Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/05/2014US8794896 Vacuum processing apparatus and zonal airflow generating unit
08/05/2014US8794502 Method of forming solder on pad on fine pitch PCB and method of flip chip bonding semiconductor using the same
08/05/2014US8794498 Electronic component device and method for producing the same
08/05/2014US8794289 Apparatus and method for making carbon nanotube film
08/05/2014US8794287 Wafer bonding apparatus
08/05/2014US8794250 Substrate processing method and substrate processing apparatus
08/05/2014CA2680551C Method for eliminating defects from semiconductor materials
08/05/2014CA2627222C Method for modifying insulating or semi-conductive surfaces, and resulting products
08/05/2014CA2425541C Method of fabricating a self-aligned bipolar junction transistor in silicon carbide and resulting devices
07/2014
07/31/2014WO2014117119A1 Leadframe-based semiconductor package having terminals on top and bottom surfaces
07/31/2014WO2014116829A1 Substrate dicing by laser ablation & plasma etch damage removal for ultra-thin wafers
07/31/2014WO2014116736A1 Silicon dioxide-polysilicon multi-layered stack etching with plasma etch chamber employing non-corrosive etchants
07/31/2014WO2014116734A1 Laser and plasma etch wafer dicing with etch chamber shield ring for film frame wafer applications
07/31/2014WO2014116707A1 Reflectivity measurements during polishing using a camera
07/31/2014WO2014116681A2 Substrate transport
07/31/2014WO2014116677A1 Open cavity plastic package
07/31/2014WO2014116656A1 Microelectronic package and method of manufacture thereof
07/31/2014WO2014116496A1 Metal-insulator-metal capacitor formation techniques
07/31/2014WO2014116489A1 Showerhead having a detachable gas distribution plate
07/31/2014WO2014116440A1 Process for removing carbon material from substrates
07/31/2014WO2014116434A1 Substrate processing chamber components incorporating anisotropic materials
07/31/2014WO2014116433A1 Deep gate-all-around semiconductor device having germanium or group iii-v active layer
07/31/2014WO2014116399A1 Self aligned dual patterning technique enhancement with magnetic shielding
07/31/2014WO2014116392A1 Electrostatic chuck with concentric cooling base
07/31/2014WO2014116376A1 Low shrinkage dielectric films
07/31/2014WO2014116304A2 Method and hardware for cleaning uv chambers
07/31/2014WO2014116253A1 Radiused alignment post for substrate material
07/31/2014WO2014115060A1 Control of p-contact resistance in a semiconductor light emitting device
07/31/2014WO2014114927A1 Substrate carrier
07/31/2014WO2014114412A1 Coated wire for bonding applications
07/31/2014WO2014114406A1 Back gate in select transistor for edram
07/31/2014WO2014113931A1 Underfill composition and packaging process using the same
07/31/2014WO2014085410A8 Ambipolar vertical field effect transistor
07/31/2014WO2014074221A4 Autonomous tool parameter impact identification for semiconductor manufacturing
07/31/2014US20140214191 Adaptive Integrated Circuit to Optimize Power and Performance Across Process Variations
07/31/2014US20140213498 Photoresist removal
07/31/2014US20140213155 Wafer polishing apparatus and method
07/31/2014US20140213151 Polishing pad
07/31/2014US20140213071 Laser annealing method and device
07/31/2014US20140213070 Low shrinkage dielectric films
07/31/2014US20140213069 Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium
07/31/2014US20140213068 Film deposition apparatus and film deposition method
07/31/2014US20140213067 Film forming method and film forming apparatus
07/31/2014US20140213066 Layout decomposition method and method for manufacturing semiconductor device applying the same
07/31/2014US20140213065 Method for Forming Layer Constituted by Repeated Stacked Layers
07/31/2014US20140213064 Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
07/31/2014US20140213063 Method and system for energized and pressurized liquids for cleaning/etching applications in semiconductor manufacturing
07/31/2014US20140213062 Silicon dioxide-polysilicon multi-layered stack etching with plasma etch chamber employing non-corrosive etchants
07/31/2014US20140213061 Ductile mode drilling methods for brittle components of plasma processing apparatuses
07/31/2014US20140213060 Method of patterning a low-k dielectric film
07/31/2014US20140213059 Boron-doped carbon-based hardmask etch processing
07/31/2014US20140213058 Pattern formation method and pattern formation apparatus
07/31/2014US20140213057 Chemical mechanical polishing (cmp) composition comprising a glycoside
07/31/2014US20140213056 Apparatus, method, and composition for far edge wafer cleaning
07/31/2014US20140213055 Semiconductor manufacturing device and processing method
07/31/2014US20140213054 Exposing method and method of forming a pattern using the same
07/31/2014US20140213053 Semiconductor device including substrate contact and related method
07/31/2014US20140213052 System for Self-Aligned Contacts
07/31/2014US20140213051 Hybrid Interconnect Scheme and Methods for Forming the Same
07/31/2014US20140213050 Method of making a die with recessed aluminum die pads
07/31/2014US20140213049 Method for processing a carrier, method for fabricating a charge storage memory cell, method for processing a chip, and method for electrically contacting a spacer structure
07/31/2014US20140213047 Fabrication of ultra-shallow junctions
07/31/2014US20140213046 Fabrication of III-Nitride Layers
07/31/2014US20140213044 Method for producing periodic crystalline silicon nanostructures
07/31/2014US20140213043 Method of radiatively grooving a semiconductor substrate
07/31/2014US20140213042 Substrate dicing by laser ablation & plasma etch damage removal for ultra-thin wafers
07/31/2014US20140213041 Laser and plasma etch wafer dicing with etch chamber shield ring for film frame wafer applications
07/31/2014US20140213040 Laser processing method
07/31/2014US20140213039 Methods of processing substrates
07/31/2014US20140213038 Manufacturing method of semiconductor device and manufacturing apparatus of semiconductor device
07/31/2014US20140213037 Methods for fabricating integrated circuits having confined epitaxial growth regions
07/31/2014US20140213036 Forming structures on resistive substrates
07/31/2014US20140213035 Method of forming buried word line structure
07/31/2014US20140213034 Method for forming isolation structure
07/31/2014US20140213033 Methods for fabricating electrically-isolated finfet semiconductor devices
07/31/2014US20140213028 Epitaxial process
07/31/2014US20140213021 Microelectronic packages and methods therefor
07/31/2014US20140213019 Method for manufacturing semiconductor device
07/31/2014US20140213018 Method for formng a semiconductor device assembly having a heat spreader
07/31/2014US20140213017 Method of fabricating semiconductor device
07/31/2014US20140213014 Ion implantation based emitter profile engineering via process modifications
07/31/2014US20140212995 Resin application apparatus, optical property correction apparatus and method, and method for manufacturing led package
07/31/2014US20140212994 Self aligned dual patterning technique enhancement with magnetic shielding
07/31/2014US20140212246 Apparatus for picking, placing and pressing semiconductor components
07/31/2014US20140212117 Heat treatment apparatus heating substrate by irradiation with light
07/31/2014US20140211347 Bi-directional esd protection circuit
07/31/2014US20140211346 Area-Efficient High Voltage Bipolar-Based ESD Protection Targeting Narrow Design Windows
07/31/2014US20140211190 Electrical Connector, Electrical Connection System and Lithographic Apparatus
07/31/2014US20140211183 Projection optical system, exposure apparatus, and exposure method
07/31/2014US20140211182 Projection optical system, exposure apparatus, and exposure method
07/31/2014US20140211180 Projection optical system, exposure apparatus, and exposure method
07/31/2014US20140210515 Pld architecture for flexible placement of ip function blocks
07/31/2014US20140210224 End effector device and substrate conveying robot including end effector device
07/31/2014US20140210113 Alignment mark recovery with reduced topography
07/31/2014US20140210111 Embedded package on package systems
07/31/2014US20140210109 Built-in electronic component substrate and method for manufacturing the substrate
07/31/2014US20140210107 Stacked wafer ddr package
07/31/2014US20140210106 ULTRA THIN PoP PACKAGE
07/31/2014US20140210105 Method of forming interconnection lines
07/31/2014US20140210100 Conductive line routing for multi-patterning technology
1 ... 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 ... 6590