Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2012
04/18/2012CN101494225B 存储器及其制作方法 Memory and manufacturing method thereof
04/18/2012CN101490145B 多孔膜的前体组合物及其制备方法、多孔膜及其制作方法、以及半导体装置 Precursor composition and preparation method, the porous membrane porous film and its production method, and semiconductor device
04/18/2012CN101488495B Semiconductor module with switching components and driver electronics
04/18/2012CN101471257B 等离子体蚀刻方法和等离子体蚀刻装置 The plasma etching method and a plasma etching apparatus
04/18/2012CN101465294B 在半导体器件中制造垂直沟道晶体管的方法 The method of manufacturing a semiconductor device in a vertical channel transistor
04/18/2012CN101438399B Ion implantation combined with in situ or ex situ heat treatment for improved field effect transistors
04/18/2012CN101419944B 平板显示器的制备方法 Preparation of flat panel displays
04/18/2012CN101419399B Method for modifying white defect of photomask
04/18/2012CN101414603B Stacked semiconductor package and method for manufacturing the same
04/18/2012CN101393898B Encapsulation structure and manufacturing method thereof
04/18/2012CN101379606B 粘接卡盘装置 Bonding chuck means
04/18/2012CN101359645B Semiconductor device, premolding packaging structure and manufacture method
04/18/2012CN101351870B Laser beam machining method and semiconductor chip
04/18/2012CN101346810B 半导体装置的制造方法和半导体装置 The method of manufacturing a semiconductor device and a semiconductor device
04/18/2012CN101339897B 真空处理装置和真空处理方法 Vacuum processing apparatus and vacuum processing method
04/18/2012CN101310443B 半导体器件 Semiconductor devices
04/18/2012CN101308847B 半导体装置 Semiconductor device
04/18/2012CN101308808B 双重金属镶嵌结构的制造方法 Manufacturing method of dual damascene structure
04/18/2012CN101286461B 芯片安装设备及芯片安装设备中的剥离促进头更换方法 Chip-mounting equipment and chip-mounting equipment stripped promote head replacement method
04/18/2012CN101273456B 形状记忆装置 Shape memory device
04/18/2012CN101260223B Thermosetting die bonding film
04/18/2012CN101256408B 基板处理装置的设定操作支援装置及其方法 Setting the substrate processing apparatus and method for the operation support apparatus
04/18/2012CN101221954B 在片上系统中使用动态随机存取存储器部件的方法及系统 Using a dynamic random access memory means in the on-chip system, a method and system for
04/18/2012CN101201382B Method for generating device testing pattern
04/18/2012CN101194359B Sub-mount and its manufacturing method
04/18/2012CN101194040B 旋转基板支撑件及其使用方法 Rotating the substrate support member and method of use
04/18/2012CN101185030B Antireflective hardmask composition and methods for using same
04/18/2012CN101172540B 非接触式运送装置 Non-contact conveying device
04/18/2012CN101160643B 等离子体掺入方法和等离子体掺入设备 Plasma incorporation method and plasma incorporation equipment
04/18/2012CN101079422B Semiconductor device having analog transistor and fabrication method thereof
04/18/2012CN101061585B 可缩放集成逻辑和非易失性存储器 Scalable Integrated logic and nonvolatile memory
04/18/2012CN101033041B 工件搬送装置及工件搬送方法 Of the workpiece conveying means and the workpiece conveying method
04/18/2012CA2773261A1 Method for manufacturing combined substrate having silicon carbide substrate
04/17/2012US8161424 Method and apparatus for modeling chemically amplified resists
04/17/2012US8159647 Lithographic apparatus and device manufacturing method
04/17/2012US8159287 Transistor device and method
04/17/2012US8159109 Microresonator
04/17/2012US8159075 Semiconductor chip stack and manufacturing method thereof
04/17/2012US8159074 Chip structure
04/17/2012US8159063 Substrate and package with micro BGA configuration
04/17/2012US8159062 Semiconductor and a method of manufacturing the same
04/17/2012US8159054 Semiconductor device
04/17/2012US8159052 Apparatus and method for a chip assembly including a frequency extending device
04/17/2012US8159049 Semiconductor structure for imaging detectors
04/17/2012US8159047 Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors
04/17/2012US8159045 Semiconductor device with shield line disposed between capacitors
04/17/2012US8159043 Semiconductor device
04/17/2012US8159039 Superjunction device having a dielectric termination and methods for manufacturing the device
04/17/2012US8159037 Stack structure comprising epitaxial graphene, method of forming the stack structure, and electronic device comprising the stack structure
04/17/2012US8159036 Semiconductor device and method of manufacturing the same
04/17/2012US8159034 Semiconductor device having insulated gate field effect transistors and method of manufacturing the same
04/17/2012US8159030 Strained MOS device and methods for its fabrication
04/17/2012US8159026 Lateral high-voltage semiconductor devices with majorities of both types for conduction
04/17/2012US8159025 Gate electrode in a trench for power MOS transistors
04/17/2012US8159024 High voltage (>100V) lateral trench power MOSFET with low specific-on-resistance
04/17/2012US8159021 Trench MOSFET with double epitaxial structure
04/17/2012US8159020 Non-volatile two transistor semiconductor memory cell and method for producing the same
04/17/2012US8159018 Non-volatile memory device
04/17/2012US8159016 Capacitor of a semiconductor device
04/17/2012US8159015 Method and structure for forming capacitors and memory devices on semiconductor-on-insulator (SOI) substrates
04/17/2012US8159014 Localized biasing for silicon on insulator structures
04/17/2012US8159013 Semiconductor integrated circuit device having a dummy metal wiring line
04/17/2012US8159008 Method of fabricating a trench-generated transistor structure
04/17/2012US8159006 Semiconductor device having a triple gate transistor and method for manufacturing the same
04/17/2012US8158987 Light-emitting diode and method for fabrication thereof
04/17/2012US8158986 System for display images and fabrication method thereof
04/17/2012US8158982 Polysilicon thin film transistor device with gate electrode thinner than gate line
04/17/2012US8158975 Semiconductor device and manufacturing method thereof
04/17/2012US8158971 Highly efficient organic light-emitting device using substrate or electrode having nanosized half-spherical convex and method for preparing the same
04/17/2012US8158568 Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith
04/17/2012US8158538 Single electron transistor operating at room temperature and manufacturing method for same
04/17/2012US8158536 Low dielectric constant films and manufacturing method thereof, as well as electronic parts using the same
04/17/2012US8158535 Method for forming insulating film and method for manufacturing semiconductor device
04/17/2012US8158534 Reduction of defects formed on the surface of a silicon oxynitride film
04/17/2012US8158533 Piezoelectric tactile sensor
04/17/2012US8158532 Topography reduction and control by selective accelerator removal
04/17/2012US8158531 Method of manufacturing solar cell and plasma treatment apparatus
04/17/2012US8158530 Methods for retaining metal-comprising materials using liquid chemistry dispense systems from which oxygen has been removed
04/17/2012US8158529 Method for forming active pillar of vertical channel transistor
04/17/2012US8158528 Method for forming pattern of semiconductor device
04/17/2012US8158527 Semiconductor device fabrication method using multiple resist patterns
04/17/2012US8158526 Endpoint detection for photomask etching
04/17/2012US8158525 Plasma etching method and apparatus, and method of manufacturing liquid ejection head
04/17/2012US8158524 Line width roughness control with arc layer open
04/17/2012US8158523 Quantification of hydrophobic and hydrophilic properties of materials
04/17/2012US8158522 Method of forming a deep trench in a substrate
04/17/2012US8158521 Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties
04/17/2012US8158520 Method of forming a via structure dual damascene structure for the manufacture of semiconductor integrated circuit devices
04/17/2012US8158519 Method of manufacturing non-volatile memory cell using self-aligned metal silicide
04/17/2012US8158518 Methods of making metal silicide contacts, interconnects, and/or seed layers
04/17/2012US8158517 Method for manufacturing wiring substrate, thin film transistor, display device and television device
04/17/2012US8158516 Method for manufacturing semiconductor device
04/17/2012US8158515 Method of making 3D integrated circuits
04/17/2012US8158514 Method for producing vertical electrical contact connections in semiconductor wafers
04/17/2012US8158513 Integrated circuit system employing backside energy source for electrical contact formation
04/17/2012US8158512 Atomic layer deposition method and semiconductor device formed by the same
04/17/2012US8158511 Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features
04/17/2012US8158510 Semiconductor device and method of forming IPD on molded substrate
04/17/2012US8158509 Method of manufacturing semiconductor device
04/17/2012US8158508 Structure and manufacturing method of a chip scale package
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