Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2012
04/12/2012US20120086000 Thin film element, semiconductor device, and method for manufacturing the same
04/12/2012US20120085991 Graphene nanoribbons, method of fabrication and their use in electronic devices
04/12/2012US20120085985 Electrically actuated device
04/12/2012US20120085959 Use of unsaturated hydrofluorocarbons
04/12/2012US20120085936 Method for monitoring ion implantation
04/12/2012US20120085278 High productivity thin film deposition method and system
04/12/2012DE19616970B4 Verfahren zur Herstellung von mikromechanische Strukturen aufweisenden Halbleiterbauelementen A process for producing micromechanical structures having semiconductor devices
04/12/2012DE112005001713B4 Verfahren zum Ätzen und Herstellen einer Mikrospiegelvorrichtung A method of etching and producing a micromirror device
04/12/2012DE102011084058A1 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
04/12/2012DE102011084014A1 Integrierte Schaltungen mit Magnetkerninduktoren und Verfahren zum Herstellen derselben Integrated circuits and methods for manufacturing the same Magnetkerninduktoren
04/12/2012DE102011079105A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
04/12/2012DE102011076845A1 Niedrigtemperaturbindeverfahren Low temperature bonding method
04/12/2012DE102011054377A1 Herstellung einer Vorrichtung mit einem Halbleiterchip Preparing a device having a semiconductor chip
04/12/2012DE102010052444A1 Substrat mit texturierter Frontelektrodenschicht für eine Dünnschichtsolarzelle Substrate with a textured front electrode layer for a thin film solar cell
04/12/2012DE102010048909A1 Prozessmaschine, insbesondere zum Bearbeiten und/oder Inspizieren von Substraten Process machine, especially for editing and / or inspecting substrates
04/12/2012DE102010042246A1 Verfahren und Vorrichtung zur Herstellung von scheibenförmigen Elementen, insbesondere Wafern Method and apparatus for the production of disc-shaped elements, in particular wafers
04/12/2012DE102010042229A1 Höhere Integrität eines Gatestapels mit großem ε durch Erzeugen einer gesteuerten Unterhöhlung auf der Grundlage einer Nasschemie Greater integrity of a gate stack with large ε by generating a controlled undercut on the basis of a wet chemistry
04/12/2012DE102010042168A1 Elektronische Baugruppe sowie Verfahren zu deren Herstellung An electronic assembly as well as processes for their preparation
04/12/2012DE102010042040A1 Method for material removal processing of sides of semiconductor wafers in e.g. microelectronics, involves bringing side of wafer in contact with sandpaper, so that material removal from side of wafer is caused in processing step
04/12/2012DE102010040060B4 Oxidabscheidung unter Anwendung eines Doppelbeschichtungsverfahrens zur Verringerung der Strukturdichtenabhängigkeit in komplexen Halbleiterbauelementen Oxide deposition using a double coating procedure to reduce the structural sealant dependence in complex semiconductor devices
04/12/2012DE102010038130A1 Dickdraht-Bondanordnung und Verfahren zum Herstellen Thick wire bonding arrangement and method for producing
04/12/2012DE102010038037A1 Device for erosive material machining of workpiece, has workpiece machining channel that penetrates tool holding surface within nozzle rings, and workpiece support operated to support workpiece along surface
04/12/2012DE102010038035A1 Device for processing workpiece e.g. vacuum chip board, has nozzle rings that are arranged on retaining surface of holder element at acute angle direction, for discharging processed workpiece materials through channel of nozzle ring
04/12/2012DE102009046246B4 Herstellverfahren und Halbleiterbauelement mit Verformungstechnologie in dreidimensionalen Transistoren auf der Grundlage global verformter Halbleiterbasisschichten Manufacturing processes and semiconductor device with deformation technology in three-dimensional transistors based on globally deformed semiconductor base layers
04/12/2012DE102008063399B4 Asymmetrischer Transistor mit einer eingebetteten Halbleiterlegierung mit einer asymmetrischen Anordnung und Verfahren zur Herstellung des Transistors Asymmetric transistor having an embedded semiconductor alloy with an asymmetrical arrangement and method for manufacturing the transistor
04/12/2012DE102007004284B4 Halbleiterleistungsmodul The semiconductor power module
04/12/2012DE102005063335B4 Modell für eine fortschrittliche Prozesssteuerung, das eine Solloffsetgröße umfaßt Model for advanced process control, comprising a target offset size
04/12/2012DE10032210B4 Kondensator für Halbleiterspeicherbauelement und Verfahren zu dessen Herstellung Capacitor for the semiconductor memory device and method for its production
04/12/2012CA2813884A1 Mechanically fluidized reactor systems and methods, suitable for production of silicon
04/12/2012CA2813668A1 Solar cell element and method for manufacturing same
04/11/2012EP2439802A1 Organic thin film transistor, surface light source and display device
04/11/2012EP2439777A1 Tunnel field effect transistor
04/11/2012EP2439773A1 Conveying system having endless drive medium, method for identifying carrier thereof, and carrier
04/11/2012EP2439772A1 Conveying system having endless drive medium and conveying method
04/11/2012EP2439771A1 Conveying system having endless drive medium and method for delivering/receiving article therein
04/11/2012EP2439770A2 Module for stacking thin panels and method of stacking thin panels
04/11/2012EP2439769A1 Apparatus with multiple heating systems for in-line thermal treatment of substrates
04/11/2012EP2439768A1 Fixed-abrasive-grain machining apparatus, fixed-abrasive-grain machining method, and semiconductor-wafer manufacturing method
04/11/2012EP2439767A1 Surface treatment composition, surface treatment method, and method for manufacturing semiconductor device
04/11/2012EP2439766A1 Method of forming micro-pore structures or trench structures on surface of silicon wafer substrate
04/11/2012EP2439590A1 Radiation-sensitive resin composition, polymer and method for forming resist pattern
04/11/2012EP2439583A1 Transmissive liquid crystal display using CMOS technology with auxiliary storage capacity
04/11/2012EP2439316A1 Nitride semiconductor crystal and method for manufacturing same
04/11/2012EP2439248A2 Chemical-mechanical polishing slurry composition comprising nonionized heat-activated nanocatalyst, and polishing method using same
04/11/2012EP2439154A1 Conveyance vehicle system
04/11/2012EP2439150A1 Package body for storing or transporting solar cell sealing film and method for storing or transporting solar cell sealing film
04/11/2012EP2438619A1 Apparatus and method to fabricate an electronic device
04/11/2012EP2438615A2 Anti-reflective coating for sensors suitable for high throughput inspection systems
04/11/2012EP2438611A2 High voltage insulated gate bipolar transistors with minority carrier diverter
04/11/2012EP2438610A1 Encapsulation process and structure for electronic devices
04/11/2012EP2438609A2 Corrosion-resistant cmp conditioning tools and methods for making and using same
04/11/2012EP2438608A2 Silicon pen nanolithography
04/11/2012EP2438459A1 Radar sensor with interference signal compensation
04/11/2012EP2438432A1 Integrated optoelectrochemical sensor for nitrogen oxides in gaseous samples
04/11/2012EP2438396A1 Monitoring device and method for in situ measuring wafer thicknesses for monitoring a thinning of semiconductor wafers and thinning device comprising a wet etching unit and a monitoring device
04/11/2012EP1990432B1 Semiconductor device, its manufacturing method, and sputtering target material for use in the method
04/11/2012EP1933374B1 Substrate cleaning apparatus, substrate cleaning method, substrate cleaning program and program recording medium
04/11/2012EP1872394B1 Substrate processing apparatus
04/11/2012EP1847834B1 Interposer, probe card and method for manufacturing interposer
04/11/2012EP1844883B1 Silver particle powder and process for producing the same
04/11/2012EP1807865B1 Polishing apparatus
04/11/2012EP1782464B1 Manufacturing method for semiconductor devices
04/11/2012EP1714730B1 Method of manufacturing by laser workpieces
04/11/2012EP1679541B1 Specimen observation method and microscope, and, for use therein, solid immersion lens and optical contact liquid
04/11/2012EP1586007B1 Electron beam processing for mask repair
04/11/2012EP1546028B1 Method for selectively covering a micro machined surface
04/11/2012EP1535332B1 Semiconductor device including a field effect transistor and a passive capacitor having reduced leakage current and an improved capacitance per unit area
04/11/2012EP1469953B1 Megasonic probe energy director
04/11/2012EP1299824B1 Convergence technique for model-based optical and proximity correction
04/11/2012EP1094921B1 Transferring substrates with different holding end effectors
04/11/2012CN202189836U 激光刻蚀oled显示器阳极薄膜材料的装置 Oled display device anode laser etching of thin film materials
04/11/2012CN202189824U 一种玻璃钢载板 A glass steel carrier plate
04/11/2012CN202189823U 一种硅片移动装置 One kind of mobile device wafers
04/11/2012CN202189822U 一种太阳能硅片的裂片工具 A solar wafers lobes Tools
04/11/2012CN202189821U 一种太阳能硅片的夹持工具 A solar wafer gripping tool
04/11/2012CN202189820U 一种太阳能硅片真空夹持吸盘 A solar wafers vacuum clamping chuck
04/11/2012CN202189819U 一种太阳能硅片存放盘 A solar wafers stored in disk
04/11/2012CN202189818U 一种太阳能硅片输送缓冲结构 A solar wafer transport buffer structure
04/11/2012CN202189817U 一种硅片输送升降结构 Transporting silicon wafers lifting structure
04/11/2012CN202189814U 一种太阳能硅片盒 A solar wafers box
04/11/2012CN202189812U 一种鼓泡分片设备 One kind of bubbling slicing equipment
04/11/2012CN202189777U 一种散热结构及其制备装置 A heat sink structure and preparation device
04/11/2012CN202189773U 一种太阳能电池片等离子刻蚀用夹具 A solar cells, plasma etching jig
04/11/2012CN202189772U 晶圆固定装置 Wafer fixtures
04/11/2012CN202189771U 一种硅片加工卡具 One kind of Wafer Processing fixtures
04/11/2012CN202189770U 一种硅片传送机的取片和定位装置 Positioning means to take a wafer sheet and the conveyor
04/11/2012CN202189769U 一种硅片与硅片的加工模具 One kind of silicon and silicon wafer processing mold
04/11/2012CN202189768U 晶圆取放手臂机构 Wafer handling arm mechanism
04/11/2012CN202189767U 一种可调节液晶片承载架 An adjustable LCD chip carrier
04/11/2012CN202189766U 半导体封装传递料盒 The semiconductor package delivery pod
04/11/2012CN202189765U 一种硅片的承载装置 A silicon wafer carrying device
04/11/2012CN202189764U 一种硅片容器 One kind of silicon container
04/11/2012CN202189763U 一种硅片架 One kind of silicon frame
04/11/2012CN202189762U 一种太阳能硅片外观检测设备 A solar wafers visual inspection equipment
04/11/2012CN202189761U Discharging device for integrated circuit package mold
04/11/2012CN202189760U 半导体器件塑封抽真空装置 The semiconductor device of plastic vacuum means
04/11/2012CN202189759U 一种半导体封装切脚成型用模具装置 A semiconductor package device molding die cut legs
04/11/2012CN202189758U 一种硅片装载自动提升装置 One kind of wafer loading automatic lifting device
04/11/2012CN202189757U 一种硅片的粘接设备 One kind of wafer bonding equipment
04/11/2012CN202189756U 一种硅片切割前排列硅片的基片 An arrangement of the silicon wafer substrate before cutting