Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2012
04/11/2012CN102412122A Bonding process by molecular bonding with reduced overlay type misalignment
04/11/2012CN102412121A Fabrication method for silicon nanotubes
04/11/2012CN102412120A 设备报警时的晶圆处理方法及晶圆处理的远程控制方法 Wafer processing method and remote control method wafer processing equipment when the alarm
04/11/2012CN102412119A Method for eliminating metal catalyst residues on surface of wires produced by catalytic growth
04/11/2012CN102412118A 一种预防在热处理时硅消耗的方法 A method of preventing consumption of silicon during the heat treatment
04/11/2012CN102412117A 薄膜形成方法 A thin film forming method
04/11/2012CN102412116A 形成电阻布局图形的方法 The method of forming a resistor layout pattern
04/11/2012CN102412115A 一种降低esd砷离子植入后产生的缺陷的方法 A method of reducing the arsenic ion-implanted defect esd method produced
04/11/2012CN102412114A Defect correcting apparatus and defect correcting method
04/11/2012CN102411240A Liquid crystal display device and method for manufacturing the same
04/11/2012CN102411239A Liquid crystal display device and method for manufacturing the same
04/11/2012CN102411238A 液晶显示装置及其制造方法 The liquid crystal display device and manufacturing method
04/11/2012CN102411237A Liquid crystal display device and method for manufacturing the same
04/11/2012CN102411227A Thin-film transistor array substrate, liquid crystal display device and manufacturing method thereof
04/11/2012CN102408845A 切割/芯片接合薄膜、切割/芯片接合薄膜的制造方法以及半导体装置的制造方法 Cutting / die-bonding film, the cutting / method of manufacturing a thin film semiconductor device manufacturing method and a die-bonding
04/11/2012CN102408840A Adhesive film, and connection structure and connecting method for circuit member
04/11/2012CN102408012A 输送单元及具有输送单元的阵列测试装置 Array test unit, and having a conveying device conveying unit
04/11/2012CN102110634B Rotary heating adsorption device
04/11/2012CN102074469B 一种用于pmos器件的金属栅功函数的调节方法 A method for adjusting the pmos devices work function metal gate
04/11/2012CN102074454B 刻蚀工艺的监控方法和监控系统 A method of monitoring the etching process and monitoring systems
04/11/2012CN102024682B 带有可升降挡板的多层腔体装置 Can lift the bezel with a multilayer cavity device
04/11/2012CN101969032B Double-sided graphic chip right-handed electroplating-etching module packaging method
04/11/2012CN101964310B Bonding machine incorporating dual-track transfer mechanism
04/11/2012CN101960566B 含硅膜的蚀刻方法及装置 Silicon film etching method and apparatus
04/11/2012CN101958302B Double-side graph chip inverse single package structure and package method thereof
04/11/2012CN101958301B Double-side graph chip direct-put single package structure and package method thereof
04/11/2012CN101950723B 实现源体欧姆接触且基于soi的mos器件制作方法 Realization of the source body ohmic contact and soi's mos device fabrication method based on
04/11/2012CN101882565B 一种在线处理设备 An online processing equipment
04/11/2012CN101866826B 一种用于真空处理系统的流体传输装置 The fluid transfer device for a vacuum processing system
04/11/2012CN101821573B 用于处理用于半导体基底的运送和大气下储存的运输支撑件的方法,以及用于实施这种方法的处理站 A support member for processing a transport method of the semiconductor substrate under the atmospheric transport and for storage, and a processing station for carrying out this method
04/11/2012CN101783335B Semiconductor device
04/11/2012CN101777585B 结型场效应晶体管及其制造方法 Junction field-effect transistor and manufacturing method thereof
04/11/2012CN101771046B 具有倒t形鳍片多重栅晶体管的集成电路结构及形成方法 An inverted t-shaped fin multiple integrated circuit structure and method for forming a gate transistor
04/11/2012CN101770935B 旋涂器及用该旋涂器清洗衬底的方法 A spin coater, and a spin coating method using the cleaning of the substrate
04/11/2012CN101764154B 金属栅晶体管及其形成方法 Metal gate transistor and method of forming
04/11/2012CN101752300B 一种制备过孔的方法 A method for preparing the hole had
04/11/2012CN101740441B 一种机械手调度方法、装置及等离子体处理设备 A mechanical hand scheduling method, apparatus and plasma processing equipment
04/11/2012CN101740352B Dicing die-bonding film and process for producing semiconductor device
04/11/2012CN101724911B Surface heat treatment process used before measuring electrical resistivity of P-type silicon epitaxial slice
04/11/2012CN101692441B Packaging structure of printed circuit board
04/11/2012CN101687992B 二胺化合物和聚酰胺酸 Diamine compounds and polyamide acid
04/11/2012CN101685791B 基片支承装置及其静电释放方法 Substrate support apparatus and method for electrostatic discharge
04/11/2012CN101681865B 传送盒接口和包含传送盒接口的分析设备 Feeder interface and contains the transmitter box interface analysis equipment
04/11/2012CN101667581B 一种分栅型埋层浮栅式的非易失性存储单元及其制造方法 One kind of sub-gate-type buried layer in a floating gate type nonvolatile memory cell and its manufacturing method
04/11/2012CN101587849B Semiconductor device package having features formed by stamping
04/11/2012CN101585663B 电浆加工设备 Plasma processing equipment
04/11/2012CN101577238B 半导体装置及传输接口系统 The semiconductor device and the transmission interface system
04/11/2012CN101552229B 半导体元件及其制作方法 Semiconductor device and manufacturing method thereof
04/11/2012CN101476114B 等离子体设备腔室维护前预处理的方法 The method of plasma equipment before maintenance pretreatment chamber
04/11/2012CN101436001B 曝光装置、器件制造方法 Exposure apparatus, device manufacturing method
04/11/2012CN101434046B 磨削装置 Grinding apparatus
04/11/2012CN101421824B 对集成电路进行临界尺寸控制的修整工艺 Trimming process for integrated circuits critical dimension control
04/11/2012CN101223640B 高密度“与非”非易失性存储器装置 High density "and not" non-volatile memory device
04/11/2012CN101211785B 制造槽栅型mosfet器件的方法 The method of manufacturing the trench gate type mosfet devices
04/11/2012CN101208790B 无铅半导体封装件 Lead-free semiconductor package
04/11/2012CN101208779B 用于沉积工艺的高效阱 Efficient process for the deposition of well
04/11/2012CN101137266B 气体注射装置 Gas injection device
04/11/2012CN101128083B 等离子体生成装置、等离子体控制方法和基板制造方法 The plasma generating apparatus, the plasma control method and substrate manufacturing method
04/11/2012CN101118899B 将预定元件置于目标平台的装置和方法 The book element placed an apparatus and method of the target platform
04/10/2012US8155427 Wafer-scale image archiving and receiving system
04/10/2012US8154708 Lithographic apparatus and device manufacturing method
04/10/2012US8154707 Illumination optical system and exposure apparatus having the same
04/10/2012US8154210 Ion implantation ion source, system and method
04/10/2012US8154130 Self-aligned metal to form contacts to Ge containing substrates and structure formed thereby
04/10/2012US8154126 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
04/10/2012US8154125 Chip package structure
04/10/2012US8154124 Semiconductor device having a chip-size package
04/10/2012US8154120 Chip-mounted film package
04/10/2012US8154103 Semiconductor device
04/10/2012US8154102 Semiconductor device and manufacturing method thereof
04/10/2012US8154099 Composite semiconductor structure formed using atomic bonding and adapted to alter the rate of thermal expansion of a substrate
04/10/2012US8154090 Non-volatile two-transistor semiconductor memory cell and method for producing the same
04/10/2012US8154088 Semiconductor topography and method for reducing gate induced drain leakage (GIDL) in MOS transistors
04/10/2012US8154086 Semiconductor surround gate SRAM storage device
04/10/2012US8154084 Performance enhancement in PMOS and NMOS transistors on the basis of silicon/carbon material
04/10/2012US8154083 Semiconductor device formed on high-resistance substrate
04/10/2012US8154082 Semiconductor device and manufacturing method thereof
04/10/2012US8154076 High and low voltage vertical channel transistors
04/10/2012US8154071 Nonvolatile semiconductor memory device and method for fabricating nonvolatile semiconductor memory device
04/10/2012US8154067 Selective spacer formation on transistors of different classes on the same device
04/10/2012US8154059 Semiconductor device and method for manufacturing the same
04/10/2012US8154055 CMOS image sensor and method for fabricating the same
04/10/2012US8154050 Semiconductor device with semiconductor epitaxial layers buried in source/drain regions, and fabrication method of the same
04/10/2012US8154044 Light emitting diode package structure and method for fabricating the same
04/10/2012US8154035 Nitride semiconductor light emitting element
04/10/2012US8154024 Field effect transistor using amorphous oxide film as channel layer, manufacturing method of field effect transistor using amorphous oxide film as channel layer, and manufacturing method of amorphous oxide film
04/10/2012US8154023 Low temperature polysilicon thin film transistor
04/10/2012US8154022 Process for fabricating a structure for epitaxy without an exclusion zone
04/10/2012US8154010 Memory device and method of fabricating the same
04/10/2012US8153996 Pattern forming apparatus and pattern forming method
04/10/2012US8153890 Low area screen printed metal contact structure and method
04/10/2012US8153888 Lateral ultra-high efficiency solar cell
04/10/2012US8153887 Method and structure for hydrogenation of silicon substrates with shaped covers
04/10/2012US8153885 Integrated thin-film solar cell and method of manufacturing the same
04/10/2012US8153833 Composition and method for low temperature deposition of silicon-containing films such as films including silicon, silicon nitride, silicon dioxide and/or silicon-oxynitride
04/10/2012US8153538 Process for annealing semiconductor wafers with flat dopant depth profiles
04/10/2012US8153537 Method for fabricating semiconductor devices using stress engineering
04/10/2012US8153536 Transfer of high temperature wafers
04/10/2012US8153535 Combinatorial plasma enhanced deposition techniques
04/10/2012US8153534 Direct oxidation method for semiconductor process
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