Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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04/12/2012 | WO2012047697A2 Pecvd oxide-nitride and oxide-silicon stacks for 3d memory application |
04/12/2012 | WO2012047695A2 Mechanically fluidized reactor systems and methods, suitable for production of silicon |
04/12/2012 | WO2012047636A2 Vacuum process chamber component and methods of making |
04/12/2012 | WO2012047571A2 Systems and methods for selective tungsten deposition in vias |
04/12/2012 | WO2012047531A2 Substrate processing system with multiple processing devices deployed in shared ambient emvironment and associated methods |
04/12/2012 | WO2012047459A2 Selective etch process for silicon nitride |
04/12/2012 | WO2012047458A2 Integrated circuit and interconnect, and method of fabricating same |
04/12/2012 | WO2012047428A2 Etch-resistant coating on sensor wafers for in-situ measurement |
04/12/2012 | WO2012047361A1 Methods for depositing germanium-containing layers |
04/12/2012 | WO2012047342A2 Methods of forming semiconductor contacts and related semiconductor devices |
04/12/2012 | WO2012047316A1 High performance carbon nano-tube composites for electrochemical energy storage devices |
04/12/2012 | WO2012047284A2 Novel process for mems scanning mirror with mass remove from mirror backside |
04/12/2012 | WO2012047035A2 Substrate processing device for supplying reaction gas through symmetry-type inlet and outlet |
04/12/2012 | WO2012047034A2 Substrate processing device equipped with semicircle shaped antenna |
04/12/2012 | WO2012047008A2 Method for manufacturing a polycrystalline silicon thin film |
04/12/2012 | WO2012046991A2 Patterning method of semiconductor and semiconductor device that contains pattern formed by patterning method |
04/12/2012 | WO2012046944A1 Film coating apparatus for semiconductor process |
04/12/2012 | WO2012046776A1 Film-formation device and film-formation method |
04/12/2012 | WO2012046737A1 Tape for wafer processing and production method for same |
04/12/2012 | WO2012046719A1 Solar cell element and method for manufacturing same |
04/12/2012 | WO2012046706A1 Method for producing dielectric thin film |
04/12/2012 | WO2012046695A1 Method for manufacturing semiconductor device |
04/12/2012 | WO2012046676A1 Epitaxial wafer, light-receiving element, optical sensor device, and method for manufacturing epitaxial wafer and light-receiving element |
04/12/2012 | WO2012046675A1 Method for manufacturing semiconductor device and semiconductor device |
04/12/2012 | WO2012046665A1 Method of evaluating systematic defect, and apparatus therefor |
04/12/2012 | WO2012046660A1 Demolding device |
04/12/2012 | WO2012046641A1 Noble metal paste for bonding of semiconductor element |
04/12/2012 | WO2012046636A1 Liquid sealing resin composition and semiconductor package |
04/12/2012 | WO2012046607A1 Pattern forming method and radiation-sensitive resin composition |
04/12/2012 | WO2012046543A1 Resist pattern formation method and radiation-sensitive resin composition |
04/12/2012 | WO2012046541A1 Exposure apparatus |
04/12/2012 | WO2012046540A1 Scanning exposure device using microlens array |
04/12/2012 | WO2012046539A1 Buffering film for multichip mounting |
04/12/2012 | WO2012046535A1 Carrier and carrying system |
04/12/2012 | WO2012046480A1 Semiconductor device and method for manufacturing same |
04/12/2012 | WO2012046478A1 Laser lift-off method and laser lift-off device |
04/12/2012 | WO2012046431A1 Defect classification system, defect classification device, and image capture device |
04/12/2012 | WO2012046418A1 Substrate plasma treatment method |
04/12/2012 | WO2012046397A1 Substrate processing device |
04/12/2012 | WO2012046365A1 Semiconductor device and method for manufacturing same |
04/12/2012 | WO2012046361A1 Manufacturing method for semiconductor device |
04/12/2012 | WO2012046360A1 Plate glass conveyance device and chamfering device provided with same |
04/12/2012 | WO2012046329A1 Semiconductor device and method of production thereof |
04/12/2012 | WO2012046179A1 Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers |
04/12/2012 | WO2012046161A1 Heat-sink device intended for at least one electronic component and corresponding method |
04/12/2012 | WO2012045981A1 Method for manufacturing a circuit |
04/12/2012 | WO2012045600A1 Electronic module and method for producing same |
04/12/2012 | WO2012045509A1 3d via capacitor with a floating conductive plate for improved reliability |
04/12/2012 | WO2012045258A1 Preparation method for semiconductor nano ring |
04/12/2012 | WO2012045257A1 Vertical channel field effect transistor and manufacturing method thereof |
04/12/2012 | WO2012045216A1 Washing method for surface damaged layer of reactive ion etching texturing of crystalline silicon |
04/12/2012 | WO2012045202A1 Discrete component backward traceability and semiconductor device forward traceability |
04/12/2012 | WO2012045113A1 Sintered device |
04/12/2012 | WO2012024033A3 Showerhead assembly with gas injection distribution devices |
04/12/2012 | WO2012021215A3 Apparatus and method for temperature control during polishing |
04/12/2012 | WO2012021197A3 Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof |
04/12/2012 | WO2012021196A3 Method for manufacturing electronic devices and electronic devices thereof |
04/12/2012 | WO2012018474A3 Wirebonding method and device enabling high-speed reverse wedge bonding of wire bonds |
04/12/2012 | WO2012018449A3 Dual plasma volume processing apparatus for neutral/ion flux control |
04/12/2012 | WO2012015656A3 Methods for depositing metal in high aspect ratio features |
04/12/2012 | WO2012012056A3 Substrate holder to reduce substrate edge stress during chemical mechanical polishing |
04/12/2012 | WO2012012052A3 Endpoint control during chemical mechanical polishing by detecting interface between different layers through selectivity change |
04/12/2012 | WO2012007522A3 Separation of master electrode and substrate in ecpr |
04/12/2012 | WO2012005957A3 Doping of zro2 for dram applications |
04/12/2012 | WO2012003341A3 Methods for forming tungsten-containing layers |
04/12/2012 | WO2012003315A3 Corrosion-resistant copper-to-aluminum bonds |
04/12/2012 | WO2012003240A3 Port door positioning apparatus and associated methods |
04/12/2012 | WO2011163149A3 Wafer dicing using femtosecond-based laser and plasma etch |
04/12/2012 | WO2011159351A3 Electrodes to improve reliability of nanoelectromechanical systems |
04/12/2012 | WO2011156669A3 Methodologies for rinsing tool surfaces in tools used to process microelectronic workpieces |
04/12/2012 | WO2011156293A3 Apparatus and methods for radio frequency switching |
04/12/2012 | WO2011148281A3 Closed chamber with fluid separation feature |
04/12/2012 | WO2011138706A3 Device for holding wafer shaped articles |
04/12/2012 | WO2011138695A3 Method for treatment of substrates and treatment composition for said method |
04/12/2012 | WO2011137216A3 Method of manufacture of chalcogenide-based photovoltaic cells |
04/12/2012 | WO2011123786A3 Selective nanoparticle assembly systems and methods |
04/12/2012 | WO2011119944A3 Method of attaching a thin die using sacrificial material to inhibit die warpage and corresponding device |
04/12/2012 | WO2011115997A3 Silicon nitride passivation layer for covering high aspect ratio features |
04/12/2012 | WO2011109811A3 Substrate clean solution for copper contamination removal |
04/12/2012 | WO2011104550A3 Method of forming and patterning conformal insulation layer in vias and etched structures |
04/12/2012 | US20120089251 Substrate handling system for aligning and orienting substrates during a transfer operation |
04/12/2012 | US20120088374 HBT and Field Effect Transistor Integration |
04/12/2012 | US20120088373 Methods of forming titanium silicon oxide |
04/12/2012 | US20120088372 Method of forming micro-pore structures or trench structures on surface of silicon wafer substrate |
04/12/2012 | US20120088371 Methods for etching substrates using pulsed dc voltage |
04/12/2012 | US20120088370 Substrate Processing System with Multiple Processing Devices Deployed in Shared Ambient Environment and Associated Methods |
04/12/2012 | US20120088369 Atomic Layer Deposition Of Photoresist Materials And Hard Mask Precursors |
04/12/2012 | US20120088368 Method of selectively removing patterned hard mask |
04/12/2012 | US20120088367 Semiconductor device and structure |
04/12/2012 | US20120088366 CMP Retaining Ring with Soft Retaining Ring Insert |
04/12/2012 | US20120088365 Technique for forming metal lines in a semiconductor by adapting the temperature dependence of the line resistance |
04/12/2012 | US20120088364 Semiconductor device and the method of manufacturing the same |
04/12/2012 | US20120088363 Method and system for forming conductive bumping with copper interconnection |
04/12/2012 | US20120088362 Thermal Compressive Bond Head |
04/12/2012 | US20120088361 Fuse part in semiconductor device and method for forming the same |
04/12/2012 | US20120088360 Methods of Fabricating Semiconductor Devices |
04/12/2012 | US20120088359 Method for manufacturing semiconductor device |
04/12/2012 | US20120088358 Methods of Forming Gates of Semiconductor Devices |
04/12/2012 | US20120088357 Method of manufacturing semiconductor device |
04/12/2012 | US20120088356 Integrated platform for in-situ doping and activation of substrates |