Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/23/2014CN102629585B 一种显示装置、薄膜晶体管、阵列基板及其制造方法 An apparatus, a thin film transistor array substrate and manufacturing method thereof
07/23/2014CN102629560B 封装载板及其制作方法 Package carrier board and its manufacturing method
07/23/2014CN102629553B 离子注入方法 An ion implantation method
07/23/2014CN102610576B 多层单晶三维堆栈式存储器及其制造方法 Three layers of single crystal and method of manufacturing a stack-type memory
07/23/2014CN102610543B 用于内部稀薄气流模拟验证及压力检测的变结构真空腔室 For internal verification and simulation of rarefied gas flow pressure sensing variable structure of the vacuum chamber
07/23/2014CN102569091B 一种后栅极单晶体管动态随机存储器的制备方法 After preparation of a single transistor gate dynamic random access memory
07/23/2014CN102543683B 光刻工艺的返工方法 Rework method lithography process
07/23/2014CN102487041B 阵列基板及其制造方法和电子纸显示器 Array substrate and manufacturing method and electronic paper displays
07/23/2014CN102484093B 使用三重植入通过裂开分离硅薄膜的方法 By using the method of cleaving triple implanted silicon thin film separation
07/23/2014CN102479684B 薄膜电阻器及其制造方法 Thin film resistor and its manufacturing method
07/23/2014CN102473737B 发光显示装置及其制造方法 Light emitting display device and its manufacturing method
07/23/2014CN102465342B 制造GaN基膜的方法 Method of manufacturing a GaN-based film
07/23/2014CN102449741B 覆膜表面处理方法 Film surface treatment method
07/23/2014CN102446856B 半导体器件及制造半导体器件的方法 Semiconductor device and manufacturing method of a semiconductor device
07/23/2014CN102446821B 减少化学机械研磨后铜互连结构材料损伤的方法 Methods copper interconnect structure material damage reduction after chemical mechanical polishing
07/23/2014CN102437067B 线宽测量方法 Linewidth measurement method
07/23/2014CN102427018B 去离子棒 Deionized stick
07/23/2014CN102399504B 压敏粘合带 The pressure-sensitive adhesive tape
07/23/2014CN102386124B 直接接触的沟槽结构 Direct contact with the trench structure
07/23/2014CN102347349B 半导体结构及其制作方法 Semiconductor structure and fabrication method
07/23/2014CN102301043B 外延碳化硅单晶基板及其制造方法 An epitaxial silicon carbide single crystal substrate and a method of manufacturing
07/23/2014CN102299068B 基板处理方法 The substrate processing method
07/23/2014CN102272892B 具有升温气体注入的化学气相沉积 Is warming gas injection chemical vapor deposition
07/23/2014CN102270577B 等离子体处理装置和方法 The plasma processing apparatus and method
07/23/2014CN102246279B 控制研磨速率的载具头膜粗糙度 Control of the polishing rate of carrier head film roughness
07/23/2014CN102197460B 化合物半导体制造装置、化合物半导体制造方法以及化合物半导体制造用型架 A compound semiconductor manufacturing apparatus, a method of manufacturing a compound semiconductor and the compound semiconductor manufacturing shaped frame
07/23/2014CN102194705B 具有保护性中介层的嵌入式裸片 Embedded die having an intermediary protective layer
07/23/2014CN102184920B 电压转换器及包括电压转换器的系统 Voltage converter, and a system including a voltage converter
07/23/2014CN102163664B 处理碳化硅衬底改善外延沉积的方法与形成的结构和器件 Improved method for processing a silicon carbide substrate with an epitaxial deposition device forming the structure and
07/23/2014CN102156365B 液晶显示设备及其制造和修复方法 LCD device and its manufacturing and repair methods
07/23/2014CN102023427B Tft-lcd阵列基板及其制造和驱动方法 Tft-lcd array substrate and manufacturing and driving method
07/23/2014CN102005470B 半导体元件用外延基板、半导体元件及半导体元件用外延基板的制作方法 The epitaxial substrate for semiconductor device, a semiconductor element and a method of manufacturing a semiconductor device using the epitaxial substrate,
07/23/2014CN101995711B Tft-lcd阵列基板及其制造方法 Tft-lcd array substrate and a method of manufacturing
07/23/2014CN101970540B 倍半硅氧烷树脂 Silsesquioxane resin
07/23/2014CN101930935B 用于改善可靠性的引线框设计 For improving the reliability of the design of a lead frame
07/23/2014CN101859729B 晶片的加工方法 Wafer processing method
07/23/2014CN101846877B 掩模板制造方法、掩模制造方法、掩模板透明基片制造方法 Mask manufacturing method, a method of manufacturing a mask, the transparent mask substrate manufacturing method
07/23/2014CN101740316B 准分子灯装置 Excimer lamp device
07/23/2014CN101625972B 使半导体晶片变薄的方法 Method of the semiconductor wafer thinning
07/23/2014CN101469416B 用于处理衬底的设备 Apparatus for processing a substrate
07/23/2014CN101135849B 抗蚀覆盖膜形成材料、抗蚀图案形成方法、电子器件及其制造方法 The resist cover film-forming material, the resist pattern forming method and a manufacturing method of an electronic device
07/23/2014CN101023560B 使用接合导线作为辐射元件构造天线的装置和方法 Using a bonding wire as the radiating element structure of the antenna apparatus and method
07/22/2014US8788981 Method of OPC model building, information-processing apparatus, and method of determining process conditions of semiconductor device
07/22/2014US8788242 Pattern measurement apparatus
07/22/2014US8787741 Heat treatment method and heat treatment apparatus for heating substrate by light irradiation
07/22/2014US8787084 Semiconductor device and driving method thereof
07/22/2014US8787074 Static random access memory test structure
07/22/2014US8786832 Shear-layer chuck for lithographic apparatus
07/22/2014US8786793 Display device and manufacturing method thereof
07/22/2014US8786174 Organic light emitting display device and method of manufacturing the same
07/22/2014US8786112 Leadframe, semiconductor device, and method of manufacturing the same
07/22/2014US8786109 Conductive structure and method for forming the same
07/22/2014US8786105 Semiconductor device with chip having low-k-layers
07/22/2014US8786102 Semiconductor device and method of manufacturing the same
07/22/2014US8786097 Method of forming vias in semiconductor substrates and resulting structures
07/22/2014US8786094 Semiconductor devices and methods of manufacture thereof
07/22/2014US8786093 Chip package and method for forming the same
07/22/2014US8786091 Semiconductor apparatus having a high-aspect penetrating electrode and manufacturing method thereof
07/22/2014US8786088 Semiconductor device including ultra low-K (ULK) metallization stacks with reduced chip-package interaction
07/22/2014US8786087 Semiconductor device having damascene interconnection structure that prevents void formation between interconnections having transparent dielectric substrate
07/22/2014US8786086 Semiconductor device including wiring having main portion and extended portion
07/22/2014US8786084 Semiconductor package and method of forming
07/22/2014US8786081 Method and device for circuit routing by way of under-bump metallization
07/22/2014US8786064 Semiconductor package and method for manufacturing the same and semiconductor package module having the same
07/22/2014US8786062 Semiconductor package and process for fabricating same
07/22/2014US8786060 Semiconductor package integrated with conformal shield and antenna
07/22/2014US8786051 Transistor having a monocrystalline center section and a polycrystalline outer section, and narrow in-substrate collector region for reduced base-collector junction capacitance
07/22/2014US8786050 High voltage resistor with biased-well
07/22/2014US8786049 Solid-state thin-film capacitor
07/22/2014US8786047 Semiconductor device with isolation layer, electronic device having the same, and method for fabricating the same
07/22/2014US8786045 Power semiconductor devices having termination structures
07/22/2014US8786038 Semiconductor storage device and method of manufacturing the same
07/22/2014US8786031 Metal nitride film, semiconductor device using the metal nitride film, and manufacturing method of semiconductor device
07/22/2014US8786030 Gate-last fabrication of quarter-gap MGHK FET
07/22/2014US8786029 Semiconductor device and manufacturing method thereof
07/22/2014US8786026 Optimized channel implant for a semiconductor device and method of forming the same
07/22/2014US8786025 Semiconductor device and method for forming same
07/22/2014US8786024 Semiconductor device comprising bipolar and unipolar transistors including a concave and convex portion
07/22/2014US8786023 Embedded non-volatile memory
07/22/2014US8786020 Method of fabricating a semiconductor device including a gate having a plurality of fingers extended over a plurality of isolation regions
07/22/2014US8786018 Self-aligned carbon nanostructure field effect transistors using selective dielectric deposition
07/22/2014US8786015 Super-junction semiconductor device
07/22/2014US8786011 Semiconductor device
07/22/2014US8786008 Nonvolatile semiconductor memory device and method for manufacturing the same
07/22/2014US8786006 Flash memory device having a graded composition, high dielectric constant gate insulator
07/22/2014US8786003 Nonvolatile semiconductor memory device and method for manufacturing same
07/22/2014US8786001 Semiconductor devices
07/22/2014US8785995 Ferroelectric semiconductor transistor devices having gate modulated conductive layer
07/22/2014US8785993 Solid-state imaging element, manufacturing method, and electronic device
07/22/2014US8785990 Semiconductor device including first and second or drain electrodes and manufacturing method thereof
07/22/2014US8785989 Semiconductor constructions
07/22/2014US8785981 Non-replacement gate nanomesh field effect transistor with pad regions
07/22/2014US8785973 Ultra high voltage GaN ESD protection device
07/22/2014US8785967 Local crystallization by heat treatment
07/22/2014US8785956 Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same
07/22/2014US8785949 Light emitting apparatus and method for manufacturing the same
07/22/2014US8785941 Thin-film semiconductor device, display apparatus, and method for manufacturing thin-film semiconductor device
07/22/2014US8785930 Method for indexing dies comprising integrated circuits
07/22/2014US8785922 Thin film transistor, organic luminescence display including the same, and method of manufacturing the organic luminescence display
07/22/2014US8785914 Piezoelectric nanowire structure and electronic device including the same