Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
---|
04/12/2012 | US20120086000 Thin film element, semiconductor device, and method for manufacturing the same |
04/12/2012 | US20120085991 Graphene nanoribbons, method of fabrication and their use in electronic devices |
04/12/2012 | US20120085985 Electrically actuated device |
04/12/2012 | US20120085959 Use of unsaturated hydrofluorocarbons |
04/12/2012 | US20120085936 Method for monitoring ion implantation |
04/12/2012 | US20120085278 High productivity thin film deposition method and system |
04/12/2012 | DE19616970B4 Verfahren zur Herstellung von mikromechanische Strukturen aufweisenden Halbleiterbauelementen A process for producing micromechanical structures having semiconductor devices |
04/12/2012 | DE112005001713B4 Verfahren zum Ätzen und Herstellen einer Mikrospiegelvorrichtung A method of etching and producing a micromirror device |
04/12/2012 | DE102011084058A1 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device |
04/12/2012 | DE102011084014A1 Integrierte Schaltungen mit Magnetkerninduktoren und Verfahren zum Herstellen derselben Integrated circuits and methods for manufacturing the same Magnetkerninduktoren |
04/12/2012 | DE102011079105A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same |
04/12/2012 | DE102011076845A1 Niedrigtemperaturbindeverfahren Low temperature bonding method |
04/12/2012 | DE102011054377A1 Herstellung einer Vorrichtung mit einem Halbleiterchip Preparing a device having a semiconductor chip |
04/12/2012 | DE102010052444A1 Substrat mit texturierter Frontelektrodenschicht für eine Dünnschichtsolarzelle Substrate with a textured front electrode layer for a thin film solar cell |
04/12/2012 | DE102010048909A1 Prozessmaschine, insbesondere zum Bearbeiten und/oder Inspizieren von Substraten Process machine, especially for editing and / or inspecting substrates |
04/12/2012 | DE102010042246A1 Verfahren und Vorrichtung zur Herstellung von scheibenförmigen Elementen, insbesondere Wafern Method and apparatus for the production of disc-shaped elements, in particular wafers |
04/12/2012 | DE102010042229A1 Höhere Integrität eines Gatestapels mit großem ε durch Erzeugen einer gesteuerten Unterhöhlung auf der Grundlage einer Nasschemie Greater integrity of a gate stack with large ε by generating a controlled undercut on the basis of a wet chemistry |
04/12/2012 | DE102010042168A1 Elektronische Baugruppe sowie Verfahren zu deren Herstellung An electronic assembly as well as processes for their preparation |
04/12/2012 | DE102010042040A1 Method for material removal processing of sides of semiconductor wafers in e.g. microelectronics, involves bringing side of wafer in contact with sandpaper, so that material removal from side of wafer is caused in processing step |
04/12/2012 | DE102010040060B4 Oxidabscheidung unter Anwendung eines Doppelbeschichtungsverfahrens zur Verringerung der Strukturdichtenabhängigkeit in komplexen Halbleiterbauelementen Oxide deposition using a double coating procedure to reduce the structural sealant dependence in complex semiconductor devices |
04/12/2012 | DE102010038130A1 Dickdraht-Bondanordnung und Verfahren zum Herstellen Thick wire bonding arrangement and method for producing |
04/12/2012 | DE102010038037A1 Device for erosive material machining of workpiece, has workpiece machining channel that penetrates tool holding surface within nozzle rings, and workpiece support operated to support workpiece along surface |
04/12/2012 | DE102010038035A1 Device for processing workpiece e.g. vacuum chip board, has nozzle rings that are arranged on retaining surface of holder element at acute angle direction, for discharging processed workpiece materials through channel of nozzle ring |
04/12/2012 | DE102009046246B4 Herstellverfahren und Halbleiterbauelement mit Verformungstechnologie in dreidimensionalen Transistoren auf der Grundlage global verformter Halbleiterbasisschichten Manufacturing processes and semiconductor device with deformation technology in three-dimensional transistors based on globally deformed semiconductor base layers |
04/12/2012 | DE102008063399B4 Asymmetrischer Transistor mit einer eingebetteten Halbleiterlegierung mit einer asymmetrischen Anordnung und Verfahren zur Herstellung des Transistors Asymmetric transistor having an embedded semiconductor alloy with an asymmetrical arrangement and method for manufacturing the transistor |
04/12/2012 | DE102007004284B4 Halbleiterleistungsmodul The semiconductor power module |
04/12/2012 | DE102005063335B4 Modell für eine fortschrittliche Prozesssteuerung, das eine Solloffsetgröße umfaßt Model for advanced process control, comprising a target offset size |
04/12/2012 | DE10032210B4 Kondensator für Halbleiterspeicherbauelement und Verfahren zu dessen Herstellung Capacitor for the semiconductor memory device and method for its production |
04/12/2012 | CA2813884A1 Mechanically fluidized reactor systems and methods, suitable for production of silicon |
04/12/2012 | CA2813668A1 Solar cell element and method for manufacturing same |
04/11/2012 | EP2439802A1 Organic thin film transistor, surface light source and display device |
04/11/2012 | EP2439777A1 Tunnel field effect transistor |
04/11/2012 | EP2439773A1 Conveying system having endless drive medium, method for identifying carrier thereof, and carrier |
04/11/2012 | EP2439772A1 Conveying system having endless drive medium and conveying method |
04/11/2012 | EP2439771A1 Conveying system having endless drive medium and method for delivering/receiving article therein |
04/11/2012 | EP2439770A2 Module for stacking thin panels and method of stacking thin panels |
04/11/2012 | EP2439769A1 Apparatus with multiple heating systems for in-line thermal treatment of substrates |
04/11/2012 | EP2439768A1 Fixed-abrasive-grain machining apparatus, fixed-abrasive-grain machining method, and semiconductor-wafer manufacturing method |
04/11/2012 | EP2439767A1 Surface treatment composition, surface treatment method, and method for manufacturing semiconductor device |
04/11/2012 | EP2439766A1 Method of forming micro-pore structures or trench structures on surface of silicon wafer substrate |
04/11/2012 | EP2439590A1 Radiation-sensitive resin composition, polymer and method for forming resist pattern |
04/11/2012 | EP2439583A1 Transmissive liquid crystal display using CMOS technology with auxiliary storage capacity |
04/11/2012 | EP2439316A1 Nitride semiconductor crystal and method for manufacturing same |
04/11/2012 | EP2439248A2 Chemical-mechanical polishing slurry composition comprising nonionized heat-activated nanocatalyst, and polishing method using same |
04/11/2012 | EP2439154A1 Conveyance vehicle system |
04/11/2012 | EP2439150A1 Package body for storing or transporting solar cell sealing film and method for storing or transporting solar cell sealing film |
04/11/2012 | EP2438619A1 Apparatus and method to fabricate an electronic device |
04/11/2012 | EP2438615A2 Anti-reflective coating for sensors suitable for high throughput inspection systems |
04/11/2012 | EP2438611A2 High voltage insulated gate bipolar transistors with minority carrier diverter |
04/11/2012 | EP2438610A1 Encapsulation process and structure for electronic devices |
04/11/2012 | EP2438609A2 Corrosion-resistant cmp conditioning tools and methods for making and using same |
04/11/2012 | EP2438608A2 Silicon pen nanolithography |
04/11/2012 | EP2438459A1 Radar sensor with interference signal compensation |
04/11/2012 | EP2438432A1 Integrated optoelectrochemical sensor for nitrogen oxides in gaseous samples |
04/11/2012 | EP2438396A1 Monitoring device and method for in situ measuring wafer thicknesses for monitoring a thinning of semiconductor wafers and thinning device comprising a wet etching unit and a monitoring device |
04/11/2012 | EP1990432B1 Semiconductor device, its manufacturing method, and sputtering target material for use in the method |
04/11/2012 | EP1933374B1 Substrate cleaning apparatus, substrate cleaning method, substrate cleaning program and program recording medium |
04/11/2012 | EP1872394B1 Substrate processing apparatus |
04/11/2012 | EP1847834B1 Interposer, probe card and method for manufacturing interposer |
04/11/2012 | EP1844883B1 Silver particle powder and process for producing the same |
04/11/2012 | EP1807865B1 Polishing apparatus |
04/11/2012 | EP1782464B1 Manufacturing method for semiconductor devices |
04/11/2012 | EP1714730B1 Method of manufacturing by laser workpieces |
04/11/2012 | EP1679541B1 Specimen observation method and microscope, and, for use therein, solid immersion lens and optical contact liquid |
04/11/2012 | EP1586007B1 Electron beam processing for mask repair |
04/11/2012 | EP1546028B1 Method for selectively covering a micro machined surface |
04/11/2012 | EP1535332B1 Semiconductor device including a field effect transistor and a passive capacitor having reduced leakage current and an improved capacitance per unit area |
04/11/2012 | EP1469953B1 Megasonic probe energy director |
04/11/2012 | EP1299824B1 Convergence technique for model-based optical and proximity correction |
04/11/2012 | EP1094921B1 Transferring substrates with different holding end effectors |
04/11/2012 | CN202189836U 激光刻蚀oled显示器阳极薄膜材料的装置 Oled display device anode laser etching of thin film materials |
04/11/2012 | CN202189824U 一种玻璃钢载板 A glass steel carrier plate |
04/11/2012 | CN202189823U 一种硅片移动装置 One kind of mobile device wafers |
04/11/2012 | CN202189822U 一种太阳能硅片的裂片工具 A solar wafers lobes Tools |
04/11/2012 | CN202189821U 一种太阳能硅片的夹持工具 A solar wafer gripping tool |
04/11/2012 | CN202189820U 一种太阳能硅片真空夹持吸盘 A solar wafers vacuum clamping chuck |
04/11/2012 | CN202189819U 一种太阳能硅片存放盘 A solar wafers stored in disk |
04/11/2012 | CN202189818U 一种太阳能硅片输送缓冲结构 A solar wafer transport buffer structure |
04/11/2012 | CN202189817U 一种硅片输送升降结构 Transporting silicon wafers lifting structure |
04/11/2012 | CN202189814U 一种太阳能硅片盒 A solar wafers box |
04/11/2012 | CN202189812U 一种鼓泡分片设备 One kind of bubbling slicing equipment |
04/11/2012 | CN202189777U 一种散热结构及其制备装置 A heat sink structure and preparation device |
04/11/2012 | CN202189773U 一种太阳能电池片等离子刻蚀用夹具 A solar cells, plasma etching jig |
04/11/2012 | CN202189772U 晶圆固定装置 Wafer fixtures |
04/11/2012 | CN202189771U 一种硅片加工卡具 One kind of Wafer Processing fixtures |
04/11/2012 | CN202189770U 一种硅片传送机的取片和定位装置 Positioning means to take a wafer sheet and the conveyor |
04/11/2012 | CN202189769U 一种硅片与硅片的加工模具 One kind of silicon and silicon wafer processing mold |
04/11/2012 | CN202189768U 晶圆取放手臂机构 Wafer handling arm mechanism |
04/11/2012 | CN202189767U 一种可调节液晶片承载架 An adjustable LCD chip carrier |
04/11/2012 | CN202189766U 半导体封装传递料盒 The semiconductor package delivery pod |
04/11/2012 | CN202189765U 一种硅片的承载装置 A silicon wafer carrying device |
04/11/2012 | CN202189764U 一种硅片容器 One kind of silicon container |
04/11/2012 | CN202189763U 一种硅片架 One kind of silicon frame |
04/11/2012 | CN202189762U 一种太阳能硅片外观检测设备 A solar wafers visual inspection equipment |
04/11/2012 | CN202189761U Discharging device for integrated circuit package mold |
04/11/2012 | CN202189760U 半导体器件塑封抽真空装置 The semiconductor device of plastic vacuum means |
04/11/2012 | CN202189759U 一种半导体封装切脚成型用模具装置 A semiconductor package device molding die cut legs |
04/11/2012 | CN202189758U 一种硅片装载自动提升装置 One kind of wafer loading automatic lifting device |
04/11/2012 | CN202189757U 一种硅片的粘接设备 One kind of wafer bonding equipment |
04/11/2012 | CN202189756U 一种硅片切割前排列硅片的基片 An arrangement of the silicon wafer substrate before cutting |