Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2012
04/25/2012EP2444993A1 Load lock chamber, substrate processing system and method for venting
04/25/2012EP2444972A1 Semiconductor device
04/25/2012EP2444845A1 Radiation-sensitive resin composition
04/25/2012EP2444528A2 Method and device for galvanising substrates and solar cells
04/25/2012EP2444521A1 Gas discharge structure, and device and method for plasma processing
04/25/2012EP2444433A1 Polyurethane, composition for formation of polishing layers that contains same, pad for chemical mechanical polishing, and chemical mechanical polishing method using same
04/25/2012EP2444164A1 Method for applying liquid material, and apparatus and program for same
04/25/2012EP2443659A2 Vertical junction field effect transistors and diodes having graded doped regions and methods of making
04/25/2012EP2443658A2 Methods of making vertical junction field effect transistors and bipolar junction transistors without ion implantation and devices made therewith
04/25/2012EP2443653A1 Crack reduction at metal/organic dielectric interface
04/25/2012EP2443651A2 Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks
04/25/2012EP2443650A1 Thermolabile precursor compounds for improving the interparticulate contact points and for filling the interspaces in semiconductive metal oxide particle layers
04/25/2012EP2443649A1 Process module for the inline-treatment of substrates
04/25/2012EP2443631A1 Sub-critical shear thinning group iv based nanoparticle fluid
04/25/2012EP2443517A1 Spectral purity filter, lithographic apparatus, and method for manufacturing a spectral purity filter
04/25/2012EP2443513A1 Pattern forming method, chemical amplification resist composition and resist film
04/25/2012EP2443440A2 Euv high throughput inspection system for defect detection on patterned euv masks, mask blanks, and wafers
04/25/2012EP2294609B1 Interfacial layer regrowth control in high-k gate structure for field effect transistor
04/25/2012EP2106426B1 Composition for polishing surface made of silicon dioxide
04/25/2012EP2102902B1 Handling tool for components, in particular electronic components
04/25/2012EP2065924B1 Silicon wafer heat treatment method
04/25/2012EP1979948B1 Manufacturing method for thin film transistor
04/25/2012EP1964162B1 Rotary chip attach
04/25/2012EP1925192B1 Laminated substrate for mounting electronic parts
04/25/2012EP1552342B1 Composition and method for removing etching residue
04/25/2012EP1393132B1 Exposure control for phase shifting photolithographic masks
04/25/2012EP0970518B1 Trench-isolated bipolar devices
04/25/2012CN202205804U 直驱式固晶机的摆臂机构 Bonder direct-drive swing arm mechanism
04/25/2012CN202205799U Double-layer lifting and conveying platform used on thin-film solar cell product line
04/25/2012CN202205798U 一种硅片推送装置 One kind of device wafers push
04/25/2012CN202205727U 吸嘴装置 Suction device
04/25/2012CN202205726U 石英舟和夹具 Quartz boat and fixtures
04/25/2012CN202205725U 提高硅片背封时硅片厚度均匀性的托盘 When silicon wafers back closure improve thickness uniformity of the tray
04/25/2012CN202205724U 贴片机用天线固定平台 Mounter antenna fixed platform
04/25/2012CN202205723U 蚀刻装置 Etching apparatus
04/25/2012CN202205722U Supersonic wave binding amplitude transformer having stress releasing structure
04/25/2012CN202205721U 硅片的自动刷洗装置 Automatic brushing device wafers
04/25/2012CN202205720U 标准机械接口装置 Standard mechanical interface device
04/25/2012CN202205719U 带有除尘装置的固化加热设备 Curing heating equipment with dust removal device
04/25/2012CN202205718U 烘干机 Dryer
04/25/2012CN202205717U 一种晶圆冷却装置 One kind of wafer cooling device
04/25/2012CN202205699U 一种用于等离子体蚀刻室的边环装置部件 A side ring device components for plasma etch chamber
04/25/2012CN202204598U Sensor component and infrared sensor
04/25/2012CN202201969U 一种反应腔室及应用该反应腔室的等离子体加工设备 A reaction to the reaction chamber and application of plasma processing equipment chamber
04/25/2012CN202200263U 柔性连接管安装工具 Flexible connection pipe installation tool
04/25/2012CN202200170U 研磨头及化学机械研磨设备 A polishing head and a chemical mechanical polishing apparatus
04/25/2012CN202200167U 研磨垫 Abrasive pad
04/25/2012CN1967273B 诊断电路及其方法 Diagnostic circuit and method
04/25/2012CN1958878B Method of using film formation apparatus
04/25/2012CN1945444B 对光刻衬底上的正色调抗蚀剂层进行构图的方法 Of positive tone resist layer on a substrate by a photolithography patterning method
04/25/2012CN1909245B 具有改善的开态电阻和击穿电压性能的半导体结构 Semiconductor structure having an improved on-resistance and breakdown voltage performance
04/25/2012CN1881611B 具有槽型结构的半导体器件及其制造方法 The method of manufacturing a semiconductor device and groove structure
04/25/2012CN1863740B 划线头和使用该划线头的划线装置以及划线方法 Scribing head and using the scribing head scribing apparatus and method for scribing
04/25/2012CN1826694B Nanowhiskers with PN junctions and methods of fabricating thereof
04/25/2012CN1826397B 用于化学机械抛光的二氧化铈研磨剂 Ceria abrasive for chemical mechanical polishing
04/25/2012CN1786831B Lithographic projection apparatus and actuator
04/25/2012CN1783427B Temperature-compensated resistor and fabrication method therefor
04/25/2012CN1701417B Substrate-processing apparatus and method of producing semiconductor device
04/25/2012CN1685599B Electrostatic holding device
04/25/2012CN1606145B Particle sticking prevention apparatus and plasma processing apparatus
04/25/2012CN102428762A 等离子体处理装置 The plasma processing apparatus
04/25/2012CN102428556A 具有用于所有阱间和阱内隔离的深沟槽隔离区并且具有到达相邻装置扩散区和下面的浮置阱区之间的结的共享接触的集成电路装置 All inter-integrated circuit having means for isolating the well and well within the trench isolation region and the deep junction with a shared diffusion region to the adjoining devices and the underlying floating contact with the well region between the
04/25/2012CN102428555A 半导体基板、半导体基板的制造方法及电子器件 The method of manufacturing an electronic device and a semiconductor substrate, a semiconductor substrate,
04/25/2012CN102428554A Method For Providing Electrical Connections To Spaced Conductive Lines
04/25/2012CN102428553A Method and Apparatus for Providing Through Silicon VIA (TSV) Redundancy
04/25/2012CN102428552A 卡匣 Cassettes
04/25/2012CN102428551A A metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom
04/25/2012CN102428550A Semiconductor switch device and method for manufacturing semiconductor switch device
04/25/2012CN102428549A 具有取代栅极结构的场效应晶体管及其制造方法 Substituent having a field effect transistor gate structure and a manufacturing method
04/25/2012CN102428548A Scaling of bipolar transistors
04/25/2012CN102428547A Fine-processing agent and fine-processing method
04/25/2012CN102428546A 改进基底中斜面蚀刻重复性的装置和方法 Improved apparatus and method for etching the substrate bevel repeatability
04/25/2012CN102428545A 等离子体处理装置以及器件的制造方法 The method of manufacturing a plasma processing apparatus and the device
04/25/2012CN102428544A 凹凸图案形成方法 Concavo-convex pattern forming method
04/25/2012CN102428543A Techniques for processing a substrate
04/25/2012CN102428542A 处理基板的技术 Processing board
04/25/2012CN102428541A Techniques for processing a substrate
04/25/2012CN102428540A 用于对硅片进行掺硼的方法 Boron-doped silicon wafer method for
04/25/2012CN102428539A 超细晶粒多晶硅薄膜的气相沉积方法 Vapor deposition of ultra-fine grain polysilicon thin film
04/25/2012CN102428519A Method for driving semiconductor storage device
04/25/2012CN102428375A Structure having chip mounted thereon and module provided with the structure
04/25/2012CN102428209A Film-forming method and film-forming apparatus
04/25/2012CN102428046A Method for producing tio2-sio2 glass body, method for heat-treating tio2-sio2 glass body, tio2-sio2 glass body, and optical base for euvl
04/25/2012CN102427916A 用于保持半导体衬底的保持设备 For holding a semiconductor substrate holding device
04/25/2012CN102427084A 氮化镓基高电子迁移率晶体管及制作方法 GaN-based high electron mobility transistor and manufacturing method
04/25/2012CN102427083A 一种疏水疏油表面微结构及其制备方法 A hydrophobic oleophobic surface microstructure and its preparation method
04/25/2012CN102427080A 一种多量子阱tft-led阵列显示基板及其制造方法 A multi-quantum well tft-led array display board and its manufacturing method
04/25/2012CN102427069A 一种电路封装结构及封装方法 A circuit package and packaging method
04/25/2012CN102427068A Monolithical integration lattice mismatched crystal template and manufacturing method thereof
04/25/2012CN102427067A 一种无电容动态随机存储单元及其制作方法与存储方法 A non-capacitor dynamic random access memory cell and its production method and storage method
04/25/2012CN102427066A Cmos一次性可编程只读存储器及其制造方法 Cmos one-time programmable read-only memory and manufacturing method thereof
04/25/2012CN102427065A 一种基于栅致漏极泄漏效应的1t-dram的制备方法 A gate-induced drain leakage effects of the preparation method based 1t-dram
04/25/2012CN102427064A 后栅极两晶体管零电容动态随机存储器的制备方法 After preparation of the gate two transistor zero capacitor dynamic random access memory
04/25/2012CN102427063A 一种抑制cmos短沟道效应的方法 A method of inhibiting the short channel effect cmos methods
04/25/2012CN102427062A 自对准沟道掺杂抑制cmos短沟道效应及其制备方法 Cmos inhibit self-aligned channel doping short channel effects and its preparation method
04/25/2012CN102427061A 有源矩阵有机发光显示器的阵列基板制造方法 The method of manufacturing an active matrix array substrate, an organic light emitting display
04/25/2012CN102427060A 一种双镶嵌结构的形成方法 The method for forming a dual damascene structure
04/25/2012CN102427059A 一种提高阻挡层与金属层的粘结性的方法 A barrier layer and a metal layer, a method to improve the adhesion of
04/25/2012CN102427058A 通过溅射工艺制作线路图形的方法和芯片的重新布线方法 By rewiring sputtering fabrication method and line graphics chips
04/25/2012CN102427057A 存储器字线高度的控制方法 Height control method memory word line
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