and apparatus for measuring parameters of an electronic device
01/20/2010EP1274877B1 A method and a device for determining the end point of a cleaning operation of a cvd apparatus
01/20/2010CN201387884Y Double crystal plate covered crystalloid
01/20/2010CN201387880Y Disc card installing device
01/20/2010CN201387879Y Non-water stain substrate cleaning and drying device
01/20/2010CN201387866Y Plasma treatment device
01/20/2010CN101632167A A semiconductor device comprising NMOS and PMOS transistors with embedded SI/GE material for creating tensile and compressive strain
01/20/2010CN101632166A Post-seed deposition process
01/20/2010CN101632165A Picker for transfer tool and transfer tool having the same
01/20/2010CN101632164A Device for positioning and/or pressing a planar component relative to a substrate and method for positioning a picking tool relative to a substrate
01/20/2010CN101632163A Hybrid composite wafer carrier for wet clean equipment
01/20/2010CN101632162A Apparatus and method for punching out electronic component
01/20/2010CN101632161A Bowed wafer hybridization compensation
01/20/2010CN101632160A Solder bump/under bump metallurgy structure for high temperature applications
01/20/2010CN101632159A Stressed field effect transistor and methods for its fabrication
01/20/2010CN101632158A Cleaning hardware kit for composite showerhead electrode assemblies for plasma processing apparatuses
01/20/2010CN101632157A Additive for abrasive composition
01/20/2010CN101632156A Printable semiconductor structures and related methods of making and assembling
01/20/2010CN101632155A Semiconductor device and method for manufacturing the same
01/20/2010CN101632154A Method for fabricating 1-3-6 2 compound thin film using single metal-organic chemical vapor deposition process
01/20/2010CN101632153A Method for silicon thin film formation
01/20/2010CN101632152A Thick nitride semiconductor structures with interlayer structures and methods of fabricating thick nitride semiconductor structures
01/20/2010CN101632151A Configuration of high-voltage semiconductor power device to achieve three dimensionalcharge coupling
01/20/2010CN101632150A Equipment and methods for etching of MEMS
01/20/2010CN101630662A Manufacturing method for protein structure quick switch memristor array
01/20/2010CN101630661A Semiconductor device and method of fabricating the same
01/20/2010CN101630660A Method for improving irradiation resistance of CMOS transistor, SMOS transistor and integrated circuit
01/20/2010CN101630659A Method for forming CMOS image sensor by using tri-gate process and structure of CMOS image sensor using tri-gate process
01/20/2010CN101630658A Method for interconnecting image sensors
01/20/2010CN101630657A Integrated circuit chip and manufacturing method for integrated circuit device
01/20/2010CN101630656A Methods for forming contact hole and dual damascene structure
01/20/2010CN101630655A Shallow trench isolation corner rounding
01/20/2010CN101630654A Method for determining height of insulating layer in shallow trench
01/20/2010CN101630653A Method of manufacturing microelectronic device and semiconductor device applying the method
01/20/2010CN101630652A Composite seat body with connected external vacuum source
01/20/2010CN101630651A Chip pick-up component
01/20/2010CN101630650A Transfer tool
01/20/2010CN101630649A Inspecting method and inspecting equipment
01/20/2010CN101630648A Method and apparatus for repairing wiring of circuit board
01/20/2010CN101630647A Welding method and welding structure of conductive terminals
01/20/2010CN101630646A Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates
01/20/2010CN101630645A Island type rewiring chip encapsulation method
01/20/2010CN101630644A Method for manufacturing large-scale integrated circuit lead frame
01/20/2010CN101630643A Method for molding LED lead frame and LED lead frame manufactured by using same
01/20/2010CN101630642A Method for manufacturing NMOS transistor
01/20/2010CN101630641A Iii-v compound semiconductor substrate, epitaxial wafer and manufacturing method thereof
01/20/2010CN101630640A Photoresist burr edge-forming method and TFT-LCD array substrate-manufacturing method
01/20/2010CN101630639A Semiconductor device manufacturing method
01/20/2010CN101630638A Thin-film device, method for manufacturing the same, and electronic apparatus
01/20/2010CN101630637A Method for preventing mark from deforming in epitaxy process
01/20/2010CN101630636A Clearing and drying device for thin semiconductor chip
01/20/2010CN101630635A Glass substrate etching device
01/20/2010CN101630634A System and method for substrate transport
01/20/2010CN101630633A Substrate proximity processing structures and methods for using and making the same
01/20/2010CN101630632A Coating and developing apparatus, coating and developing method, and storage medium
01/20/2010CN101630631A Information managing method, information managing apparatus and substrate processing system
01/20/2010CN101630630A Method for preventing lateral erosion in wet etching
01/20/2010CN101630629A Cmp by controlling polish temperature
01/20/2010CN101630086A Aligning device
01/20/2010CN100584153C Electronic device and method of manufacturing the same
01/20/2010CN100584152C Manufacturing method of electronic device
01/20/2010CN100583474C Injection apparatus, manufacturing apparatus, semiconductor light emitting apparatus and manufacturing method thereof
01/20/2010CN100583471C Light emitting device and method for manufacturing light emitting device
01/20/2010CN100583465C Method for preparing silicon solar battery texturing
01/20/2010CN100583464C Production method of high-speed deposition for high-quality intrinsic minicrystal silicon film
01/20/2010CN100583460C PIN diode and method for making PIN diode and forming semiconductor fin structure
01/20/2010CN100583458C Pixel structure, thin-film transistor and production method thereof
01/20/2010CN100583455C Semiconductor device having super junction structure and method of manufacturing the same
01/20/2010CN100583454C Fin FET device and its making method
01/20/2010CN100583453C Ldmos晶体管 Ldmos transistor
01/20/2010CN100583452C Method of fabricating a FET
01/20/2010CN100583451C Semiconductor device and method for fabricating the same
01/20/2010CN100583450C Semiconductor device and its making method
01/20/2010CN100583449C Semiconductor device and a method of manufacturing thereof
01/20/2010CN100583448C Field effect transistor, especially a double diffused field effect transistor, and method for the production thereof
01/20/2010CN100583447C Semiconductor device with a bipolar transistor and method of manufacturing such a device
01/20/2010CN100583446C Image sensor and fabricating method thereof
01/20/2010CN100583445C Substrate material and heterostructure
01/20/2010CN100583443C Thin-film transistor structure and preparation method thereof
01/20/2010CN100583440C Dual-gate dynamic random access memory device and method of fabricating the same
01/20/2010CN100583439C Method and device with durable contact on silicon carbide
01/20/2010CN100583438C Structure and method for device-specific fill for improved anneal uniformity
01/20/2010CN100583436C Semiconductor device and its making method
01/20/2010CN100583431C Manufacture method of stacking chip encapsulation structure
01/20/2010CN100583427C Metal interconnect structure for a microelectronic element
01/20/2010CN100583426C Semiconductor device and method for manufacturing same
01/20/2010CN100583425C Method for manufacturing through-hole and electronic device
01/20/2010CN100583423C Multilayered wiring substrate and method of manufacturing the same
01/20/2010CN100583422C Electronic part with electromagnetic interference shielding action and its encapsulation method