| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/17/2014 | US20140199823 Method for manufacturing semiconductor device |
| 07/17/2014 | US20140199822 Methods of forming semiconductor device structures including an insulative material on a semiconductive material, and related semiconductor device structures and semiconductor devices |
| 07/17/2014 | US20140199820 Methods of forming a pattern and methods of manufacturing a semiconductor device using the same |
| 07/17/2014 | US20140199818 Method for fabricating an esd protection device |
| 07/17/2014 | US20140199814 Method of manufacture for a semiconductor device |
| 07/17/2014 | US20140199812 Bump structural designs to minimize package defects |
| 07/17/2014 | US20140199796 Semiconductor light emitting device and method of manufacturing the same |
| 07/17/2014 | US20140199791 Method and System for Universal Target Based Inspection and Metrology |
| 07/17/2014 | US20140199790 Resin coating device, and resin coating method |
| 07/17/2014 | US20140199789 Fabricating method of customized mask and fabricating method of semiconductor device using customized mask |
| 07/17/2014 | US20140199788 Floating substrate monitoring and control device, and method for the same |
| 07/17/2014 | US20140199787 Semiconductor Mask Blanks with a Compatible Stop Layer |
| 07/17/2014 | US20140199786 Rapid conductive cooling using a secondary process plane |
| 07/17/2014 | US20140199785 Multizone control of lamps in a conical lamphead using pyrometers |
| 07/17/2014 | US20140199784 Method and Apparatus for Making a Semiconductor Device |
| 07/17/2014 | US20140199140 Apparatus, method and non-transitory storage medium for accommodating and processing a substrate |
| 07/17/2014 | US20140199138 Semiconductor wafer handling transport |
| 07/17/2014 | US20140199056 Quartz upper and lower domes |
| 07/17/2014 | US20140198577 Semiconductor device |
| 07/17/2014 | US20140198459 Stacked package device and manufacturing method thereof |
| 07/17/2014 | US20140198013 Backside redistribution layer patch antenna |
| 07/17/2014 | US20140197610 Substrate gripping apparatus |
| 07/17/2014 | US20140197552 Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit |
| 07/17/2014 | US20140197551 Method for Fabricating a Semiconductor Chip Panel |
| 07/17/2014 | US20140197549 Semiconductor package and method of manufacturing the same |
| 07/17/2014 | US20140197548 Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof |
| 07/17/2014 | US20140197545 Non-cylindrical conducting shapes in multilayer laminated substrate cores |
| 07/17/2014 | US20140197537 Void-Free Metallic Filled High Aspect Ratio Openings |
| 07/17/2014 | US20140197536 Package structure and method for manufacturing thereof |
| 07/17/2014 | US20140197532 Semiconductor Module and Method for Manufacturing Semiconductor Module |
| 07/17/2014 | US20140197531 Compact device package |
| 07/17/2014 | US20140197530 Semiconductor device with chip having low-k-layers |
| 07/17/2014 | US20140197527 Chip arrangement and a method for manufacturing a chip arrangement |
| 07/17/2014 | US20140197526 Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods |
| 07/17/2014 | US20140197523 Chip arrangement and a method for forming a chip arrangement |
| 07/17/2014 | US20140197522 Hybrid conductor through-silicon-via for power distribution and signal transmission |
| 07/17/2014 | US20140197517 Trimming circuit for an integrated circuit and related integrated device |
| 07/17/2014 | US20140197516 Integration of 3d stacked ic device with peripheral circuits |
| 07/17/2014 | US20140197499 Self Aligned Contact Formation |
| 07/17/2014 | US20140197495 Semiconductor device and method of forming the same |
| 07/17/2014 | US20140197474 Semiconductor integrated circuit device and a method of manufacturing the same |
| 07/17/2014 | US20140197473 Nonvolatile semiconductor storage device and method of manufacturing the same |
| 07/17/2014 | US20140197470 Methods for forming etch stop layers, semiconductor devices having the same, and methods for fabricating semiconductor devices |
| 07/17/2014 | US20140197468 Methods of forming semiconductor device with self-aligned contact elements and the resulting device |
| 07/17/2014 | US20140197467 High voltage junction field effect transistor structure |
| 07/17/2014 | US20140197461 Semiconductor Structure Including A Spatially Confined Dielectric Region |
| 07/17/2014 | US20140197460 Semiconductor device, method for manufacturing the same, power supply device, and high-frequency amplifier |
| 07/17/2014 | US20140197448 Bidirectional Semiconductor Device for Protection against Electrostatic Discharges |
| 07/17/2014 | US20140197429 Method of arranging a multiplicity of leds in packaging units, and packaging unit comprising a multiplicity of leds |
| 07/17/2014 | US20140197418 Semiconductor structure having sets of iii-v compound layers and method of forming the same |
| 07/17/2014 | US20140197414 Array substrate and manufacturing method thereof |
| 07/17/2014 | US20140197409 Multi-chip package and interposer with signal line compression |
| 07/17/2014 | US20140197377 Cmos nanowire structure |
| 07/17/2014 | US20140197375 Semiconductor component comprising micro-bridges for adjusting a tensile strain state and method for the production thereof |
| 07/17/2014 | US20140197130 Method for manufacturing a plurality of nanowires |
| 07/17/2014 | US20140197129 Substrate processing method and substrate processing apparatus |
| 07/17/2014 | US20140197068 Wafer holding apparatus |
| 07/17/2014 | US20140196853 Method For Detaching A Semiconductor Chip From A Foil |
| 07/17/2014 | US20140196850 Method and system for wafer level singulation |
| 07/17/2014 | US20140196846 Method and device for bonding two wafers |
| 07/17/2014 | US20140196782 Method for making semiconductor device and semiconductor device made thereby |
| 07/17/2014 | US20140196781 Method of manufacturing thick-film electrode |
| 07/17/2014 | US20140196749 Cryogenic liquid cleaning apparatus and methods |
| 07/17/2014 | US20140196746 In situ chamber clean with inert hydrogen helium mixture during wafer process |
| 07/17/2014 | US20140196664 System and method for tungsten hexafluoride recovery and reuse |
| 07/17/2014 | US20140196280 Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method |
| 07/17/2014 | US20140196251 Semiconductor fabricating apparatus |
| 07/17/2014 | DE112012004475T5 Gasdispersionsvorrichtung Gas dispersion device |
| 07/17/2014 | DE112011105702T5 Source-/Drain-Kontakte für nicht planare Transistoren Source / drain contacts for non-planar transistors |
| 07/17/2014 | DE112011105207T5 Biomolekülinformationen-Analysevorrichtung Biomolekülinformationen analyzer |
| 07/17/2014 | DE112009000351B4 Mikroelektronischer Baustein, der Siliziumpatches für Zwischenverbindungen hoher Dichte enthält, und Verfahren zum Herstellen desselben Of the same microelectronic module containing silicon patches for intermediates high density and methods for preparing |
| 07/17/2014 | DE112007001029B4 Lötformteil, dessen Herstellung und Elektronikbauteil Lötformteil, its preparation and electronic part |
| 07/17/2014 | DE102014200518A1 Trennvorrichtung Separator |
| 07/17/2014 | DE102014200242A1 Gebondetes System mit beschichtetem Kupferleiter The bonded system with coated copper conductors |
| 07/17/2014 | DE102014100309A1 Chipanordnung und verfahren zum bilden einer chipanordnung Chip assembly and method for forming a chip arrangement |
| 07/17/2014 | DE102014100282A1 Chip-anordnung, verfahren zur herstellung einer chip-anordnung, integrierte schaltungen und verfahren zur herstellung einer integrierten schaltung Chip arrangement, method for producing a chip arrangement, integrated circuits and methods of fabricating an integrated circuit |
| 07/17/2014 | DE102014100278A1 Chipanordnung und verfahren zur herstellung einer chipanordnung Chip assembly and method for manufacturing a chip arrangement |
| 07/17/2014 | DE102014100249A1 Halbleiterbauelement mit igbt-zelle und entsättigungskanalstruktur A semiconductor device comprising IGBT cell and entsättigungskanalstruktur |
| 07/17/2014 | DE102014100236A1 Verfahren zum Herstellen eines Halbleiter-Chippanels A method of manufacturing a semiconductor chip Panels |
| 07/17/2014 | DE102013200526A1 Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls The power semiconductor module and method of producing a power semiconductor module |
| 07/17/2014 | DE102013200467A1 Klemmbare Aufkittleiste für einen Drahtsägeprozess For clamping Aufkittleiste for wire sawing |
| 07/17/2014 | DE102013200308A1 Bonddraht und Verfahren zur Herstellung einer Bondverbindung Bonding wire and method for producing a bond |
| 07/17/2014 | DE102013000882B3 Halbleiterbauelement mit Härtepuffer und dessen Verwendung Semiconductor component with hardness buffer and its use |
| 07/17/2014 | DE102012110916B4 Verfahren und Vorrichtung zum Transport flacher Substrate Method and device for transporting flat substrates |
| 07/17/2014 | DE102012107899B4 Waferanordnung mit Trägerwafer und Herstellungsverfahren dafür Wafer assembly with carrier wafer and manufacturing method thereof |
| 07/17/2014 | DE102011088010B4 Halbleiterbauelement mit einer Metallgatestruktur mit einer Polysiliziumlegierung und Verfahren zur Herstellung des Halbleiterbauelements A semiconductor device having a metal gate structure comprising a polysilicon alloy and method of manufacturing the semiconductor device |
| 07/17/2014 | DE102011080929B4 Verfahren zur Herstellung eines Verbundes und eines Leistungshalbleitermoduls A process for the production of a composite and a power semiconductor module |
| 07/17/2014 | DE102010000199B4 Einkapselungsverfahren Encapsulation |
| 07/17/2014 | DE102009035688B4 Halbleiterbauelement mit Trenchgatestruktur und Verfahren zur Herstellung desselben Of the same semiconductor device having a trench gate structure and methods for preparing |
| 07/17/2014 | DE102009022299B4 Verfahren und Vorrichtung zum Aufbringen eines elektronischen Bauelements auf ein Substrat Method and apparatus for applying an electronic component to a substrate |
| 07/17/2014 | DE102005006281B4 Hochfrequenzleistungsbauteil mit Goldbeschichtungen und Verfahren zur Herstellung desselben Of the same high-frequency power component with gold coatings and methods for preparing |
| 07/17/2014 | DE102004001350B4 Fördervorrichtung für ein plattenartiges Werkstück A conveyor for a plate-like workpiece |
| 07/16/2014 | EP2755454A1 Plasma generation device, cvd device and plasma treatment particle generation divice |
| 07/16/2014 | EP2755453A1 Plasma generator and cvd device |
| 07/16/2014 | EP2755240A1 Method for manufacturing solar cell |
| 07/16/2014 | EP2755239A1 Semiconductor device and display device |
| 07/16/2014 | EP2755237A2 Trench MOS gate semiconductor device and method of fabricating the same |
| 07/16/2014 | EP2755234A1 Composition for electronic device |
| 07/16/2014 | EP2755233A1 Underfill composition |
| 07/16/2014 | EP2755232A1 Sealant composition for electronic device |