Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2011
11/10/2011WO2011084229A3 Embedded mems sensors and related methods
11/10/2011WO2011081503A3 Chemical mechanical polishing slurry compositions and polishing method using the same
11/10/2011WO2011078627A3 Pattern-roll and printing device including the same
11/10/2011WO2011078483A3 Fine gap-fill polymers, fine gap-filling compositions comprising same, and method for making integrated circuit semiconductor devices using same
11/10/2011WO2011074847A3 Apparatus and method for extracting a silicon ingot
11/10/2011WO2011074837A3 Probe apparatus for a wafer solder bump
11/10/2011WO2011071726A3 Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices
11/10/2011WO2010144823A3 Method for manufacturing tight pitch, flip chip integrated circuit packages
11/10/2011WO2010122168A3 Method for producing a semiconductor element, in particular a solar cell, based on a semiconductor thin layer having a direct semiconductor or germanium
11/10/2011US20110276928 Method for controlling pattern uniformity of semiconductor device
11/10/2011US20110276073 Cystotomy Catheter Capture Device
11/10/2011US20110275226 Process to dissolve the oxide layer in the peripheral ring of a structure of semiconductor-on-insulator type
11/10/2011US20110275225 Semiconductor device manufacturing method
11/10/2011US20110275224 Method for manufacturing silicon carbide substrate
11/10/2011US20110275223 Solution for increasing wafer sheet resistance and/or photovoltaic cell power density level
11/10/2011US20110275222 Silicon Texture Formulations With Diol Additives And Methods of Using The Formulations
11/10/2011US20110275221 Method for treatment substrates and treatment composition for said method
11/10/2011US20110275220 Low temperature metal etching and patterning
11/10/2011US20110275219 High pressure bevel etch process
11/10/2011US20110275218 Double patterning strategy for contact hole and trench in photolithography
11/10/2011US20110275217 Polishing solution for cmp and polishing method using the polishing solution
11/10/2011US20110275216 Two step chemical-mechanical polishing process
11/10/2011US20110275215 Method for forming a titanium-containing layer on a substrate using an atomic layer deposition (ald) process
11/10/2011US20110275214 Dual damascene-like subtractive metal etch scheme
11/10/2011US20110275213 Semiconductor device and manufacturing method thereof
11/10/2011US20110275212 Integrated High-K/Metal Gate in CMOS Process Flow
11/10/2011US20110275211 Methods of Etching Nanodots, Methods of Removing Nanodots From Substrates, Methods of Fabricating Integrated Circuit Devices, Methods of Etching a Layer Comprising a Late Transition Metal, and Methods of Removing a Layer Comprising a Late Transition Metal From a Substrate
11/10/2011US20110275210 Method of making vertical transistor with graded field plate dielectric
11/10/2011US20110275209 Vertical field effect transistor arrays and methods for fabrication thereof
11/10/2011US20110275208 Shield contacts in a shielded gate mosfet
11/10/2011US20110275207 Semiconductor memory device and a method of manufacturing the same
11/10/2011US20110275206 Method for fabricating semiconductor device
11/10/2011US20110275205 Method of fabricating a semiconductor device including ion implantation at a tilt angle in exposed regions
11/10/2011US20110275204 Method of fabricating a semiconductor device including ion implantation at a tilt angle in exposed regions
11/10/2011US20110275203 Method of fabricating a semiconductor device including ion implantation at a tilt angle in exposed regions
11/10/2011US20110275202 Semiconductor device and fabrication method
11/10/2011US20110275201 Method for producing a semiconductor device have fin-shaped semiconductor regions
11/10/2011US20110275200 Methods of dynamically controlling film microstructure formed in a microcrystalline layer
11/10/2011US20110275199 Compound semiconductor device and manufacturing method of the same
11/10/2011US20110275198 Film wrapped nfet nanowire
11/10/2011US20110275197 Semiconductor memory device, method of forming the same, and memory system
11/10/2011US20110275196 Thermal Evaporation Sources with Separate Crucible for Holding the Evaporant Material
11/10/2011US20110275195 Method of treating a semiconductor device
11/10/2011US20110275194 Method for manufacturing semiconductor device
11/10/2011US20110275193 Method and apparatus for dividing thin film device into separate cells
11/10/2011US20110275192 Fusion bonding process and structure for fabricating silicon-on-insulation (soi) semiconductor devices
11/10/2011US20110275191 Method of Manufacturing Semiconductor Device
11/10/2011US20110275190 Method of forming an insulation structure and method of manufacturing a semiconductor device using the same
11/10/2011US20110275189 Semiconductor device and manufacturing method of semiconductor device
11/10/2011US20110275188 Semiconductor device having a buried gate that can realize a reduction in gate-induced drain leakage (gidl) and method for manufacturing the same
11/10/2011US20110275187 Method for forming a vertical mos transistor
11/10/2011US20110275186 Fabricating and operating a memory array having a multi-level cell region and a single-level cell region
11/10/2011US20110275185 Method of manufacturing semiconductor device with offset sidewall structure
11/10/2011US20110275184 Semiconductor Device
11/10/2011US20110275183 Enhancement Mode III-Nitride FET
11/10/2011US20110275182 Stacked non-volatile memory with silicon carbide-based amorphous silicon thin film transistors
11/10/2011US20110275181 Semiconductor package having an antenna with reduced area and method for fabricating the same
11/10/2011US20110275180 Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via
11/10/2011US20110275179 Protective tape joining method and protective tape used therefor
11/10/2011US20110275178 Patterned contact
11/10/2011US20110275177 Semiconductor package having ink-jet type dam and method of manufacturing the same
11/10/2011US20110275176 Method of Assembly and Assembly Thus Made
11/10/2011US20110275170 System for concurrent test of semiconductor devices
11/10/2011US20110275169 Semiconductor nanocrystal probes for biological applications and process for making and using such probes
11/10/2011US20110275168 Single step cmp for polishing three or more layer film stacks
11/10/2011US20110275167 Endpoint Method Using Peak Location Of Modified Spectra
11/10/2011US20110275166 Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
11/10/2011US20110275165 Thermoelectric conversion module and method of restoring the same
11/10/2011US20110275164 Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
11/10/2011US20110275018 Circuit architecture on an organic base and related manufacturing method
11/10/2011US20110274848 Ejection device and droplet disposition method
11/10/2011US20110274522 Robot arm for delivering a wafer, wafer-operating machine and member thereof
11/10/2011US20110274521 Carrier system and method for handling carried object using the same
11/10/2011US20110274299 Encapsulated micro-electro-mechanical device, in particular a mems acoustic transducer
11/10/2011US20110274130 Single ridge n-p-n diode laser
11/10/2011US20110273857 Contact springs for silicon chip packages
11/10/2011US20110273698 Beam transforming element, illumination optical apparatus, exposure apparatus, and exposure method with two optical elements having different thicknesses
11/10/2011US20110273697 Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
11/10/2011US20110273693 Beam transforming element, illumination optical apparatus, exposure apparatus, and exposure method with two optical elements having different thicknesses
11/10/2011US20110273692 Beam transforming element, illumination optical apparatus, exposure apparatus, and exposure method with two optical elements having different thicknesses
11/10/2011US20110273683 Lithographic apparatus and device manufacturing method
11/10/2011US20110273680 Immersion photolithography system and method using microchannel nozzles
11/10/2011US20110273677 Lithographic apparatus and device manufacturing method
11/10/2011US20110273676 Immersion photolithography system and method using microchannel nozzles
11/10/2011US20110273390 Semiconductor device, method for manufacturing same, and display device
11/10/2011US20110273154 Semiconductor Device
11/10/2011US20110272874 Device for holding wafer shaped articles
11/10/2011US20110272871 Wafer Spin Chuck and an Etcher Using the Same
11/10/2011US20110272840 Light Transmissive Mold and Apparatus For Imprinting a Pattern Onto a Material Applied on a Semiconductor Workpiece and Related Methods
11/10/2011US20110272826 Method for producing an electric functional layer on a surface of a substrate
11/10/2011US20110272825 Stacked die assembly having reduced stress electrical interconnects
11/10/2011US20110272824 Semiconductor Device and Method of Forming Channels in Back Surface of FO-WLCSP for Heat Dissipation
11/10/2011US20110272823 Through substrate vias
11/10/2011US20110272821 Wiring Substrate Manufacturing Method and Wiring Substrate
11/10/2011US20110272820 Stacked semiconductor package and method for manufacturing the same
11/10/2011US20110272818 Semiconductor device for preventing crack in pad region and fabricating method thereof
11/10/2011US20110272816 Wiring over substrate, semiconductor device, and methods for manufacturing thereof
11/10/2011US20110272815 Semiconductor device and layout design method for the same
11/10/2011US20110272814 Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint
11/10/2011US20110272813 Semiconductor device and method of manufacturing semiconductor device