Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/30/2014CN103956340A 采用后端cmos工艺三维光电集成的方法 Cmos process using three-dimensional back-end optoelectronic integrated approach
07/30/2014CN103956339A 一次性可编程器件的制造方法 One-time programmable device manufacturing method
07/30/2014CN103956338A 一种集成u形沟道器件和鳍形沟道器件的集成电路及其制备方法 An integrated device and the u-shaped channel of the fin-shaped channel devices integrated circuit and its preparation method
07/30/2014CN103956337A 一种半导体晶片的切割方法 A method of cutting a semiconductor wafer
07/30/2014CN103956336A 用于制造可转移半导体结构、器件和器件构件的松脱策略 For the manufacture of semiconductor structures can be transferred, devices and device components loose strategy
07/30/2014CN103956335A 一种阵列基板的制备方法 Method for preparing the array substrate
07/30/2014CN103956334A 集成电路中rdl和tsv金属层一次成型方法 IC rdl and tsv metal layer forming method
07/30/2014CN103956333A 基于中通孔制作方法的tsv、m1、ct金属层一次成型方法 Tsv through hole production methods, m1, ct metal layer forming method based on
07/30/2014CN103956332A 用于提升走线资源的集成电路结构及方法 Enhance alignment resources integrated circuit structure and method for
07/30/2014CN103956331A 一种用于多孔互连介质表面封孔的薄膜及其制备方法 Film and preparation method for surface sealing of porous media interconnects
07/30/2014CN103956330A 用于集成电路及类似物的侧堆叠互连 Integrated circuits and the like for the side of the stack of interconnect
07/30/2014CN103956329A 固晶机自动上料机构 Bonder automatic feeding mechanism
07/30/2014CN103956328A 一种引线框架废品标记工装 A lead frame scrap tooling marks
07/30/2014CN103956327A 一种激光拆键合工艺方法及系统 A laser bonding process demolition method and system
07/30/2014CN103956326A 无源集成转接板的制作方法及所对应的无源集成转接板 Production methods of passive integrated adapter plate and the corresponding passive integrated adapter plate
07/30/2014CN103956325A 一种多层复合氧化物高k介质薄膜晶体管的制备方法 Method for preparing high-k dielectric multilayer composite oxide thin film transistors
07/30/2014CN103956324A 一种具备沟道效应的瞬态电压抑制器芯片的生产工艺 With the production process of a transient voltage suppressor channeling chips
07/30/2014CN103956323A 半导体器件及其形成方法、非瞬时计算机可读存储介质 Semiconductor device and method for forming a non-transitory computer-readable storage medium
07/30/2014CN103956322A 介层窗层的介层窗图案化掩膜分配的方法 Method vias patterned mask assigned vias layer
07/30/2014CN103956321A 单晶硅蚀刻方法及所获得的半导体结构 Monocrystalline silicon etching method and a semiconductor structure obtained
07/30/2014CN103956320A 一种将电极图形转移在任意基底上并构建电子器件的方法 A method for transferring the electrode pattern on the substrate and any electronic device constructed
07/30/2014CN103956319A 一种采用激光辐照氮化镓外延片改善氮化镓电学光学性质的方法 One kind of GaN epitaxial wafers using laser irradiation to improve the optical properties of GaN electrical methods
07/30/2014CN103956318A 避免离子注入层后光阻导致的薄膜中毒的方法 Avoid ion implantation layer of photoresist film after lead poisoning methods
07/30/2014CN103956315A 一种电极间距可调的离子反应腔室及电极间距调整装置 An electrode spacing adjustable plasma reaction chamber and electrode spacing adjustment device
07/30/2014CN103955738A 双界面智能卡封装工艺及双界面智能卡 Dual interface smart card packaging technology and dual interface smart card
07/30/2014CN103955123A 一种离子注入后晶片的湿法去胶液及光刻胶去除方法 An ion-implanted wafer wet glue and to resist removal method
07/30/2014CN103955098A 液晶显示面板、其制作方法以及液晶显示装置 LCD panel, its production method, and a liquid crystal display device
07/30/2014CN103952683A 含有SiN<sub>x</sub>插入层的半极性m面GaN基的半导体器件的制备方法 Preparation containing SiN <sub> x </ sub> Semi-polar m-plane GaN-based intervening layer of a semiconductor device
07/30/2014CN103562435B 发光分析装置 Emission analyzer
07/30/2014CN103492517B 可光固化的切割芯片粘合带 The photocurable pressure-sensitive adhesive tape of the cutting chip
07/30/2014CN103262671B 适合于卷取大规模制造的电桥的制造方法 Suitable for large scale manufacturing method for manufacturing the winding of the bridge
07/30/2014CN102986012B 薄膜晶体管基板及其制造方法和液晶显示面板 A thin film transistor substrate and a method of manufacturing the liquid crystal display panel
07/30/2014CN102956554B 嵌入逻辑电路的分离栅极式快闪存储器及其制作方法 Separation of the embedded logic gate type flash memory and its production method
07/30/2014CN102956553B 嵌入逻辑电路的分离栅极式存储器及存储器组的制作方法 The method of manufacturing the embedded logic gate type memory and a separate memory groups
07/30/2014CN102832176B 一种量子效应光电探测器与读出集成电路的封装方法 A quantum effects photodetector and readout integrated circuit packaging method
07/30/2014CN102832173B 位线结构及其制造方法 Bit line structure and a manufacturing method
07/30/2014CN102800621B 形成栓塞结构、半导体器件的方法 Embolism structure method of forming a semiconductor device
07/30/2014CN102751232B 利用锗浓缩技术制备SiGe或Ge纳米线的方法 Preparation of germanium SiGe or Ge enrichment technology nanowires methods
07/30/2014CN102664157B 一种二极管酸处理后的震荡冲洗装置 Concussion latter diode acid treatment flushing device
07/30/2014CN102640278B 使电损耗减小的绝缘体上半导体型结构的制造方法及相应的结构 The electric loss is reduced in the method of manufacturing a semiconductor-on-insulator structure and the corresponding structures
07/30/2014CN102637623B Led芯片载体定位吸附装置 Led chip carrier positioning suction device
07/30/2014CN102637612B 固设半导体芯片于线路基板的方法及其结构 Fixing the semiconductor chip to the circuit substrate is provided a method and structure
07/30/2014CN102637585B 一种应用原子层沉积技术制备三氧化二铝钝化薄膜的方法 Preparation method of depositing an aluminum oxide passivation film atomic layer Application method
07/30/2014CN102610539B 利用集成pn结测量多芯片埋置型封装芯片接面温度的方法 Pn junction measurements using integrated multi-chip embedded chip type package junction temperature method
07/30/2014CN102597153B 粘接剂组合物、电路连接结构体和半导体装置，以及玻璃用粘接促进剂 The adhesive composition and the circuit member connection structure and a semiconductor device, and a glass adhesion promoter
07/30/2014CN102576710B 基于电荷陷阱的存储器 Based on the charge trap memory
07/30/2014CN102569302B 非易失性叠层式与非门存储器及其制备方法 A stacked-type nonvolatile memory with a NAND gate and its preparation method
07/30/2014CN102569202B 静态随机存储器的制造方法 The method of manufacturing a static random access memory
07/30/2014CN102569044B 二极管sf芯片的制造方法 Sf diode chip manufacturing method
07/30/2014CN102569040B 一种制作半导体器件结构的方法 A method of fabricating a semiconductor device structure
07/30/2014CN102555135B 树脂密封装置及树脂密封方法 Resin sealing resin sealing device and method
07/30/2014CN102543841B 半导体器件、形成栓塞的方法 A semiconductor device, method for forming plug
07/30/2014CN102484099B 用于不同半导体裸片和/或晶片的半导体晶片到晶片结合 The semiconductor wafer is used for different semiconductor die and / or wafer to wafer bonding
07/30/2014CN102482771B 用于气相沉积的含钛前体 For the vapor deposition of titanium-containing precursor
07/30/2014CN102482240B 化合物及其制造方法、含有该化合物的射线敏感性组合物以及固化膜 Compound and its manufacturing method, comprising the radiation sensitive composition and a cured film of the compound
07/30/2014CN102456653B 凸点下金属化层(ubm)结构及其形成方法 The under bump metallization layer (ubm) Structure and forming method
07/30/2014CN102446806B 相变存储器沟槽隔离结构的制作方法 The method of making a trench isolation structure in a memory phase transition
07/30/2014CN102445801B 液晶显示面板及其制造方法 The method of manufacturing a liquid crystal display panel and
07/30/2014CN102437185B 半导体器件的金属栅结构 Metal gate structure of a semiconductor device
07/30/2014CN102420223B 电路装置及其制造方法 Circuit device and manufacturing method thereof
07/30/2014CN102420203B 微电子封装中焊料凸点/金属化层连接结构体及其应用 Microelectronic package solder bump / metallization layer connection structure and its application
07/30/2014CN102418073B 溅射腔室、预清洗腔室以及等离子体加工设备 Sputtering chamber, pre-wash chamber and a plasma processing equipment
07/30/2014CN102412181B 浅沟槽隔离结构形成方法 The method for forming a shallow trench isolation structure
07/30/2014CN102386063B 基板冷却装置 Substrate cooling device
07/30/2014CN102379038B 电子器件安装构造及电子器件安装方法 The electronic component mounting structure and an electronic device mounting method
07/30/2014CN102376565B 半导体器件制造方法 The semiconductor device manufacturing method
07/30/2014CN102362346B 通孔结构及其方法 The through-hole structure and a method
07/30/2014CN102339765B 用于集成电路封装件的多步骤成型方法和装置 For a multi-step method of forming an integrated circuit package and means
07/30/2014CN102299046B 基板处理装置 The substrate processing apparatus
07/30/2014CN102290331B 基板清洗装置 Substrate cleaning apparatus
07/30/2014CN102244098B 半导体装置及其制造方法 Semiconductor device and manufacturing method
07/30/2014CN102239562B 制造隧穿晶体管的方法和包括隧穿晶体管的ic The method of manufacturing a transistor, and includes a tunneling tunneling transistor ic
07/30/2014CN102237310B 集成电路及其制造方法 And a method of manufacturing an integrated circuit
07/30/2014CN102214616B 金属导电结构及其制作方法 Metal conductive structure and production methods
07/30/2014CN102214601B 双镶嵌结构形成方法 The method for forming a dual damascene structure
07/30/2014CN102176456B 双端纳米管器件和系统及其制作方法 Double-ended nanotube devices and systems and production methods
07/30/2014CN102159356B 晶片接合装置和晶片接合方法 Device wafer bonding and wafer bonding method
07/30/2014CN102144295B 带隙移动的半导体表面和装置 And means for moving the surface of the semiconductor bandgap
07/30/2014CN102137959B 晶体制造装置、使用该晶体制造装置制造的半导体设备以及使用该晶体制造装置制造半导体设备的方法 Crystal manufacturing apparatus using the semiconductor device manufacturing apparatus for manufacturing a crystal of the crystal and the use of a method of manufacturing a semiconductor device manufacturing apparatus
07/30/2014CN102113087B 切割集成电路的系统和方法 Systems and methods for cutting IC
07/30/2014CN102074456B 减压干燥装置 Vacuum drying apparatus
07/30/2014CN102051597B 成膜装置和成膜方法 Film forming apparatus and film forming method
07/30/2014CN101971323B 集成电路长、短沟道金属栅极器件及其制造方法 IC long, short channel device and a manufacturing method of a metal gate
07/30/2014CN101959983B Cmp浆料及使用该浆料进行抛光的方法 Cmp slurry and methods of using the polishing slurry
07/30/2014CN101924044B 制造大功率半导体模块的方法和大功率半导体模块 Method of manufacturing high-power semiconductor module and power semiconductor module
07/30/2014CN101890579B 器件加工方法 Device fabrication method
07/30/2014CN101807551B 电子纸阵列基板制造方法和电子纸阵列基板 The electronic paper and a method of manufacturing an array substrate, an array substrate, an electronic paper
07/30/2014CN101802998B 静电夹具 Electrostatic chuck
07/30/2014CN101771068B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/30/2014CN101752221B 真空容器及制造方法、真空处理设备和电子器件制造方法 The method of manufacturing the vacuum vessel and the vacuum processing apparatus and a method for fabricating an electronic device
07/30/2014CN101621048B 复合半导体器件、印头以及图像形成装置 Compound semiconductor devices, print head and an image forming apparatus
07/30/2014CN101208805B 纳米尺度沟道晶体管的块接触结构 Block contact structure nanoscale channel transistors
07/30/2014CN101124672B 非易失性半导体存储装置 The nonvolatile semiconductor memory device
07/29/2014US8792755 Light transmission path package, light transmission module, electronic device and method for manufacturing light transmission module
07/29/2014US8792265 Phase change material for a phase change memory device and method for adjusting the resistivity of the material
07/29/2014US8792179 Laminated micromirror package
07/29/2014US8792085 Lithographic apparatus, substrate table, and method for enhancing substrate release properties
07/29/2014US8792034 Solid-state imaging device with charge transfer transistor on different substrates
07/29/2014US8792031 Solid-state image pickup device and camera
07/29/2014US8791723 Three-dimensional high voltage gate driver integrated circuit
1 ... 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 ... 6590