Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/30/2014EP2758986A1 Method and system for optimization of an image on a substrate to be manufactured using optical lithography
07/30/2014CN203746889U Led晶片手动导边器 Led wafer edge guide manual
07/30/2014CN203746887U 一种多腔室制绒系统 A multi-chamber system Texturing
07/30/2014CN203746831U 一种柔性显示器 A flexible display
07/30/2014CN203746819U 一种cmos硅片裂片的处理装置 Cmos wafer processing apparatus lobes
07/30/2014CN203746818U 晶圆劈裂机 Wafer splitting machine
07/30/2014CN203746817U 一种用于硅片印刷烘烤的托盘架 A wafer printing baking tray rack
07/30/2014CN203746816U 一种安全高效的晶片夹具 A safe and efficient wafer chuck
07/30/2014CN203746815U 用于处理基板的腔室 A chamber for processing a substrate
07/30/2014CN203746814U 一种晶体摆放装置 A crystal display device
07/30/2014CN203746813U 一种新型硅片测试机的乘片台盘 A new wafer tester units multiplied sheet tray
07/30/2014CN203746812U 固晶机及其真空吸取支架 Bonder and vacuum pick holder
07/30/2014CN203746811U 一种吸附装置 An adsorption apparatus
07/30/2014CN203746810U 一种用于将硅片花篮转向的旋转机构 A rotation mechanism for steering the wafer basket
07/30/2014CN203746809U 一种晶圆盒 One kind of pod
07/30/2014CN203746808U 用于清洗晶圆的盘式载具 Disc carrier for cleaning wafers
07/30/2014CN203746807U 一种吸附装置及干法刻蚀设备 A dry etching apparatus, and the adsorption device
07/30/2014CN203746806U Led晶片手动寻边器 Led manual wafer edge finder
07/30/2014CN203746805U 漏晶检测装置 Crystal leak detection device
07/30/2014CN203746804U 二极管组残胶清除装置 Diode groups adhesive residue removal device
07/30/2014CN203746803U 刻蚀机运行检测保护机构 Etcher run the test Protection Agency
07/30/2014CN203746802U 一种智能卡芯片封装装置 An intelligent card chip packaging means
07/30/2014CN203746801U 处理平坦基板的装置 Means for processing flat substrate
07/30/2014CN203746800U 一种石英晶振智能贴合机 One kind of quartz crystals intelligent laminating machine
07/30/2014CN203746799U 半导体工艺气路显示装置 Semiconductor process gas line display device
07/30/2014CN203741459U 一种腐蚀晶片用承载装置 One corrosion wafers carrying device
07/30/2014CN203740667U Led分光机和装带机供料结构 Led by machine and loading machine feeding structure
07/30/2014CN203738818U 一种用于机械手臂的防污染系统 A mechanical arm antipollution system
07/30/2014CN203737648U 一种衬底单面漂洗装置 A substrate single rinsing device
07/30/2014CN103959920A 天线结构和等离子体生成装置 The antenna structure and a plasma generating means
07/30/2014CN103959897A 控制热阵列的系统和方法 Thermal control system and method of the array
07/30/2014CN103959579A 用于制造半导体激光器器件的方法及半导体激光器器件 The method of manufacturing a semiconductor laser device and the semiconductor laser device is used
07/30/2014CN103959488A 系统、制造条件决定装置以及制造管理装置 Systems, manufacturing apparatus and manufacturing management condition determination means
07/30/2014CN103959476A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/30/2014CN103959475A 半导体装置 Semiconductor device
07/30/2014CN103959474A 单片集成的垂直jfet和肖特基二极管 Monolithically integrated Schottky diode and vertical jfet
07/30/2014CN103959473A 半导体器件 Semiconductor devices
07/30/2014CN103959472A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/30/2014CN103959471A 用于制造碳化硅半导体器件的方法 The method for manufacturing a silicon carbide semiconductor device
07/30/2014CN103959464A 具有横向电极的量子阱装置 A quantum well having a lateral electrode device
07/30/2014CN103959459A 忆阻器及制造方法 Memristor and method of manufacture
07/30/2014CN103959458A 用于将电压浮置或者将电压施加置集成电路的阱的方法和设备 A method and apparatus for applying a voltage to the well voltage of the floating or set of integrated circuits
07/30/2014CN103959457A 去耦电路和半导体集成电路 Decoupling circuit and a semiconductor integrated circuit
07/30/2014CN103959456A 具有改进的电特性的绝缘体上半导体结构 The insulator having improved electrical characteristics of the semiconductor structure
07/30/2014CN103959455A 部件操纵组件 Member steering assembly
07/30/2014CN103959454A 基板保持装置 Substrate holding means
07/30/2014CN103959453A 基板输送装置及基板装配线 Substrate transport apparatus and substrate assembly line
07/30/2014CN103959452A 激光划线系统、设备和方法 Laser scribing system, apparatus and method
07/30/2014CN103959451A 半导体装置制造方法以及半导体装置 The semiconductor device manufacturing method and semiconductor device
07/30/2014CN103959450A 半导体封装件及其制造方法 The semiconductor package and method for manufacturing
07/30/2014CN103959449A 用于接触半导体的方法和用于半导体的接触组件 The method of contacting the semiconductor and a contact assembly for a semiconductor
07/30/2014CN103959448A 金属配线形成用的转印基板及基于所述转印用基板的金属配线的形成方法 The method of forming a metal wiring formed on the substrate and the transfer substrate for transferring a metal wiring
07/30/2014CN103959447A 等离子体处理装置和等离子体处理方法 The plasma processing apparatus and plasma processing method
07/30/2014CN103959446A 用于使用改良的摩擦测量来进行基板抛光检测的系统和方法 For the measurement of friction using a modified system and method for detecting substrate polishing
07/30/2014CN103959445A 用于电化学处理器的接触环 Contact for electrochemical processor ring
07/30/2014CN103959444A 粘合片及使用粘合片的电子元件的制造方法 The method of manufacturing an electronic device using the adhesive sheet and the adhesive sheet
07/30/2014CN103959443A 用于铜阻挡层应用的掺杂的氮化钽 Tantalum nitride barrier layer for copper doped application
07/30/2014CN103959442A 用于基板处理的激光反射仪 Laser reflectometer for substrate processing
07/30/2014CN103959441A 生长用于红外光检测器的异质结构的方法 Growth of heterostructures of infrared photodetector for a method
07/30/2014CN103959440A 包括隔热板的基板处理装置 The substrate processing apparatus includes a thermal shield
07/30/2014CN103959439A 半导体衬底以及形成方法 The method for forming a semiconductor substrate, and
07/30/2014CN103959438A 供应具有相位差的反应性气体的基板处理装置 The substrate processing apparatus having a supply of the reactive gas phase
07/30/2014CN103959437A 具有特定结晶特征的iii-v族衬底材料及其制备方法 Iii-v aromatic substrate material and its preparation method has the particular characteristic of crystalline
07/30/2014CN103959436A Ib及via族基多元半导体 Ib and via diverse ethnic groups semiconductors
07/30/2014CN103959435A Uv固化的优化 Uv curable optimization
07/30/2014CN103959434A 通过使用聚合物掩模的选择性沉积 By selectively deposited using a polymer mask
07/30/2014CN103958733A 用于多通道流量比率控制器系统的方法和装置 Method and apparatus for multi-channel flow ratio controller system
07/30/2014CN103958640A 无胺cmp后组合物及其使用方法 No amine cmp and methods of use thereof in combination after
07/30/2014CN103958602A 树脂组合物、树脂组合物片材、半导体器件及其制备方法 The resin composition, the resin composition sheet, a semiconductor device and a method for preparing
07/30/2014CN103958520A 具有半导体特性的化合物及相关组合物和装置 Compounds and related compositions and devices having semiconductor characteristics
07/30/2014CN103958455A 环状化合物、其制造方法、辐射敏感组合物及抗蚀图案形成方法 Cyclic compounds, manufacturing method, the radiation-sensitive composition and resist pattern-forming method
07/30/2014CN103958445A 用于放射性药物合成器的校准和归一化系统和方法 For radiopharmaceuticals synthesizer calibration and normalization system and method
07/30/2014CN103958393A Mems传感器封装及其方法 Mems sensor package and method
07/30/2014CN103958125A 抛光垫 Polishing pad
07/30/2014CN103958123A 研磨用组合物 The polishing composition
07/30/2014CN103958120A 锡基焊球和包含它的半导体封装 Tin-based solder balls and included its semiconductor package
07/30/2014CN103956390A 一种沟槽式肖特基芯片及其制造方法 One kind of trench Schottky chip and its manufacturing method
07/30/2014CN103956389A 一种阶梯式沟槽mos肖特基二极管器件 One kind of stepped trench Schottky diode device mos
07/30/2014CN103956388A 肖特基二极管半导体器件及其制备方法 Schottky diode semiconductor device and its preparation method
07/30/2014CN103956386A 薄膜晶体管及制备方法、阵列基板及制备方法和显示装置 Thin film transistor and method of preparation, array substrate preparation method and display device
07/30/2014CN103956385A 一种jfet器件及其制造方法 One kind jfet device and manufacturing method thereof
07/30/2014CN103956384A 一种高压pmos晶体管及其制备方法 A high voltage pmos transistor and its preparation method
07/30/2014CN103956382A 一种沟槽功率器件结构及其制造方法 One kind of a trench power device structure and manufacturing method
07/30/2014CN103956380A 一种igbt芯片及其制造方法 One kind igbt chip and its manufacturing method
07/30/2014CN103956378A 形成镍硅化物的方法、半导体器件及其形成方法 The method of forming a nickel silicide, a semiconductor device and method of forming
07/30/2014CN103956373A 一种疏水有机薄膜封装的有机发光显示装置及其制造方法 A hydrophobic organic thin film encapsulation of organic light emitting display device and manufacturing method thereof
07/30/2014CN103956365A 阵列基板及其制备方法、显示装置 Array substrate and its preparation method, the display device
07/30/2014CN103956363A 复合基板及其制造方法、柔性显示装置及其制造方法 Composite substrate and its manufacturing method, the flexible display device and manufacturing method
07/30/2014CN103956362A 基于图形化高能离子注入的低衬底损耗硅基集成电路及其制作方法 Low substrate-based graphical high energy ion implantation of silicon-based integrated circuit and method of making loss
07/30/2014CN103956354A 以石墨烯为金属化层和扩散势垒层的互连线及其制备方法 Graphene metallization layer and a diffusion barrier layer of interconnecting lines and preparation method
07/30/2014CN103956353A 半导体器件及其形成方法 Semiconductor device and method for forming
07/30/2014CN103956352A 功率半导体芯片的铜金属化结构及其制作方法 Copper metallization structure and method of making power semiconductor chips
07/30/2014CN103956351A 边长渐变多边形平面螺旋电感及其生成方法 Gradient polygon side spiral inductor and Generation
07/30/2014CN103956350A 包括将半导体芯片键合至铜表面的烧结接合部的模块 Comprising a semiconductor chip bonded to the copper surface of a sintered joint module
07/30/2014CN103956349A 功率半导体芯片的铜金属化结构及其制作方法 Copper metallization structure and method of making power semiconductor chips
07/30/2014CN103956346A 一种制作3d封装芯片的散热方法 A cooling method 3d packaged chip production
07/30/2014CN103956345A 集成电路芯片、嵌入式设备及集成电路加工方法 Integrated circuit chips, embedded devices and integrated circuits processing method
07/30/2014CN103956344A 一种适合平行封焊工艺的陶瓷管帽及其制造方法 A parallel closure welding process and method of manufacturing the ceramic cap fit
07/30/2014CN103956343A 一种芯片封装结构及其制作工艺 A chip package structure and manufacturing process
07/30/2014CN103956342A 内含固体金属导热填充物的高导热陶瓷基板及其制备工艺 Containing high thermal conductivity of the ceramic substrate and preparation process of the solid metal thermal filler
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