Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2010
01/19/2010US7648909 Method for fabricating semiconductor device with metal line
01/19/2010US7648908 Method for forming inlaid interconnect
01/19/2010US7648907 Semiconductor device, wiring substrate forming method, and substrate processing apparatus
01/19/2010US7648906 Method and apparatus for processing a conductive thin film
01/19/2010US7648905 Flash memory device and a method of manufacturing the same
01/19/2010US7648904 Metal line in semiconductor device and method for forming the same
01/19/2010US7648903 Modular bonding pad structure and method
01/19/2010US7648901 Manufacturing process and apparatus therefor utilizing reducing gas
01/19/2010US7648900 Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same
01/19/2010US7648899 Interfacial layers for electromigration resistance improvement in damascene interconnects
01/19/2010US7648898 Method to fabricate gate electrodes
01/19/2010US7648897 Method for manufacturing conductive layer and semiconductor device
01/19/2010US7648896 Deposited semiconductor structure to minimize n-type dopant diffusion and method of making
01/19/2010US7648895 Vertical CVD apparatus for forming silicon-germanium film
01/19/2010US7648894 Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor device comprising the same
01/19/2010US7648893 Method for manufacturing a semiconductor-on-insulator substrate for microelectronics and optoelectronics
01/19/2010US7648892 Methods and apparatus for depositing a microcrystalline silicon film for photovoltaic device
01/19/2010US7648891 Semiconductor chip shape alteration
01/19/2010US7648890 using aqueous acid solution which contains hydrogen fluoride, nitric acid, and phosphoric acid in single-wafer etching step; capable of performing a high level of flattening
01/19/2010US7648889 Production method for device
01/19/2010US7648888 Apparatus and method for splitting substrates
01/19/2010US7648887 Classification apparatus for semiconductor substrate, classification method of semiconductor substrate, and manufacturing method of semiconductor device
01/19/2010US7648886 Shallow trench isolation process
01/19/2010US7648885 Method for forming misalignment inspection mark and method for manufacturing semiconductor device
01/19/2010US7648884 Semiconductor device with integrated resistive element and method of making
01/19/2010US7648883 Phosphorous doping methods of manufacturing field effect transistors having multiple stacked channels
01/19/2010US7648882 SONOS flash memory and method for fabricating the same
01/19/2010US7648881 Non-volatile memory devices with charge storage insulators and methods of fabricating such devices
01/19/2010US7648880 Nitride-encapsulated FET (NNCFET)
01/19/2010US7648879 High-voltage vertical transistor with a multi-gradient drain doping profile
01/19/2010US7648878 Method for fabricating semiconductor device with recess gate
01/19/2010US7648877 Structure and method for forming laterally extending dielectric layer in a trench-gate FET
01/19/2010US7648876 Flash memory device
01/19/2010US7648875 Methods for forming DRAM devices including protective patterns and related devices
01/19/2010US7648874 Method of forming a dielectric structure having a high dielectric constant and method of manufacturing a semiconductor device having the dielectric structure
01/19/2010US7648873 Methods of forming capacitors
01/19/2010US7648872 Methods of forming DRAM arrays
01/19/2010US7648871 Field effect transistors (FETS) with inverted source/drain metallic contacts, and method of fabricating same
01/19/2010US7648870 Method of forming fuse region in semiconductor damascene process
01/19/2010US7648869 Method of fabricating semiconductor structures for latch-up suppression
01/19/2010US7648868 Metal-gated MOSFET devices having scaled gate stack thickness
01/19/2010US7648867 Method for fabricating a semiconductor device
01/19/2010US7648866 Method of manufacturing driving-device for unit pixel of organic light emitting display
01/19/2010US7648865 Method for manufacturing pixel structure
01/19/2010US7648864 Semiconductor structure including mixed rare earth oxide formed on silicon
01/19/2010US7648863 Semiconductor device and manufacturing method thereof
01/19/2010US7648862 Semiconductor device and method of manufacturing the same
01/19/2010US7648861 Method of fabricating a semiconductor device including separately forming a second semiconductor film containing an impurity element over the first semiconductor region
01/19/2010US7648860 Self-aligned thin-film transistor and method of forming same
01/19/2010US7648859 Microcomponent comprising a hermetically-sealed microcavity and method for production of such a microcomponent
01/19/2010US7648858 Methods and apparatus for EMI shielding in multi-chip modules
01/19/2010US7648857 Process for precision placement of integrated circuit overcoat material
01/19/2010US7648856 Methods for attaching microfeature dies to external devices
01/19/2010US7648855 Device comprising an encapsulated microsystem and production method thereof
01/19/2010US7648854 Methods of forming metal oxide layers, methods of forming gate structures using the same, and methods of forming capacitors using the same
01/19/2010US7648853 Dual channel heterostructure
01/19/2010US7648852 Low-voltage organic thin film transistor and fabrication method thereof
01/19/2010US7648851 Method of fabricating backside illuminated image sensor
01/19/2010US7648850 Method for producing semiconductor chip
01/19/2010US7648849 Nitride semiconductor light emitting diode having mesh DBR reflecting layer
01/19/2010US7648848 Semiconductor integrated circuit production method and device including preparing a plurality of SOI substrates, grouping SOI substrates having mutual similarities and adjusting their layer thicknesses simultaneously
01/19/2010US7648847 In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit
01/19/2010US7648846 Active matrix substrate and repairing method thereof
01/19/2010US7648820 Polycarbosilanes with chromogen and transparent moieties crosslinked by glycouril, alcohols, hydroxybenzyl, phenol, hydroxymethylbenzyl, cyclohexanoyl, propanol, fluorocarbon alcohols, vinyl ethers, and epoxides; semiconductors; lithography
01/19/2010US7648818 contecting polymeric resist layer to an onium derivatizing agent in which at least one light field or dark field is modified, preferential removal of dark-field or light field regions with CO2 solution, which may be used to form patterned regions on substrates such as microelectronic substrates
01/19/2010US7648807 preparing a plate-like substrate with a rectangular main surface, forming a marker for identifying the substrate on each of at least a plurality of end faces among four end faces of the substrate, the four end faces continuous with sides of the main surface, respectively; avoiding defective portion
01/19/2010US7648782 Ceramic coating member for semiconductor processing apparatus
01/19/2010US7648689 Process for the production of InP fine particles and InP fine particle dispersion obtained by the process
01/19/2010US7648621 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion
01/19/2010US7648611 Plasma etching equipment
01/19/2010US7648610 Baffle plate, apparatus for producing the same, method of producing the same, and gas processing apparatus containing baffle plate
01/19/2010US7648580 Substrate processing method and substrate processing device
01/19/2010US7648579 Substrate support system for reduced autodoping and backside deposition
01/19/2010US7648578 Substrate processing apparatus, and method for manufacturing semiconductor device
01/19/2010US7648577 MBE growth of p-type nitride semiconductor materials
01/19/2010US7648576 Epitaxial wafer and method for producing same
01/19/2010US7648410 Polishing pad and chemical mechanical polishing apparatus
01/19/2010US7648327 Wafer engine
01/19/2010US7648322 Automatic carton magazine loading system
01/19/2010US7647959 LCD bonding machine and method for fabricating LCD by using the same
01/19/2010US7647886 Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
01/19/2010US7647694 Method for mounting electronic component
01/19/2010CA2442127C Negative-resistance field-effect element
01/19/2010CA2380114C Imprint method and device
01/15/2010WO2009009380A2 Normally-off integrated jfet power switches in wide bandgap semiconductors and methods of making
01/15/2010CA2729299A1 Normally-off integrated jfet power switches in wide bandgap semiconductors and methods of making
01/14/2010WO2010006279A2 Chamber components for cvd applications
01/14/2010WO2010006181A2 Methods and apparatus for abating electronic device manufacturing process effluent
01/14/2010WO2010006156A2 Rapid thermal processing chamber with shower head
01/14/2010WO2010006148A2 Wire slicing system
01/14/2010WO2010006107A2 Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making
01/14/2010WO2010006080A2 Graphene and hexagonal boron nitride planes and associated methods
01/14/2010WO2010005934A2 Rf-biased capacitively-coupled electrostatic (rfb-cce) probe arrangement for characterizing a film in a plasma processing chamber
01/14/2010WO2010005933A2 Passive capacitively-coupled electrostatic (cce) probe arrangement for detecting plasma instabilities in a plasma processing chamber
01/14/2010WO2010005932A2 Plasma-facing probe arrangement including vacuum gap for use in a plasma processing chamber
01/14/2010WO2010005931A2 Capacitively-coupled electrostatic (cce) probe arrangement for detecting dechucking in a plasma processing chamber and methods thereof
01/14/2010WO2010005930A2 Capacitively-coupled electrostatic (cce) probe arrangement for detecting strike step in a plasma processing chamber and methods thereof
01/14/2010WO2010005878A1 Dielectric cap above floating gate
01/14/2010WO2010005866A1 Method of making a nonvolatile memory device
01/14/2010WO2010005831A2 Grayscale patterning of polymer thin films using direct-write multiphoton photolithography