Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/23/2014CN103946952A 用于治疗癌症的rna改造的t细胞 For the treatment of cancer transformation rna t-cells
07/23/2014CN103946748A 热反应型抗蚀剂材料、模具的制造方法、模具、显影方法以及图案形成材料 The heat-reactive resist material, the manufacturing method for a mold, the mold, a developing method and a pattern forming material
07/23/2014CN103946747A 负型感光性树脂组合物、分隔壁、黑色矩阵以及光学元件 A negative-type photosensitive resin composition, partition walls, a black matrix and an optical element
07/23/2014CN103946742A 半导体装置、显示装置和半导体装置的制造方法 A semiconductor device, a display device and a method of manufacturing a semiconductor device
07/23/2014CN103946431A 制造碳化硅半导体器件的方法 The method of manufacturing a silicon carbide semiconductor device
07/23/2014CN103946361A 聚硅氧氮烷氢氧化物薄膜清洗溶液及使用其的聚硅氧氮烷氢氧化物薄膜图案形成方法 Poly-silicon oxynitride film alkyl hydroxide cleaning solution and using the same silicone Prozac hydroxide film pattern forming method
07/23/2014CN103946326A 固化性组合物、涂布用组合物、固化膜、激光加工方法及多层布线结构体的制造方法 Method for producing a curable composition, coating composition, a cured film, a laser processing method and a multilayer wiring structure
07/23/2014CN103946314A 具有改善的热稳定性的凝胶 Having improved thermal stability gel
07/23/2014CN103946271A 包含具有碳碳多重键的树脂的钝化膜形成用组合物 A passivation film comprising a resin having a carbon-carbon multiple bond-forming composition
07/23/2014CN103946204A 环状化合物、其制造方法、辐射敏感组合物及抗蚀图案形成方法 Cyclic compounds, manufacturing method, the radiation-sensitive composition and resist pattern-forming method
07/23/2014CN103946004A 密封用树脂片材的制造方法 The method of manufacturing a sealing resin sheet
07/23/2014CN103945986A 使用过的固定磨料钢丝锯用切削液组合物的处理方法 A processing method using a fixed abrasive wire saw through the cutting fluid composition
07/23/2014CN103945984A 研磨垫 Abrasive pad
07/23/2014CN103943741A 一种基于激光剥离的半导体发光器件的制备方法 A process for laser lift-off of the semiconductor light emitting device based on
07/23/2014CN103943722A 一种抗pid太阳能电池制作方法 A method of manufacturing a solar cell anti-pid
07/23/2014CN103943719A 一种采用预氧结合低温-高温-低温的变温扩散方式对磷掺杂浓度进行控制的方法 One kind of oxygen combined with pre-low - temperature - low variable temperature phosphorus diffusion method for controlling the doping concentration
07/23/2014CN103943688A 一种肖特基势垒二极管器件结构及其制作方法 One kind of a Schottky barrier diode device structure and manufacturing method thereof
07/23/2014CN103943686A 一种封装免焊片的肖特基势垒二极管芯片制备方法 A packaged-free solder tabs Schottky barrier diode chip preparation
07/23/2014CN103943684A 薄膜晶体管及其制作方法、阵列基板、显示装置 Thin film transistor and manufacturing method, the array substrate, a display device
07/23/2014CN103943683A 一种铟锡锌氧化物同质薄膜晶体管及其制备方法 One kind of indium-tin-zinc oxide thin film transistor homogeneity and preparation method
07/23/2014CN103943681A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/23/2014CN103943679A 用于电流控制的半导体装置及其制造方法 Semiconductor device and manufacturing method for the current control
07/23/2014CN103943678A 一种半导体器件及其制造方法 A semiconductor device and its manufacturing method
07/23/2014CN103943677A 一种芯片尺寸级氮化镓基晶体管及其制备方法 A chip size of the gallium nitride-based transistor stage and preparation method
07/23/2014CN103943676A 半导体装置及其制造方法、电源装置和高频放大器 Semiconductor device and manufacturing method of the power supply apparatus and a high-frequency amplifier
07/23/2014CN103943675A 半导体装置及其制造方法、电源装置和高频放大器 Semiconductor device and manufacturing method of the power supply apparatus and a high-frequency amplifier
07/23/2014CN103943674A 高电子迁移率晶体管 High electron mobility transistor
07/23/2014CN103943671A 一种功率半导体器件及其形成方法 A power semiconductor device and method of forming
07/23/2014CN103943669A 一种反熔丝结构及其制备方法 An anti-fuse structure and preparation method
07/23/2014CN103943668A 带有加强的3d resurf的半导体器件 Semiconductor devices with enhanced 3d resurf of
07/23/2014CN103943667A 一种化学配比失配绝缘材料电荷补偿的半导体结装置及其制备方法 A stoichiometric semiconductor junction device mismatch charge compensation of insulating material and its preparation method
07/23/2014CN103943666A 一种沟槽半导体装置及其制备方法 A semiconductor device and a method for preparing a trench
07/23/2014CN103943665A 半导体装置及其制造方法与操作方法 The semiconductor device and its manufacturing method and operating method
07/23/2014CN103943660A 一种显示装置 A display device comprising
07/23/2014CN103943646A 能够增强电荷耦合元件紫外响应能力的光学薄膜及制备 Charge-coupled device can be enhanced UV response capability and an optical film prepared
07/23/2014CN103943645A 影像传感器模组及其形成方法 Image sensor module and method of forming
07/23/2014CN103943644A 一种传输晶体管结构 A transmission transistor structure
07/23/2014CN103943639A 一种阵列基板及其制作方法、显示装置 One kind of array substrate and method of manufacturing a display device
07/23/2014CN103943638A 一种阵列基板及其制作方法、显示装置 One kind of array substrate and method of manufacturing a display device
07/23/2014CN103943637A 一种阵列基板、其制作方法及显示装置 An arrayed substrate, its production method and a display device
07/23/2014CN103943636A 一种薄膜晶体管阵列基板及其制作方法 A thin film transistor array substrate and manufacturing method thereof
07/23/2014CN103943633A 一种阵列基板及其制作方法、显示装置 One kind of array substrate and method of manufacturing a display device
07/23/2014CN103943632A 一种阵列基板及其制备方法、液晶显示器 One kind of array substrate and its preparation method, liquid crystal displays
07/23/2014CN103943631A 一种薄膜晶体管阵列基板及其制备方法、液晶显示器 A thin film transistor array substrate and its preparation method, liquid crystal displays
07/23/2014CN103943630A Tft基板及其制作方法、显示面板 Tft substrate and method of manufacturing the display panel
07/23/2014CN103943628A Tft阵列基板、制造方法及其显示面板 Tft array substrate, a display panel manufacturing method and
07/23/2014CN103943627A Tft阵列基板及其制造方法、显示装置 Tft array substrate and a manufacturing method of a display device
07/23/2014CN103943625A 一种nand闪存器件及其制造方法 One kind of nand flash memory device and manufacturing method thereof
07/23/2014CN103943622A 半导体装置结构及形成cmos集成电路结构的方法 The semiconductor device structure and method of forming an integrated circuit structure cmos
07/23/2014CN103943621A 浅沟槽隔离结构及其形成方法 Shallow trench isolation structure and method of forming
07/23/2014CN103943620A 半导体封装件及其制法 The semiconductor package Jiqizhifa
07/23/2014CN103943615A 一种dram双芯片堆叠封装结构和封装方法 One kind of two-chip stacked package structure dram and encapsulation method
07/23/2014CN103943614A 集成无源器件扇出型晶圆级封装三维堆叠结构及制作方法 Integrated passives fan-out type wafer level package structure and method of making a three-dimensional stack
07/23/2014CN103943607A 划片槽条宽测试结构及方法 Scribe bar width test structures and methods
07/23/2014CN103943605A 基于超薄玻璃的封装结构及方法 Thin glass package structure and method based on
07/23/2014CN103943604A 复合铜线互连结构及形成方法 Composite copper interconnect structure and a method of forming
07/23/2014CN103943602A 芯片叠层结构及其制造方法 Chip stack structure and manufacturing method
07/23/2014CN103943601A 一种具有铜-石墨烯复相的互连线及其制备方法 Graphene interconnects complex phase of its preparation - a copper has
07/23/2014CN103943600A 在芯片和基板之间的新型端接和连接 The new termination and connection between the chip and the substrate
07/23/2014CN103943599A 互连结构及其制造方法 Interconnection structure and its manufacturing method
07/23/2014CN103943598A 一种通用预封装基板结构、封装结构及封装方法 A universal pre-packaged substrate structure package structure and encapsulation method
07/23/2014CN103943581A 功率器件封装结构及封装方法 Power device package structure and encapsulation method
07/23/2014CN103943580A 半导体器件 Semiconductor devices
07/23/2014CN103943579A 晶圆级铜柱微凸点结构及制作方法 Wafer-level Tongzhu microbumps point structure and production methods
07/23/2014CN103943578A 铜柱凸点结构及成型方法 Copper pillar bump structure and method of forming
07/23/2014CN103943575A 用于在暴露的导电表面上电泳沉积（epd）薄膜的方法及其电子部件 The method for film on the conductive surface of the exposed electrophoretic deposition (epd) and the electronic component
07/23/2014CN103943573A 一种新型集成电路内部封装方法 A new method of packaging an integrated circuit inside
07/23/2014CN103943572A 集成电路装置及其制造方法 Integrated circuit device and manufacturing method thereof
07/23/2014CN103943571A 非易失性存储器的制造方法 The method of manufacturing a nonvolatile memory
07/23/2014CN103943570A 一种一次性编程存储器中金属硅化物掩膜的制备方法 Preparation method of one-time programmable memory metal silicide mask
07/23/2014CN103943569A 消除金属薄膜表面小丘状缺陷的方法 Method to eliminate hillock shaped metal film surface defects
07/23/2014CN103943568A 利用对隔离层的氮化来制造半导体器件的方法 Using the method of the nitride spacer layer is a semiconductor device manufactured
07/23/2014CN103943567A 晶片加工方法 Wafer processing method
07/23/2014CN103943566A 辊 Roll
07/23/2014CN103943565A 一种裸眼3d功能面板的制造方法 A method for producing a 3d naked eye function panel
07/23/2014CN103943564A 一种tft阵列基板及其制作方法、显示面板 One kind tft array substrate and method of manufacturing the display panel
07/23/2014CN103943563A 形成包含垂直纳米线的半导体结构的方法 The method of forming a semiconductor structure comprising a vertical nanowires
07/23/2014CN103943562A 一种具有石墨烯的互连线及其制备方法 A graphene interconnects its preparation method
07/23/2014CN103943561A 一种低介电常数薄膜的成膜方法 A low dielectric constant film deposition method of
07/23/2014CN103943560A 一种形成低介电常数薄膜及其缓冲层的成膜方法 A low dielectric constant film deposition method and the buffer layer is formed
07/23/2014CN103943559A 金属硬掩膜结构、制造方法及铜互连结构制造方法 Metal hard mask structure, manufacturing method and manufacturing method of a copper interconnect structure
07/23/2014CN103943558A 采用cmp对以聚合物为介质层的大马士革工艺中铜沉积后的表面进行平坦化的方法 Cmp polymer used as the surface of the dielectric layer after the deposition of the copper damascene process in the method of flattening
07/23/2014CN103943557A 利用cmp对重布线层中聚合物介质层表面进行平坦化的方法 Using cmp weight polymer dielectric layer surface of the wiring layer is planarized method
07/23/2014CN103943556A 一种用于半导体铜互连工艺的电镀铜膜的处理方法 Processing method for electroplating a copper film semiconductor copper interconnect technology
07/23/2014CN103943555A 一种有源区制备方法 An active area preparation
07/23/2014CN103943554A 延长超低介电常数材料的工艺等待时间的方法 Ultra-low dielectric constant material extend the process method of the waiting time
07/23/2014CN103943553A 半导体器件和形成具有垂直互连单元的低轮廓扇出式封装的方法 And forming a semiconductor device having a vertical low-profile interconnection unit package method of fan-out
07/23/2014CN103943552A 半导体集成电路制造方法 The semiconductor integrated circuit manufacturing method
07/23/2014CN103943551A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
07/23/2014CN103943550A 顶层金属互连层的制造方法 The method of manufacturing the top metal interconnect layer
07/23/2014CN103943549A 一种浅沟槽氧化物空洞和浮栅极多晶硅凹点的消除方法 A method to eliminate voids and shallow trench oxide floating gate polysilicon pits
07/23/2014CN103943548A 分立式场氧结构的半导体器件的制造方法 Semiconductor device manufacturing method discrete field oxide structure
07/23/2014CN103943547A 基于增强吸附来制备绝缘体上材料的方法 Based on the insulator is prepared to enhance the adsorption material
07/23/2014CN103943546A 一种硅片支撑装置 One kind of wafer support device
07/23/2014CN103943545A 机械手和半导体设备 Robots and semiconductor equipment
07/23/2014CN103943544A 制造软性元件的方法 The method of manufacturing the soft member
07/23/2014CN103943543A 离形层、应用其的可挠式装置及可挠式基板的制造方法 From the shape layer and method of manufacturing the flexible application of its type device and flexible style board
07/23/2014CN103943542A 一种晶圆定位起托器 Wafer positioning device from one kind of care
07/23/2014CN103943541A 盖板载片盒装置 Cover onboard cassette device
07/23/2014CN103943540A 自动控制点胶量的固晶机 Automatic control dispensing amount Bonder
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