Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2012
04/19/2012US20120094479 Method for making electrical interconnections with carbon nanotubes
04/19/2012US20120094478 Resist feature and removable spacer pitch doubling patterning method for pillar structures
04/19/2012US20120094477 Hafnium tantalum oxynitride dielectric
04/19/2012US20120094476 Method of manufacturing a semiconductor device
04/19/2012US20120094475 Method for fabricating a metal gate electrode
04/19/2012US20120094474 Method for equipping an epitaxy reactor
04/19/2012US20120094473 Group iii nitride substrate, epitaxial layer-provided substrate, methods of manufacturing the same, and method of manufacturing semiconductor device
04/19/2012US20120094472 Methods for fabricating thin film pattern and array substrate
04/19/2012US20120094471 Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device
04/19/2012US20120094470 Method for forming integrated circuits on a strained semiconductor substrate
04/19/2012US20120094469 Process for realising a connecting structure
04/19/2012US20120094468 Two silicon-containing precursors for gapfill enhancing dielectric liner
04/19/2012US20120094467 Semiconductor device and manufacturing method with improved epitaxial quality of iii-v compound on silicon surfaces
04/19/2012US20120094466 Semiconductor device fabrication method for improved isolation regions and defect-free active semiconductor material
04/19/2012US20120094465 Integrated planar and multiple gate fets
04/19/2012US20120094464 Method of Fabricating Semiconductor Device Isolation Structure
04/19/2012US20120094463 High-Density Capacitor Configured On a Semiconductor
04/19/2012US20120094462 Semiconductor device and method of fabricating the same
04/19/2012US20120094461 Semiconductor memory device and manufacturing method therefor
04/19/2012US20120094460 Method for fabricating mos transistors
04/19/2012US20120094459 Semiconductor Devices Including Compressive Stress Patterns and Methods of Fabricating the Same
04/19/2012US20120094458 Hybrid-mode ldmos
04/19/2012US20120094457 Sti-aligned ldmos drift implant to enhance manufacturability while optimizing rdson and safe operating area
04/19/2012US20120094456 Process for Fabricating Silicon-on-Nothing MOSFETs
04/19/2012US20120094455 Semiconductor device having vertical channel transistor and method of manufacturing the same
04/19/2012US20120094454 Method of fabricating semiconductor device including vertical channel transistor
04/19/2012US20120094453 Semiconductor Devices And Methods Of Fabricating The Same
04/19/2012US20120094452 Semiconductor device and manufacturing method of the same
04/19/2012US20120094451 Method for Fabricating a Non-volatile Memory Device
04/19/2012US20120094450 Manufacturing method of multi-level cell nor flash memory
04/19/2012US20120094449 Vertical transistors
04/19/2012US20120094448 Method of fabricating epitaxial structures
04/19/2012US20120094447 Method for integration of dual metal gates and dual high-k dielectrics in cmos devices
04/19/2012US20120094446 Method for manufacturing semiconductor device
04/19/2012US20120094445 Etching method and method for manufacturing semiconductor device
04/19/2012US20120094444 Semiconductor Package Having Semiconductor Die with Internal Vertical Interconnect Structure and Method Therefor
04/19/2012US20120094443 Pass-through 3d interconnect for microelectronic dies and associated systems and methods
04/19/2012US20120094442 Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump
04/19/2012US20120094441 Semiconductor Chip Attach Configuration Having Improved Thermal Characteristics
04/19/2012US20120094440 Method of die bonding onto dispensed adhesives
04/19/2012US20120094439 Method for Positioning Chips During the Production of a Reconstituted Wafer
04/19/2012US20120094438 Apparatus for and methods of attaching heat slugs to package tops
04/19/2012US20120094437 Method of forming through silicon via of semiconductor device using low-k dielectric material
04/19/2012US20120094436 Embedded die package on package (pop) with pre-molded leadframe
04/19/2012US20120094435 Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom
04/19/2012US20120094434 Enhanced spontaneous separation method for production of free-standing nitride thin films, substrates, and heterostructures
04/19/2012US20120094433 Method for manufacturing semiconductor device
04/19/2012US20120094432 Self cleaning large scale method and furnace system for selenization of thin film photovoltaic materials
04/19/2012US20120094431 Liquid precursor for deposition of indium selenide and method of preparing the same
04/19/2012US20120094427 Method for manufacturing a solar cell
04/19/2012US20120094426 Method for manufacturing a solar cell
04/19/2012US20120094422 Partially transmitted imaged laser beam for scribing solar cell structures
04/19/2012US20120094419 Cmos image sensor and fabricating method thereof
04/19/2012US20120094418 Wafer Level Package and Manufacturing Method Using Photodefinable Polymer for Enclosing Acoustic Devices
04/19/2012US20120094414 Novel semiconductor and optoelectronic devices
04/19/2012US20120094412 Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same
04/19/2012US20120094403 Method of manufacturing thin-film transistor substrate
04/19/2012US20120094402 Method to manufacture semiconductor device with optical grating
04/19/2012US20120094401 Methods of processing and inspecting semiconductor substrates
04/19/2012US20120094400 Feedforward/feedback litho process control of stress and overlay
04/19/2012US20120094399 Photovoltaic cell manufacturing method and photovoltaic cell manufacturing apparatus
04/19/2012US20120094398 Semiconductor device manufacturing method and semiconductor device
04/19/2012US20120093954 Compression molding method for electronic component and compression molding apparatus employed therefor
04/19/2012US20120093617 Vacuum processing apparatus and vacuum processing method
04/19/2012US20120093616 Processing thin wafers
04/19/2012US20120093456 Coupling Methods and Systems Using a Taper
04/19/2012US20120092946 Memory devices and memory systems including discharge lines and methods of forming
04/19/2012US20120092807 Metal-Insulator-Metal Capacitor and Method for Manufacturing Thereof
04/19/2012US20120092804 Low Voltage Modular Room Ionization System
04/19/2012US20120092771 Embedded vertical optical grating for heterogeneous integration
04/19/2012US20120091598 Handling layer for transparent substrate
04/19/2012US20120091597 Stacked semiconductor package, semiconductor device including the stacked semiconductor package and method of manufacturing the stacked semiconductor package
04/19/2012US20120091594 Method of Producing a Chip Package, and Chip Package
04/19/2012US20120091593 Structure and method for simultaneously forming a through silicon via and a deep trench structure
04/19/2012US20120091592 Double Patterning Technology Using Single-Patterning-Spacer-Technique
04/19/2012US20120091589 Method to electrodeposit nickel on silicon for forming controllable nickel silicide
04/19/2012US20120091588 Barrier layer, film forming method, and processing system
04/19/2012US20120091586 Conformal coating of highly structured surfaces
04/19/2012US20120091578 Semiconductor chip having different pad width to ubm width ratios and method of manufacturing the same
04/19/2012US20120091577 Copper pillar bump with cobalt-containing sidewall protection
04/19/2012US20120091576 Under-bump metallization (ubm) structure and method of forming the same
04/19/2012US20120091575 Semiconductor Package And Method For Making The Same
04/19/2012US20120091574 Conductive pillar structure
04/19/2012US20120091570 Chip package structure and chip packaging method
04/19/2012US20120091569 Leadframe package structure and manufacturing method thereof
04/19/2012US20120091566 Semiconductor apparatus and method of fabrication for a semiconductor apparatus
04/19/2012US20120091565 Semiconductor integrated circuit device and process for manufacturing the same
04/19/2012US20120091564 Semiconductor component with marginal region
04/19/2012US20120091561 Mems devices
04/19/2012US20120091559 Capacitor and Method for Making Same
04/19/2012US20120091557 Anti-fuse of semiconductor device and method for manufacturing the same
04/19/2012US20120091556 Vertical silicide e-fuse
04/19/2012US20120091555 Semiconductor device and method of manufacturing the same
04/19/2012US20120091554 Semiconductor device and method for manufacturing the same
04/19/2012US20120091553 Method for Detecting the Repackaging of an Integrated Circuit after it has been Originally Packaged, and Corresponding Integrated Circuit
04/19/2012US20120091548 Ferromagnetic tunnel junction structure, and magneto-resistive element and spintronics device each using same
04/19/2012US20120091547 Resonator and production method thereof
04/19/2012US20120091546 Microphone
04/19/2012US20120091544 Component having a micromechanical microphone structure, and method for its production
04/19/2012US20120091543 Electromechanical transducer and method of manufacturing the same
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