Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/22/2014US8785911 Graphene or carbon nanotube devices with localized bottom gates and gate dielectric
07/22/2014US8785910 Thin film transistor, display device including the same, and method of manufacturing the display device
07/22/2014US8785906 Lamp with controllable spectrum
07/22/2014US8785901 Semiconductor devices having metal oxide patterns
07/22/2014US8785900 Resistive memory and methods of processing resistive memory
07/22/2014US8785893 Extreme ultraviolet light source and positioning method of light focusing optical means
07/22/2014US8785889 Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system
07/22/2014US8785888 Apparatus for and method of drawing
07/22/2014US8785818 Athermalized permanent-alignment optical-element mount
07/22/2014US8785815 Aperture control of thermal processing radiation
07/22/2014US8785334 Select transistor, method for making select transistor, memory device, and method for manufacturing memory device
07/22/2014US8785333 Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
07/22/2014US8785332 Method and apparatus for plasma dicing a semi-conductor wafer
07/22/2014US8785331 Method for replacing chlorine atoms on a film layer
07/22/2014US8785330 Method for producing a structure comprising at least one active part having zones of different thicknesses
07/22/2014US8785329 Method for forming pattern and method for manufacturing semiconductor device
07/22/2014US8785328 Mask pattern for hole patterning and method for fabricating semiconductor device using the same
07/22/2014US8785327 Method of manufacturing semiconductor device
07/22/2014US8785326 Methods of separating solid state transducers from substrates and associated devices and systems
07/22/2014US8785325 Method of manufacturing semiconductor device
07/22/2014US8785324 Interconnect structure for semiconductor devices
07/22/2014US8785323 Method of forming an interconnect structure having an enlarged region
07/22/2014US8785322 Devices and methods to optimize materials and properties for replacement metal gate structures
07/22/2014US8785321 Low resistance and reliable copper interconnects by variable doping
07/22/2014US8785320 Structure and process for metallization in high aspect ratio features
07/22/2014US8785319 Methods for forming fine patterns of a semiconductor device
07/22/2014US8785318 Semiconductor device and a method of manufacturing the same
07/22/2014US8785317 Wafer level packaging of semiconductor chips
07/22/2014US8785316 Methods for forming semiconductor materials by atomic layer deposition using halide precursors
07/22/2014US8785315 Reacted conductive gate electrodes and methods of making the same
07/22/2014US8785314 Etch bias homogenization
07/22/2014US8785313 Method of manufacturing device having a blocking structure
07/22/2014US8785312 Conductive layers for hafnium silicon oxynitride
07/22/2014US8785311 Film forming method, semiconductor device, manufacturing method thereof and substrate processing apparatus therefor
07/22/2014US8785310 Method of forming conformal metal silicide films
07/22/2014US8785308 Method for manufacturing semiconductor base material
07/22/2014US8785307 Method of forming a memory cell by reducing diffusion of dopants under a gate
07/22/2014US8785305 Backside stress compensation for gallium nitride or other nitride-based semiconductor devices
07/22/2014US8785304 P-I-N structures and methods for forming P-I-N structures having an i-layer formed via hot wire chemical vapor deposition (HWCVD)
07/22/2014US8785303 Methods for depositing amorphous silicon
07/22/2014US8785302 Crystal silicon film forming method, thin-film transistor and display device using the crystal silicon film
07/22/2014US8785301 Method of cleaning silicon carbide semiconductor
07/22/2014US8785300 BEOL anti-fuse structures for gate last semiconductor devices
07/22/2014US8785299 Package with a fan-out structure and method of forming the same
07/22/2014US8785298 Method of singulating a thin semiconductor wafer
07/22/2014US8785297 Method for encapsulating electronic components on a wafer
07/22/2014US8785296 Packaging method with backside wafer dicing
07/22/2014US8785294 Silicon carbide lamina
07/22/2014US8785293 Adaptation of the lattice parameter of a layer of strained material
07/22/2014US8785292 Anodic bonding method and method of producing acceleration sensor
07/22/2014US8785291 Post-gate shallow trench isolation structure formation
07/22/2014US8785290 Method for manufacturing semiconductor device having element isolation portions
07/22/2014US8785289 Integrated decoupling capacitor employing conductive through-substrate vias
07/22/2014US8785288 Methods of making memory cells
07/22/2014US8785287 Method to tune narrow width effect with raised S/D structure
07/22/2014US8785286 Techniques for FinFET doping
07/22/2014US8785285 Semiconductor devices and methods of manufacture thereof
07/22/2014US8785284 FinFETs and fin isolation structures
07/22/2014US8785283 Method for forming semiconductor structure having metal connection
07/22/2014US8785282 Two step poly etch LDMOS gate formation
07/22/2014US8785281 CMOS structure and method for fabrication thereof using multiple crystallographic orientations and gate materials
07/22/2014US8785280 Super-self-aligned Trench-DMOS structure and method
07/22/2014US8785279 High voltage field balance metal oxide field effect transistor (FBM)
07/22/2014US8785278 Nano MOSFET with trench bottom oxide shielded and third dimensional P-body contact
07/22/2014US8785277 Method of manufacturing the trench power semiconductor structure
07/22/2014US8785276 Methods for fabricating a cell string and a non-volatile memory device including the cell string
07/22/2014US8785274 Method for manufacturing semiconductor device
07/22/2014US8785273 FinFET non-volatile memory and method of fabrication
07/22/2014US8785272 Process to make high-K transistor dielectrics
07/22/2014US8785271 DRAM cell based on conductive nanochannel plate
07/22/2014US8785270 Integrating schottky diode into power MOSFET
07/22/2014US8785269 Method for manufacturing a semiconductor device
07/22/2014US8785268 Memory system with Fin FET technology
07/22/2014US8785267 Methods of manufacturing semiconductor devices including transistors
07/22/2014US8785266 Semiconductor device and manufacturing method thereof
07/22/2014US8785265 Semiconductor device and method for manufacturing the same
07/22/2014US8785264 Organic TFT array substrate and manufacture method thereof
07/22/2014US8785263 Thin-film transistor substrate and method of manufacturing the same
07/22/2014US8785262 Self-aligned carbon nanostructure field effect transistors using selective dielectric deposition
07/22/2014US8785261 Microelectronic transistor having an epitaxial graphene channel layer
07/22/2014US8785259 Organic transistor, manufacturing method of semiconductor device and organic transistor
07/22/2014US8785258 Method for manufacturing semiconductor device
07/22/2014US8785257 Array substrate for display device
07/22/2014US8785256 Method of manufacturing semiconductor package
07/22/2014US8785255 Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
07/22/2014US8785254 Method of manufacturing high-capacity semiconductor package
07/22/2014US8785253 Leadframe for IC package and method of manufacture
07/22/2014US8785251 Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die
07/22/2014US8785250 Methods and apparatus for flip-chip-on-lead semiconductor package
07/22/2014US8785249 Three dimensional microelectronic components and fabrication methods for same
07/22/2014US8785248 Wafer level packaging using a lead-frame
07/22/2014US8785247 Chip package and method for forming the same
07/22/2014US8785246 Multiple seal-ring structure for the design, fabrication, and packaging of integrated circuits
07/22/2014US8785245 Method of manufacturing stack type semiconductor package
07/22/2014US8785244 Wafer level packaging using a lead-frame
07/22/2014US8785243 Method for manufacturing a thin film transistor array panel
07/22/2014US8785242 Semiconductor device and method for manufacturing the same
07/22/2014US8785241 Semiconductor device and manufacturing method thereof
07/22/2014US8785240 Light-emitting apparatus and production method thereof
07/22/2014US8785239 Methods of depositing antimony-comprising phase change material onto a substrate and methods of forming phase change memory circuitry
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