Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2012
04/25/2012CN101399172B 基板处理装置以及基板处理方法 The substrate processing apparatus and a substrate processing method
04/25/2012CN101388332B 保护带剥离方法及保护带剥离装置 Protective tape stripping method and protective tape peeling device
04/25/2012CN101356643B 半导体器件 Semiconductor devices
04/25/2012CN101354514B Liquid crystal display device and electronic device provided with the same
04/25/2012CN101352844B 用于化学机械抛光的抛光垫及应用其的化学机械抛光方法 Used in the chemical mechanical polishing pad and polishing applications thereof The chemical mechanical polishing method
04/25/2012CN101350331B Method for manufacturing display device
04/25/2012CN101339952B Solid-state imaging device and method for fabricating the same
04/25/2012CN101325160B 半导体处理用的成膜方法和装置 Forming a semiconductor processing method and apparatus used in
04/25/2012CN101310383B Enhancing shock resistance in semiconductor packages
04/25/2012CN101308783B 半导体衬底、半导体装置、以及其制造方法 A semiconductor substrate, a semiconductor device and a manufacturing method thereof
04/25/2012CN101308100B 外观检查装置 Appearance inspection device
04/25/2012CN101302610B 具有覆盖钇铝层的部件的处理腔 A cover member having a layer of yttrium aluminum processing chamber
04/25/2012CN101292334B 源极区和漏极区之间具有box层的应变硅mos器件 Strained silicon mos devices with box layer between the source region and a drain region
04/25/2012CN101291785B 薄片切断用工作台 Sheet cutting table
04/25/2012CN101276775B 载置台的表面处理方法 The surface treatment method of the stage
04/25/2012CN101276746B Surface treatment method, etching treatment method and manufacturing method of electronic apparatus
04/25/2012CN101213058B 用于减小硅晶片之间吸引力的方法和试剂 For reducing the attraction between the silicon wafers methods and reagents
04/25/2012CN101207050B Light emitting device package and method for manufacturing the same
04/25/2012CN101172332B Polishing pads useful for endpoint detection in chemical mechanical polishing
04/25/2012CN101118841B 半导体处理用的热处理装置 Heat treatment apparatus used in semiconductor processing
04/25/2012CN101112789B Process of production of patterned structure
04/25/2012CN101103089B Polishing slurries and methods for chemical mechanical polishing
04/25/2012CN101100018B 激光加工方法和芯片 The laser processing method and the chip
04/25/2012CN101093811B 具有双温度区的静电吸盘的衬底支架 A substrate holder having an electrostatic chuck of the dual temperature zones
04/25/2012CN101071791B 晶片的分割方法及分割装置 Segmentation of the wafer and dividing means
04/25/2012CN101064258B 高取向性硅薄膜形成方法、三维半导体器件及其制造方法 The highly oriented silicon film forming method, three-dimensional semiconductor device and its manufacturing method
04/25/2012CN101045500B 具有可动导轨的真空传送装置 Vacuum transfer apparatus having a movable rail
04/24/2012USRE43326 Tap connections for circuits with leakage suppression capability
04/24/2012USRE43320 Semiconductor device and manufacturing method thereof
04/24/2012US8165715 Substrate processing system, substrate detecting apparatus, and substrate detecting method
04/24/2012US8165710 Polishing method, polishing apparatus, and program for controlling polishing apparatus
04/24/2012US8164984 Time piece with LED light means
04/24/2012US8164879 Step down dechucking
04/24/2012US8164727 Liquid crystal display with refractive index matched electrodes
04/24/2012US8164668 Photoelectric conversion device and image capturing system
04/24/2012US8164355 Electronic component pressing device and electronic component test apparatus
04/24/2012US8164193 Metal wiring of semiconductor device and forming method thereof
04/24/2012US8164188 Methods of forming solder connections and structure thereof
04/24/2012US8164186 BGA semiconductor device having a dummy bump
04/24/2012US8164181 Semiconductor device packaging structure
04/24/2012US8164175 Stackable semiconductor device assemblies
04/24/2012US8164166 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device
04/24/2012US8164165 Wafer-to-wafer stack with supporting pedestal
04/24/2012US8164161 Structure of trench capacitor and method for manufacturing the same
04/24/2012US8164158 Semiconductor device and method of forming integrated passive device
04/24/2012US8164156 Fuse structure for high integrated semiconductor device
04/24/2012US8164155 Semiconductor device and method of manufacturing the same
04/24/2012US8164146 Substrate symmetrical silicide source/drain surrounding gate transistor
04/24/2012US8164144 Semiconductor device and manufacturing method thereof
04/24/2012US8164142 Semiconductor device and method of manufacturing semiconductor device
04/24/2012US8164137 Multiple-gate MOS transistor using Si substrate and method of manufacturing the same
04/24/2012US8164122 Thin film field effect transistor with dual semiconductor layers
04/24/2012US8164120 Semiconductor device with capacitor and fuse and its manufacture
04/24/2012US8164115 Nitride semiconductor device
04/24/2012US8164108 Light emitting diode chip and manufacturing method thereof
04/24/2012US8164105 Light emitting device and method for fabricating the same
04/24/2012US8164099 Display device and manufacturing method thereof
04/24/2012US8164083 Quantum dot optoelectronic devices with enhanced performance
04/24/2012US8163836 Adhesive composition and adhesive film
04/24/2012US8163660 SONOS type stacks for nonvolatile change trap memory devices and methods to form the same
04/24/2012US8163659 Method for oxide film formation and apparatus for the method
04/24/2012US8163658 Multiple patterning using improved patternable low-k dielectric materials
04/24/2012US8163657 Process for adjusting the size and shape of nanostructures
04/24/2012US8163656 Process for adjusting the size and shape of nanostructures
04/24/2012US8163655 Method for forming a sacrificial sandwich structure
04/24/2012US8163654 Method for fabricating fine pattern in semiconductor device
04/24/2012US8163653 Semiconductor device and method of manufacturing the same
04/24/2012US8163652 Plasma processing method and plasma processing device
04/24/2012US8163651 Method of fabricating semiconductor substrate by use of heterogeneous substrate and recycling heterogeneous substrate during fabrication thereof
04/24/2012US8163650 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same
04/24/2012US8163649 Copper interconnection structure, semiconductor device, and method for forming copper interconnection structure
04/24/2012US8163648 Atomic layer deposition methods
04/24/2012US8163647 Method for growing carbon nanotubes, and electronic device having structure of ohmic connection to carbon element cylindrical structure body and production method thereof
04/24/2012US8163646 Interconnection wiring structure of a semiconductor device and method for manufacturing same
04/24/2012US8163645 Method for providing a redistribution metal layer in an integrated circuit
04/24/2012US8163644 Template process for small pitch flip-chip interconnect hybridization
04/24/2012US8163643 Enhanced pad design for solder attach devices
04/24/2012US8163642 Package substrate with dual material build-up layers
04/24/2012US8163641 System for modifying small structures
04/24/2012US8163640 Metal gate compatible electrical fuse
04/24/2012US8163639 Photo diode and method for manufacturing the same
04/24/2012US8163638 Back side contact solar cell structures and fabrication processes
04/24/2012US8163637 Forming impurity regions in silicon carbide devices
04/24/2012US8163636 Method of preparing P-type doped ZnO or ZnMgO
04/24/2012US8163635 Manufacturing method of semiconductor device
04/24/2012US8163634 Devices with graphene layers
04/24/2012US8163633 Light-emitting nanoparticles and method of making same
04/24/2012US8163632 Irradiation with high energy ions for surface structuring and treatment of surface proximal sections of optical elements
04/24/2012US8163631 Methods for discretized processing and process sequence integration of regions of a substrate
04/24/2012US8163630 Method of manufacturing a semiconductor device
04/24/2012US8163629 Metallization for chip scale packages in wafer level packaging
04/24/2012US8163628 Method for manufacturing semiconductor substrate
04/24/2012US8163627 Method of forming isolation layer of semiconductor device
04/24/2012US8163626 Enhancing NAND flash floating gate performance
04/24/2012US8163625 Method for fabricating an isolation structure
04/24/2012US8163624 Discrete semiconductor device and method of forming sealed trench junction termination
04/24/2012US8163623 Using a mesh to form a lower electrode in a capacitor
04/24/2012US8163622 Method for angular doping of source and drain regions for odd and even NAND blocks
04/24/2012US8163621 High performance LDMOS device having enhanced dielectric strain layer
04/24/2012US8163620 Method for etching Mo-based metal gate stack with aluminium nitride barrier
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