Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2012
04/19/2012WO2012050044A1 Polishing composition
04/19/2012WO2012050015A1 Polymerizable fluorine-containing sulfonate, fluorine-containing sulfonate resin, resist composition and pattern-forming method using same
04/19/2012WO2012050007A1 Ferroelectric thin film having superlattice structure, manufacturing method thereof, ferroelectric element, and manufacturing method thereof
04/19/2012WO2012049998A1 Processing system
04/19/2012WO2012049954A1 Electronic device and electronic component
04/19/2012WO2012049943A1 Silicon nitride film-forming device and method
04/19/2012WO2012049939A1 Method for manufacturing electronic component
04/19/2012WO2012049938A1 Method for manufacturing electronic component
04/19/2012WO2012049919A1 Method for forming resist pattern and radiation-sensitive resin composition
04/19/2012WO2012049913A1 Liquid treatment apparatus and liquid treatment method
04/19/2012WO2012049901A1 Image rendering method and image rendering device
04/19/2012WO2012049893A1 RECTANGULAR-SHAPED SILVER (Ag) CLAD STEEL-RIBBON FOR HIGH TEMPERATURE SEMICONDUCTOR DEVICE
04/19/2012WO2012049892A1 Semiconductor device and method for producing same
04/19/2012WO2012049843A1 Method for producing buffer layer and cbd film-forming apparatus
04/19/2012WO2012049830A1 Semiconductor thin film, thin film transistor and production method therefor
04/19/2012WO2012049823A1 Semiconductor device production method and semiconductor device
04/19/2012WO2012049821A1 Semiconductor device using close proximity wireless communication
04/19/2012WO2012049792A1 Method for producing silicon carbide semiconductor device
04/19/2012WO2012049735A1 Method for forming pzt thin film and method for producing semiconductor device
04/19/2012WO2012049071A1 Field-effect transistor on a self-assembled semiconductor well
04/19/2012WO2012049058A1 Device and method for processing wafers
04/19/2012WO2012048973A1 Methods of forming through wafer interconnects in semiconductor structures using sacrificial material, and semiconductor structures formed by such methods
04/19/2012WO2012048624A1 Method for fabricating small-scale mos device
04/19/2012WO2012048534A1 Process for cleaning compound semiconductor wafer
04/19/2012WO2012048516A1 Three-dimensional vertical interconnecting structure and manufacturing method thereof
04/19/2012WO2012048419A1 Methods, apparatus and media for determining a shape of an irradiance pulse to which a workpiece is to be exposed
04/19/2012WO2012030774A3 Light-emitting device array with individual cells
04/19/2012WO2012027009A3 Gas distribution showerhead with high emissivity surface
04/19/2012WO2012024056A3 Semiconductor constructions; and methods for providing electrically conductive material within openings
04/19/2012WO2012024007A3 Micromachined on-wafer probes and related method
04/19/2012WO2012023973A3 Liquid precursor for deposition of indium selenide
04/19/2012WO2012021243A3 Methods for forming low stress dielectric films
04/19/2012WO2012018473A3 Method of removing contaminants and native oxides from a substrate surface
04/19/2012WO2012015550A3 Semiconductor device and structure
04/19/2012WO2012012457A3 Polycrystalline silicon production
04/19/2012WO2012012335A3 Ultrasonic bonding systems including workholder and ribbon feeding system
04/19/2012WO2012012220A3 Metal-contamination-free through-substrate via structure
04/19/2012WO2012010139A3 Precision machine tool
04/19/2012WO2012009371A3 Compartmentalized chamber
04/19/2012WO2012003301A3 Ultrahigh density vertical nand memory device and method of making thereof
04/19/2012WO2012002997A3 Resistive ram devices and methods
04/19/2012WO2011163441A3 Methods of operating of a wire bonding machine
04/19/2012WO2011159905A3 Loadlock batch ozone cure
04/19/2012WO2011159737A3 Systems, methods and products involving aspects of laser irradiation, cleaving, and/or bonding silicon-containing material to substrates
04/19/2012WO2011159615A3 Method and apparatus for inducing turbulent flow of a processing chamber cleaning gas
04/19/2012WO2011159081A3 Method for forming pattern, and pattern structure
04/19/2012WO2011156650A3 Low resistivity tungsten pvd with enhanced ionization and rf power coupling
04/19/2012WO2011156534A3 Multiple frequency power for plasma chamber electrode
04/19/2012WO2011156454A3 Crystallization of multi-layered amorphous films
04/19/2012WO2011156292A3 Devices for methodologies for debonding and handling semiconductor wafers
04/19/2012WO2011155985A3 Ozone plenum as uv shutter or tunable uv filter for cleaning semiconductor substrates
04/19/2012WO2011155808A3 Apparatus and method for printing process simulation
04/19/2012WO2011152625A3 Wafer polishing apparatus
04/19/2012WO2011152620A3 Electrostatic chuck and a substrate-processing device comprising the same
04/19/2012WO2011149965A3 Copper filling of through silicon vias
04/19/2012WO2011149770A3 Engineering boron-rich films lithographic mask applications
04/19/2012WO2011149616A3 Planarizing etch hardmask to increase pattern density and aspect ratio
04/19/2012WO2011149215A3 Method for preparing polycrystalline silicon thin film
04/19/2012WO2011146455A3 Multi-semiconductor material vertical memory strings, strings of memory cells having individual biasable channel regions, memory arrays incorporating such strings,and methods of accessing and forming the same
04/19/2012WO2011145858A3 Wire tool
04/19/2012WO2011145828A3 Printed circuit board including a dam for underfills, and method for manufacturing same
04/19/2012WO2011142288A9 Semiconductor device, bonded substrate, and manufacturing methods therefor
04/19/2012WO2011139124A3 Integrated semiconductor-processing apparatus
04/19/2012WO2011139061A3 Method for aligning semiconductor materials
04/19/2012WO2011137068A3 Twin chamber processing system with shared vacuum pump
04/19/2012WO2011130586A3 Improved debonding equipment and methods for debonding temporary bonded wafers
04/19/2012WO2011130397A3 Improved silicon nitride films and methods
04/19/2012WO2011129959A3 Molding windows in thin pads
04/19/2012WO2011128328A3 Preformed film
04/19/2012WO2011123291A3 Forming a compound-nitride structure that includes a nucleation layer
04/19/2012WO2011119733A3 Reduction of particle contamination produced by moving mechanisms in a process tool
04/19/2012WO2011109266A4 Method and apparatus for single step selective nitridation
04/19/2012WO2011089687A9 Silicon carbide semiconductor device and method of manufacturing same
04/19/2012US20120096006 Building a library of spectra for optical monitoring
04/19/2012US20120094505 Method for selective oxidation, device for selective oxidation, and computer-readable memory medium
04/19/2012US20120094504 Methods of forming gate dielectric material
04/19/2012US20120094503 Combinatorial plasma enhanced deposition techniques
04/19/2012US20120094502 Methods for depositing bevel protective film
04/19/2012US20120094501 Etching composition, in particular for silicon materials, method for characterizing defects on surfaces of such materials and process of treating such surfaces with the etching compostion
04/19/2012US20120094500 Dry etching method and dry etching apparatus
04/19/2012US20120094499 Method of performing an in situ chamber clean
04/19/2012US20120094498 Method for reducing punch-through defects
04/19/2012US20120094497 Method of fabricating semiconductor device
04/19/2012US20120094496 Process For Locally Dissolving The Oxide Layer In A Semiconductor-On-Insulator Type Structure
04/19/2012US20120094495 Substrate processing method
04/19/2012US20120094494 Methods for etching multi-layer hardmasks
04/19/2012US20120094493 Method of manufacturing semiconductor device and apparatus for manufacturing semiconductor device
04/19/2012US20120094492 Method of forming pattern, reticle, and computer readable medium for storing program for forming pattern
04/19/2012US20120094491 Cmp polishing liquid and polishing method
04/19/2012US20120094490 Slurry For Chemical Mechanical Polishing
04/19/2012US20120094489 Cmp compositions and methods for suppressing polysilicon removal rates
04/19/2012US20120094488 Chemical mechanical polishing process
04/19/2012US20120094487 Compositions and methods for modifying a surface suited for semiconductor fabrication
04/19/2012US20120094486 Method for creating a metal crystalline region, in particular in an integrated circuit
04/19/2012US20120094485 Method of forming contacts for a semiconductor device
04/19/2012US20120094484 Nano-tube thermal interface structure
04/19/2012US20120094483 Film forming method, film forming apparatus and method for manufacturing a semiconductor device
04/19/2012US20120094482 Microelectronic devices and methods for filing vias in microelectronic devices
04/19/2012US20120094481 Method of manufacturing airbridge
04/19/2012US20120094480 Stacked Coplanar Waveguides Having Signal and Ground Lines Extending Through Plural Layers