| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/24/2014 | US20140202636 Bonding Head With A Heatable And Coolable Suction Member |
| 07/24/2014 | US20140202635 Mounting table and plasma processing apparatus |
| 07/24/2014 | US20140202632 Hardmask surface treatment |
| 07/24/2014 | US20140202631 Method of affixing heat transfer sheet |
| 07/24/2014 | US20140202627 Chip sorting apparatus |
| 07/24/2014 | US20140202503 Method and system for uniformly applying a multi-phase cleaning solution to a substrate |
| 07/24/2014 | US20140202496 Substrate processing apparatus and substrate processing method |
| 07/24/2014 | US20140202387 Vertical diffusion furnace |
| 07/24/2014 | US20140202383 Wafer processing system using multi-zone chuck |
| 07/24/2014 | US20140202378 METHOD FOR PRODUCING AN ORGANISED NETWORK OF SEMICONDUCTOR NANOWIRES, IN PARTICULAR MADE OF ZnO |
| 07/24/2014 | US20140202027 Heating arrangement and method for heating substrates |
| 07/24/2014 | DE112012004495T5 Strukturierung mit hoher Wiedergabetreue unter Verwendung eines Fluorkohlenwasserstoff enthaltenden Polymers Patterning with high fidelity using a fluorocarbon-containing polymer |
| 07/24/2014 | DE112012004463T5 Schichtbildungsverfahren, vakuumverarbeitungsvorrichtung, herstellungsverfahren eines lichtemittierenden halbleiterelements, lichtemittierendes halbleiterelement und beleuchtungseinrichtung Layer formation process, vacuum processing apparatus, manufacturing process of a light emitting semiconductor elements, light-emitting semiconductor element and lighting device |
| 07/24/2014 | DE112012004047T5 Wafer für Solarzellen, Verfahren zur Herstellung eines Wafers für Solarzellen, Verfahren zur Herstellung einer Solarzelle, sowie Verfahren zur Herstellung eines Solarzellenmoduls Wafers for solar cells, methods for producing a wafer for solar cells, A method of producing a solar cell, and methods for producing a solar cell module |
| 07/24/2014 | DE112012004026T5 Halbleitervorrichtung Semiconductor device |
| 07/24/2014 | DE112012004024T5 Verfahren zum Übertragen von Materialschichten in 3D-Integrationsprozessen und damit zusammenhängende Strukturen und Vorrichtungen A method of transferring material layers in 3D integration processes and related structures and devices |
| 07/24/2014 | DE112011105831T5 Kondensatoren mit zurückgesetzter Bodenelektrode und Verfahren zur Herstellung derselben Capacitors with recessed bottom electrode and method of manufacturing the same |
| 07/24/2014 | DE112006002876B4 MOSFETs und Verfahren zum Herstellen eines MOSFETs MOSFET and method of manufacturing a MOSFET |
| 07/24/2014 | DE102014200840A1 Verfahren zur Herstellung einer Halbleiterstruktur mit einem vertikalen Nanodraht A process for producing a semiconductor structure with a vertical nanowire |
| 07/24/2014 | DE102014200839A1 Halbleitervorrichtungsstruktur und Verfahren zum Bilden einer integrierten CMOS-Schaltungsstruktur A semiconductor device structure and method of forming a CMOS integrated circuit structure |
| 07/24/2014 | DE102014100744A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same |
| 07/24/2014 | DE102014100512A1 Chip-gehäuse mit anschlusspads mit unterschiedlichen formfaktoren Chip housing, with pads with different form factors |
| 07/24/2014 | DE102014100509A1 Verfahren zur herstellung und testung eines chipgehäuses A process for the preparation and testing of a chip package |
| 07/24/2014 | DE102014100397A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 07/24/2014 | DE102013200990A1 Beleuchtungsanordnung mit optoelektronischem Bauelement Lighting arrangement with optoelectronic device |
| 07/24/2014 | DE102013114547A1 TO-Gehäuse sowie Verfahren zu dessen Herstellung TO package and process for its preparation |
| 07/24/2014 | DE102013105701A1 Verbindungshalbleiterbauteil, das Galliumnitrid-Gatestrukturen aufweist Compound semiconductor component, the gallium nitride gate structures |
| 07/24/2014 | DE102013105660B3 Bestückungsvorrichtung und Verfahren zum Aufbringen von elektrischen und/oder optoelektrischen Bauteilen auf Substrate Mounting apparatus and method for applying the electrical and / or opto-electrical components on substrates |
| 07/24/2014 | DE102013105449A1 Vertikale Tunnel-Feldeffekttransistorzelle und Herstellung derselben Vertical tunnel field-effect transistor cell and preparation thereof |
| 07/24/2014 | DE102013104523A1 Verfahren zur Herstellung einer FinFET-Vorrichtung einschließlich eines Fußbereichs eines Grat-Elements A method of manufacturing a FinFET device including a root portion of a ridge element |
| 07/24/2014 | DE102013103056A1 Herstellungsverfahren für eine Halbleitervorrichtung mit einer Deckschicht Manufacturing method of a semiconductor device with a covering layer |
| 07/24/2014 | DE102013100711A1 Verfahren zur Herstellung einer Vielzahl optoelektronischer Bauelemente und optoelektronisches Bauelement A process for the production of a variety of optoelectronic devices and optoelectronic component |
| 07/24/2014 | DE102013100563A1 Aufnahmeeinrichtung zur Handhabung strukturierter Substrate Receiving means for handling structured substrates |
| 07/24/2014 | DE102013100535A1 Object holding and orientation device for holding object e.g. substrate in vacuum chamber, has fixing mechanism that is arranged in spherical contact surfaces to releasably fix microscope slide and object positioning unit to each other |
| 07/24/2014 | DE102012214998B4 Verfahren zum beidseitigen Bearbeiten einer Halbleiterscheibe A method for double-sided machining a semiconductor wafer |
| 07/24/2014 | DE102011085799B4 Verfahren zum Schutz einer Substratbehandlungsanlage vor Überhitzung A method of protecting a substrate processing system from overheating |
| 07/24/2014 | DE102011053390B4 Verfahren zum Prozessieren eines Substrats A method for processing a substrate |
| 07/24/2014 | DE102011015263B4 Vorrichtung und Verfahren zum Behandeln von Substraten Apparatus and method for processing substrates |
| 07/24/2014 | DE102010030760B4 Halbleiterbauelement mit Durchgangskontaktierungen mit einem Verspannungsrelaxationsmechanismus und Verfahren zur Herstellung eines solchen A semiconductor device with vias with a Verspannungsrelaxationsmechanismus and methods for producing such |
| 07/24/2014 | DE102009024585B4 System zur Herstellung eines Halbleiteranordnungswafers, Halbleiteranordnung und Verfahren zum Geraderichten einer verzerrten Oberfläche System for manufacturing a semiconductor device wafer, semiconductor device and method for straightening a distorted surface |
| 07/23/2014 | EP2757588A1 Silicon carbide semiconductor device and method for manufacturing same |
| 07/23/2014 | EP2757581A1 Semiconductor device |
| 07/23/2014 | EP2757580A1 Bipolar cmos dmos (bcd) processes |
| 07/23/2014 | EP2757579A1 Method for characterisation of shallow junctions for use in semiconductor devices |
| 07/23/2014 | EP2757578A1 Polishing pad |
| 07/23/2014 | EP2757577A1 Polishing pad |
| 07/23/2014 | EP2757576A1 Dicing sheet substrate film and dicing sheet |
| 07/23/2014 | EP2757575A1 Dicing sheet substrate film and dicing sheet |
| 07/23/2014 | EP2757574A1 Method for manufacturing composite wafer |
| 07/23/2014 | EP2757412A1 Tft array substrate, fabrication method thereof, and liquid crystal display device |
| 07/23/2014 | EP2757136A1 Adhesive composition for bonding water and supporting body for said wafer, adhesive film, and laminate |
| 07/23/2014 | EP2757083A1 Magnesium aluminate-based sintered body and member for use in semiconductor manufacturing devices |
| 07/23/2014 | EP2756522A1 Low cte interposer |
| 07/23/2014 | EP2756521A2 Rna engineered t cells for the treatment of cancer |
| 07/23/2014 | EP2756353A1 Pattern-forming method, electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition, resist film, manufacturing method of electronic device using them and electronic device |
| 07/23/2014 | EP2755978A1 Compounds having semiconducting properties and related compositions and devices |
| 07/23/2014 | EP2755617A1 Biocompatible electrode component and method for fabrication thereof |
| 07/23/2014 | CN203733772U 半导体沟槽结构 Semiconductor trench structure |
| 07/23/2014 | CN203733771U 叠层电池片吸盘 Laminated cell wafer chuck |
| 07/23/2014 | CN203733770U 圆片级封装工艺用治具 Wafer-level packaging technology with fixtures |
| 07/23/2014 | CN203733769U 元件移载装置 Component transfer means |
| 07/23/2014 | CN203733768U 一种用于传输线上的翻转机构 An invert mechanism for a transmission line |
| 07/23/2014 | CN203733767U 一种湿法蚀刻装置 One kind of wet etching apparatus |
| 07/23/2014 | CN203733766U 一种半导体封装用绷片装置 A semiconductor package with a stretched piece of equipment |
| 07/23/2014 | CN203733765U 一种外延生长时gap值的测量装置 Value of a gap measuring device epitaxial growth |
| 07/23/2014 | CN203733764U 一种自动化电池片厚度测量机构 An automated cell thickness measuring mechanism |
| 07/23/2014 | CN203733763U 一种背凹超减薄晶圆的出片电性测试装置 One kind of ultra-thinned wafer concave back to film electrical test equipment |
| 07/23/2014 | CN203733762U 一种热压装置 A hot press apparatus |
| 07/23/2014 | CN203732136U 液位测量装置及湿法刻蚀装置 Level measuring apparatus and a wet etching apparatus |
| 07/23/2014 | CN203731821U 一种干燥设备 A method of drying equipment |
| 07/23/2014 | CN203724931U 隔离式搬运盒的滤膜组件 Isolated membrane components carrying case |
| 07/23/2014 | CN103947301A 等离子产生源及具备它的真空等离子处理装置 Plasma generation source and with its vacuum plasma processing apparatus |
| 07/23/2014 | CN103947287A 热阵列系统 Thermal Array System |
| 07/23/2014 | CN103946985A 半导体装置及半导体装置的制造方法 Semiconductor device and manufacturing method of a semiconductor device |
| 07/23/2014 | CN103946983A 半导体装置和半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device |
| 07/23/2014 | CN103946981A 具有提供偏移互连的接口的堆叠式存储器 Providing an offset interconnect having stacked memory interface |
| 07/23/2014 | CN103946980A 允许装置互连中的变化的堆栈式存储器 Allowing the device to change the interconnection of stacked memory |
| 07/23/2014 | CN103946979A 宏晶体管器件 Macro transistor devices |
| 07/23/2014 | CN103946974A 存储元件、存储装置 Storage element, the storage device |
| 07/23/2014 | CN103946973A 用于外延层剥离后晶片重新利用的牺牲性蚀刻保护层 Etching the sacrificial protective layer for the epitaxial layer of the delaminated wafer after the re-use |
| 07/23/2014 | CN103946972A 去除传导材料以在衬底中形成传导特征 Removing the conductive material to form a conductive substrate characterized in that |
| 07/23/2014 | CN103946971A 用于形成自对准触点和局部互连的方法 A method for forming self-aligned contacts and local interconnects |
| 07/23/2014 | CN103946970A 限制缺陷形成的制备异质结构的工艺 Process for preparing a heterostructure limits defect formation |
| 07/23/2014 | CN103946969A 绝缘体上半导体结构及其制造方法 Semiconductor on insulator structures and methods |
| 07/23/2014 | CN103946968A 搬运工件的偏转修正机构和搬运工件的偏转修正方法 Deflection correction method porter pieces deflection correction mechanism and porter pieces |
| 07/23/2014 | CN103946967A 用于裸工件储料器的容器存储附加装置 Container means for storing additional bare workpiece stocker |
| 07/23/2014 | CN103946966A 晶圆关联数据管理方法及晶圆关联数据生成装置 The data management method and the associated wafer data generating means associated with the wafer |
| 07/23/2014 | CN103946965A 封装上受控的管芯上焊料集成及其装配方法 Integration and controlled method for assembling the solder on the die to the package |
| 07/23/2014 | CN103946964A 掺杂碳纳米管和石墨烯用于改善电子迁移率 The doped carbon nanotubes and graphene for improving electron mobility |
| 07/23/2014 | CN103946963A 在用于cmos器件的含锗沟道上对氧化硅和高k栅极电介质的无氧化锗的原子层沉积 Channel for the germanium-containing silicon oxide cmos devices and high-k gate dielectrics without oxidizing the germanium atomic layer deposition |
| 07/23/2014 | CN103946962A 半导体装置及其制造方法、电子部件 Semiconductor device and manufacturing method of the electronic component |
| 07/23/2014 | CN103946961A 薄膜制造方法 Thin-film manufacturing method |
| 07/23/2014 | CN103946960A 蚀刻方法 Etching method |
| 07/23/2014 | CN103946959A 含有孔隙的基板及形成该基板的方法 The method of forming the pores of the substrate and the substrate containing |
| 07/23/2014 | CN103946958A 用于抛光铝半导体基材的组合物及方法 The composition and method for polishing a semiconductor substrate of aluminum |
| 07/23/2014 | CN103946957A 使用铝烷基的前驱物的金属薄膜沉积 A metal thin film of aluminum alkyl deposited precursor |
| 07/23/2014 | CN103946956A 包括辅助气体供应端口的基板处理装置 The substrate processing apparatus includes a secondary gas supply port |
| 07/23/2014 | CN103946955A 包括多个排气端口的基板处理装置及方法 Including the substrate processing apparatus and method of the plurality of exhaust ports |
| 07/23/2014 | CN103946954A 采用包含氟代烃的聚合物的高保真构图 Fidelity patterning using a polymer containing fluorinated hydrocarbons |
| 07/23/2014 | CN103946953A 碳化硅外延 SiC epitaxial |