Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/24/2014US20140206180 Thin film formation method
07/24/2014US20140206179 Method and system for junction termination in gan materials using conductivity modulation
07/24/2014US20140206178 Method of Laser Separation of the Epitaxial Film or of the Epitaxial Film Layer from the Growth Substrate of the Epitaxial Semiconductor Structure (Variations)
07/24/2014US20140206177 Wafer processing method
07/24/2014US20140206176 Method for low temperature bonding and bonded structure
07/24/2014US20140206175 Methods of forming semiconductor structures including bodies of semiconductor material
07/24/2014US20140206174 Method of making semiconductor device
07/24/2014US20140206173 Method for processing semiconductors using a combination of electron beam and optical lithography
07/24/2014US20140206167 Contact structure of semiconductor device
07/24/2014US20140206166 Finfet device and method of manufacturing same
07/24/2014US20140206161 Method of fabricating a semiconductor device having a capping layer
07/24/2014US20140206160 Method of Forming A Gated Diode Structure for Eliminating RIE Damage From Cap Removal
07/24/2014US20140206156 Finfet device and method of manufacturing same
07/24/2014US20140206154 Semiconductor device comprising a passive component of capacitors and process for fabrication
07/24/2014US20140206153 Method for fabricating solder columns for a column grid array package
07/24/2014US20140206152 Single layer bga substrate process
07/24/2014US20140206150 Apparatus and method for manufacturing an integrated circuit
07/24/2014US20140206148 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
07/24/2014US20140206147 Stacked microelectronic assembly with tsvs formed in stages and carrier above chip
07/24/2014US20140206146 Fabrication method of semiconductor package having electrical connecting structures
07/24/2014US20140206137 Deposition system for thin film formation
07/24/2014US20140206136 Antimony compounds useful for deposition of antimony-containing materials
07/24/2014US20140206126 Methods of growing heteroepitaxial single crystal or large grained semiconductor films on glass substrates and devices thereon
07/24/2014US20140206125 Method for producing a solar cell
07/24/2014US20140206122 Open Cavity Plastic Package
07/24/2014US20140206114 Contact resistance test structure and method suitable for three-dimensional integrated circuits
07/24/2014US20140206113 Semiconductor Test Structures
07/24/2014US20140206112 Method for reducing charge in critical dimension-scanning electron microscope metrology
07/24/2014US20140206111 Semiconductor device manufacturing method
07/24/2014US20140206110 Etchant and Etching Process
07/24/2014US20140206109 Method of Manufacturing and Testing a Chip Package
07/24/2014US20140206108 Heat treatment apparatus and heat treatment method for heating substrate by irradiating substrate with flash of light
07/24/2014US20140206096 Stable indium-containing semiconductor nanocrystals
07/24/2014US20140205951 Thermal crosslinking accelerator, polysiloxane-containing resist underlayer film forming composition containing same, and patterning process using same
07/24/2014US20140205835 Base film for dicing sheet and dicing sheet
07/24/2014US20140205818 Methods of making patterned structures of materials, patterned structures of materials, and methods of using same
07/24/2014US20140205816 Dicing-tape-integrated adhesive sheet, semiconductor device, multilayered circuit board and electronic component
07/24/2014US20140205702 Template, manufacturing method of the template, and position measuring method in the template
07/24/2014US20140204975 Plate-shaped body for temperature measurement and temperature measuring apparatus provided with the same
07/24/2014US20140204967 Thermal Shunt
07/24/2014US20140204501 Electrostatic chucking device
07/24/2014US20140204359 Exposure method, exposure apparatus, exposure system and device manufacturing method
07/24/2014US20140204305 Tft structure, lcd device, and method for manufacturing tft
07/24/2014US20140203827 Integrated circuits and methods of forming the same with embedded interconnect connection to through-semiconductor via
07/24/2014US20140203458 Dicing tape-integrated film for semiconductor back surface
07/24/2014US20140203456 Pre-Applying Supporting Materials between Bonded Package Components
07/24/2014US20140203453 Air-dielectric for subtractive etch line and via metallization
07/24/2014US20140203450 Semiconductor package and method of fabricating the same
07/24/2014US20140203449 Integrated circuits and methods of forming the same with metal layer connection to through-semiconductor via
07/24/2014US20140203448 Random coded integrated circuit structures and methods of making random coded integrated circuit structures
07/24/2014US20140203447 Metal lines having etch-bias independent height
07/24/2014US20140203446 Through silicon via device having low stress, thin film gaps and methods for forming the same
07/24/2014US20140203445 Mitigating pattern collapse
07/24/2014US20140203441 Semiconductor device and method of manufacturing the same
07/24/2014US20140203440 Microelectronic package and method of manufacture thereof
07/24/2014US20140203438 Methods and Apparatus of Packaging of Semiconductor Devices
07/24/2014US20140203437 Method Of Semiconductor Integrated Circuit Fabrication
07/24/2014US20140203436 Selective local metal cap layer formation for improved electromigration behavior
07/24/2014US20140203435 Selective local metal cap layer formation for improved electromigration behavior
07/24/2014US20140203434 Semiconductor Integrated Circuit and Fabricating the Same
07/24/2014US20140203432 Method for Packaging Quad Flat Non-Leaded Package Body, and Package Body
07/24/2014US20140203429 Fan-out package structure and methods for forming the same
07/24/2014US20140203423 Semiconductor device and method for manufacturing same
07/24/2014US20140203418 Lead frame and a method of manufacturing thereof
07/24/2014US20140203417 Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects
07/24/2014US20140203416 Chip package and method for forming the same
07/24/2014US20140203415 Semiconductor device and manufacturing method thereof, delamination method, and transferring method
07/24/2014US20140203414 Method Of Modifying Surfaces
07/24/2014US20140203413 Composite Substrate, Semiconductor Chip Having a Composite Substrate and Method for Producing Composite Substrates and Semiconductor Chips
07/24/2014US20140203412 Through silicon vias for semiconductor devices and manufacturing method thereof
07/24/2014US20140203411 Production method of semiconductor device, semiconductor wafer, and semiconductor device
07/24/2014US20140203410 Die edge sealing structures and related fabrication methods
07/24/2014US20140203408 Method of producing composite wafer and composite wafer
07/24/2014US20140203407 Method for low temperature bonding and bonded structure
07/24/2014US20140203406 Isolation structure of high-voltage driving circuit
07/24/2014US20140203398 Integrated Magnetic Core Inductors with Interleaved Windings
07/24/2014US20140203376 Finfet integrated circuits with uniform fin height and methods for fabricating the same
07/24/2014US20140203373 Device and methods for high-k and metal gate stacks
07/24/2014US20140203372 Semiconductor device and fabrication method thereof
07/24/2014US20140203365 Semiconductor device
07/24/2014US20140203335 Semiconductor Devices and Methods for Fabricating the Same
07/24/2014US20140203333 Semiconductor device having modified profile metal gate
07/24/2014US20140203326 Methods of forming hetero-layers with reduced surface roughness and bulk defect density on non-native surfaces and the structures formed thereby
07/24/2014US20140203325 Integration of germanium photo detector in cmos processing
07/24/2014US20140203309 Electroluminescence display device
07/24/2014US20140203300 SiC SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF
07/24/2014US20140203297 Method of Manufacturing Substrates Having Improved Carrier Lifetimes
07/24/2014US20140203288 Compound semiconductor device having gallium nitride gate structures
07/24/2014US20140203286 Electro-Optical Device and Electronic Device
07/24/2014US20140203280 Electrical test structure for devices employing high-k dielectrics or metal gates
07/24/2014US20140203279 Test structure and method to faciltiate development/optimization of process parameters
07/24/2014US20140203278 Chip Package Having Terminal Pads of Different Form Factors
07/24/2014US20140203250 Fabrication apparatus for fabricating a patterned layer
07/24/2014US20140202995 Plasma heat treatment apparatus
07/24/2014US20140202989 Substrate treatment method
07/24/2014US20140202946 Piping joint and semiconductor manufacturing apparatus
07/24/2014US20140202922 Carrier for receiving one or more electronic modules
07/24/2014US20140202921 Substrate transport
07/24/2014US20140202736 Lead frame and a method of fabrication thereof
07/24/2014US20140202641 Apparatus for producing ic chip package
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