Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2012
04/11/2012CN202189022U 一种全自动三次光检机的光检装置 A fully automated optical inspection device three times optical inspection machine
04/11/2012CN202189021U 一种全自动三次光检机的光照系统 A fully automated optical inspection machine three times the illumination system
04/11/2012CN202188722U 一种硅片脱水设备 One kind of silicon dewatering equipment
04/11/2012CN202185817U 一种提高硅片平整度的抛光头 A way to improve the flatness of the wafer polishing head
04/11/2012CN202185815U 一种固定器太阳能硅片保护装置 A fixed-Solar wafer protection devices
04/11/2012CN202185420U 一种硅片盒清洁装置 One kind of wafer cassette cleaning device
04/11/2012CN1983036B 作为对准标记的二进制正弦子波长格栅 As a binary sine sub-wavelength grating alignment mark
04/11/2012CN1913122B 形成无空隙沟槽隔离层的方法 Forming a trench isolation layer of void-free method
04/11/2012CN102414846A 用于led制造的改良多腔室分离处理 Improved multi-chamber for separation led manufacture
04/11/2012CN102414825A Power semiconductor device
04/11/2012CN102414821A Soi晶片的检查方法 Wafer inspection method Soi
04/11/2012CN102414820A 关于具有浮动主体的存储器单元的方法、装置及系统 Memory cell having a floating body on the method, apparatus and system for
04/11/2012CN102414818A Semiconductor element, semiconductor device, and power converter
04/11/2012CN102414817A 具备具有二极管区和igbt区的半导体基板的半导体装置 A semiconductor device having the diode region and the semiconductor substrate region igbt
04/11/2012CN102414815A Multi-die semiconductor package with heat spreader
04/11/2012CN102414811A 移动台、具有移动台的输送装置及带电粒子束装置 The mobile station, the mobile station has a transmission device and a charged particle beam device
04/11/2012CN102414810A 自动基板加载站 Automatic substrate loading station
04/11/2012CN102414809A 负载锁定装置和处理系统 The load lock device and the processing system
04/11/2012CN102414808A 被处理体的输送方法和被处理体处理装置 The method of treating body is transported to be processed and the processing device
04/11/2012CN102414807A 确定基底完整性的非破坏性信号传播系统和方法 Determine the integrity of the base signal propagation systems and non-destructive methods
04/11/2012CN102414806A Die connection monitoring system and method
04/11/2012CN102414805A 二极管的制造方法以及二极管 The method of manufacturing a diode and a diode
04/11/2012CN102414804A Method for forming cu wiring
04/11/2012CN102414803A Selective plasma nitriding method and plasma nitriding device
04/11/2012CN102414802A Discontinuous thin semiconductor wafer surface features
04/11/2012CN102414801A Method of decontamination of process chamber after in-situ chamber clean
04/11/2012CN102414800A 热处理装置 Heat treatment device
04/11/2012CN102414799A Gas distribution showerhead and method of cleaning
04/11/2012CN102414798A 原料供应单元、薄膜沉积装置及沉积薄膜的方法 Raw material supply unit, the thin film deposition apparatus and film deposition method
04/11/2012CN102414797A 在HVPE中形成原位预GaN沉积层的方法 The method of in-situ deposition of the pre-GaN layer is formed on the HVPE
04/11/2012CN102414796A 制作晶片产品的方法及制作氮化镓基半导体光元件的方法 The method of production of the product wafer and a method of fabricating a gallium nitride-based semiconductor optical element
04/11/2012CN102414795A Method of deposition of chemical compound semiconductor and device
04/11/2012CN102414794A 改良膜厚度不均匀性与粒子表现的cvd设备 Improved film thickness non-uniformity and particle performance cvd equipment
04/11/2012CN102414793A 用于pvd腔室的溅射靶材 Pvd target for sputtering chamber
04/11/2012CN102414792A Hvpe前驱物源硬件 Hvpe precursor source hardware
04/11/2012CN102414791A 制造多晶硅薄膜的方法 The method of fabricating a polysilicon thin film
04/11/2012CN102414790A Hvpe腔室硬件 Hvpe chamber hardware
04/11/2012CN102414789A 半导体基板的制造方法及半导体基板 The method of manufacturing a semiconductor substrate and a semiconductor substrate
04/11/2012CN102414788A Nano/microwire solar cell fabricated by nano/microsphere lithography
04/11/2012CN102414787A Laser-reflective mask and method for manufacturing same
04/11/2012CN102414786A 在原位清洁后利用NH<sub>3</sub>净化对MOCVD腔室进行去污染处理 In-situ cleaning after use NH <sub> 3 </ sub> purification of the MOCVD chamber for de-pollution treatment
04/11/2012CN102414785A 贴合晶片的制造方法 The method of manufacturing a bonded wafer paste
04/11/2012CN102414784A Controller for bonding apparatus and multilayer bonding method
04/11/2012CN102414783A 具整合混合阀的安瓿 Ampoules with the integration of the mixing valve
04/11/2012CN102414782A Preparation unit for lithogrpahy machine
04/11/2012CN102414781A Substrate support structure, clamp preparation unit, and lithography system
04/11/2012CN102414780A Device and method for separating substrate from carrier substrate
04/11/2012CN102414777A 真空腔中产生真空的带电粒子光刻设备及方法 Vacuum producing charged particles of the lithographic apparatus and method for the vacuum chamber
04/11/2012CN102414776A Lithography machine and substrate handling arrangement
04/11/2012CN102414775A Method and arrangement for realizing vacuum in vacuum chamber
04/11/2012CN102414625A Method for formation of resist pattern, and developing solution
04/11/2012CN102414619A Composition for forming resist underlayer film for euv lithography
04/11/2012CN102414347A Method for forming an anodized layer, method for manufacturing a mold, and mold
04/11/2012CN102414340A 载置台构造以及等离子体成膜装置 Stage structure and a plasma film forming apparatus
04/11/2012CN102414024A Multilayered polyimide film
04/11/2012CN102413986A Method and apparatus for irradiating semiconductor material surface by laser energy
04/11/2012CN102413951A 清洁片、带清洁功能的搬送构件、基板处理装置的清洁方法及基板处理装置 The cleaning sheet with a cleaning function of the conveying member, the cleaning method for a substrate processing apparatus and a substrate processing apparatus
04/11/2012CN102413643A Solder ball loading method and solder ball loading unit background of the invention
04/11/2012CN102413641A Multilayer wiring board and manufacturing method thereof
04/11/2012CN102412505A Method of manufacturing semiconductor laser
04/11/2012CN102412313A 一种采用SiGe HBT工艺的MOS可变电容及其制作方法 One kind of using SiGe HBT process MOS variable capacitor and its manufacturing method
04/11/2012CN102412311A PN junction variodenser in BiCMOS (bipolar complementary metal oxide semiconductor) process and manufacturing method thereof
04/11/2012CN102412310A 一种提高电容密度的多层堆叠结构及其制造方法 A capacitance density multilayer stack to improve the structure and manufacturing method
04/11/2012CN102412308A BiCMOS工艺中的寄生PIN器件及制造方法 BiCMOS processes in the device and method of manufacturing the parasitic PIN
04/11/2012CN102412307A 垂直的齐纳二极管结构及其制备方法 Vertical Zener diode structure and preparation method
04/11/2012CN102412306A Trench gate JFET and manufacture method thereof
04/11/2012CN102412302A Tunneling field-effect transistor for inhibiting bipolar effect and preparation method thereof
04/11/2012CN102412301A Nano-wire tunneling field-effect transistor with vertical structure and preparation method thereof
04/11/2012CN102412299A 半导体装置及其制造方法 Semiconductor device and manufacturing method
04/11/2012CN102412298A 半导体元件及该半导体元件的制造方法 The method of manufacturing a semiconductor element and a semiconductor element
04/11/2012CN102412296A 超级结半导体器件结构及其制作方法 Super-junction semiconductor device structures and fabrication method thereof
04/11/2012CN102412295A Semiconductor device and method for manufacturing same
04/11/2012CN102412293A 5V PMOS (P-channel Metal Oxide Semiconductor) device in SONOS (Silicon Oxide Nitride Oxide Semiconductor) technique and fabrication method thereof
04/11/2012CN102412291A 锗硅BiCMOS工艺中的可变电容及制造方法 SiGe BiCMOS process variable capacitor and method of manufacture
04/11/2012CN102412287A Silicon-germanium HBT (heterojunction bipolar transistor) device and fabrication method thereof
04/11/2012CN102412286A 一种高速锗硅hbt器件结构及其制造方法 A high speed SiGe hbt device structure and its manufacturing method
04/11/2012CN102412285A 一种锗硅异质结三极管器件结构及其制造方法 One kind of silicon-germanium heterojunction transistor device structure and manufacturing method thereof
04/11/2012CN102412284A 锗硅hbt工艺中垂直寄生型pnp三极管及其制造方法 SiGe hbt process parasitic vertical pnp type transistor and manufacturing method thereof
04/11/2012CN102412283A Silicon-germanium HBT (heterojunction bipolar transistor) device and fabrication method thereof
04/11/2012CN102412281A 锗硅异质结双极晶体管 SiGe heterojunction bipolar transistor
04/11/2012CN102412279A 锗硅bicmos工艺中垂直寄生型pnp三极管及制造方法 SiGe bicmos process parasitic vertical pnp type transistor and method of manufacture
04/11/2012CN102412278A 锗硅BiCMOS工艺中垂直型PNP三极管及制造方法 SiGe BiCMOS process, vertical PNP transistor and method of manufacture
04/11/2012CN102412277A VPNP device structure used in BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) process and manufacturing method thereof
04/11/2012CN102412276A Transistor and method of manufacturing transistor
04/11/2012CN102412275A Vertical PNP device in SiGe BiCMOS technology and manufacturing method thereof
04/11/2012CN102412274A Vertically parasitic PNP device in germanium-silicon HBT (heterojunction bipolar transistor) process and fabrication method thereof
04/11/2012CN102412273A Semiconductor device and method for manufacturing same
04/11/2012CN102412270A Igbt结构及其制备方法 Igbt structure and preparation method
04/11/2012CN102412269A 一种cmos侧墙结构及其制备方法 One kind of sidewall structure and preparation method cmos
04/11/2012CN102412268A 平面型单向触发二极管芯片及其制造方法 Planar type one-way trigger diode chip and its manufacturing method
04/11/2012CN102412266A 提高soa能力的功率器件结构及其制造方法 Ability to improve soa power device structure and manufacturing method
04/11/2012CN102412265A Method for preventing semiconductor layer mix and laminated structure
04/11/2012CN102412264A A method for producing a structure element and a semiconductor component comprising the structure element
04/11/2012CN102412263A 具有金属前介质填充结构的半导体器件及其制备方法 A semiconductor device and a method for preparing metallic structure filled before the media
04/11/2012CN102412260A 超级结半导体器件的终端保护结构及制作方法 Super Junction terminal protection structure and method of making a semiconductor device
04/11/2012CN102412259A 具有受应力区域的半导体本体 A semiconductor body region affected by stress
04/11/2012CN102412255A Method for forming impurity layer, exposure mask and method for producing solid-state imaging device
04/11/2012CN102412253A 浮体效应存储器件用soi硅片及制造方法、存储器件 Floating body effect memory device and manufacturing method using soi wafer, memory devices
04/11/2012CN102412252A 一种局部化混合晶向应变硅cmos结构及其制备方法 A method of localized strain silicon cmos mixed crystal structure and preparation method
04/11/2012CN102412251A 改进晶体管载流子迁移率的半导体器件及方法 Improvement of the carrier mobility of the transistors in the semiconductor device and method
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