Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2012
04/25/2012CN102427056A 一种在一体化氧化膜刻蚀工艺中去胶的工艺方法 A process of integration of the oxide film etch process method to glue
04/25/2012CN102427055A 一种采用等离子体处理多孔低k值介质的方法 A plasma processing method using a porous low-k value of the medium
04/25/2012CN102427054A Manufacturing method of metal-oxide-metal with high performance
04/25/2012CN102427053A 预防超低介电常数薄膜损伤的方法 Injury prevention method ultra low dielectric constant film
04/25/2012CN102427052A Silicon-on-insulator (SOI) material substrate with high-efficiency recombination center and preparation method for silicon-on-insulator (SOI) material substrate
04/25/2012CN102427051A 一种浅沟槽隔离填充的方法 One kind of method for filling shallow trench isolation
04/25/2012CN102427050A 一种无化学机械抛光的浅沟槽隔离工艺 A non-chemical-mechanical polishing the shallow trench isolation process
04/25/2012CN102427049A 一种提高浅沟槽隔离制程均匀度的方法 A way to improve the shallow trench isolation process uniformity of approach
04/25/2012CN102427048A High voltage diode assembly tool and operation method thereof
04/25/2012CN102427047A 晶圆背面清洁设备以及晶圆背面清洁方法 Backside wafer backside cleaning equipment and cleaning methods
04/25/2012CN102427046A Electro-chemical deposition result determination method
04/25/2012CN102427045A 原位水汽生成工艺实时检测方法 In-situ steam generation process real-time detection method
04/25/2012CN102427044A 一种对工艺反应腔室进行检漏的方法 Kind of process reaction chamber leak detection method
04/25/2012CN102427043A 一种改善pmos器件载流子迁移率的方法 A method of improving the pmos device carrier mobilities
04/25/2012CN102427042A 一种改善nmos器件载流子迁移率的方法 A method of improving the nmos devices of the carrier mobility
04/25/2012CN102427041A 高性能肖特基二极管的制造方法 Schottky diode manufacturing method of high-performance
04/25/2012CN102427040A 一种在层间介质层中自形成含锰硅氧化合物阻挡层的方法 A method for inter-layer dielectric layer of silicon oxide manganese compound forming a self-blocking layer
04/25/2012CN102427039A 光阻去除方法 Photoresist removal method
04/25/2012CN102427038A 一种先进的自动调整刻蚀均匀性的方法 An advanced automatic adjustment method for etching uniformity
04/25/2012CN102427037A 多孔低介电常数介质干法刻蚀速率过慢的解决方法 Porous low-k dielectric dry etch rate is too slow solution
04/25/2012CN102427036A 对HfO<sub>2</sub>薄膜的高选择性干法刻蚀方法 On HfO <sub> 2 </ sub> highly selective dry etching method Films
04/25/2012CN102427035A 内层电介质沉积方法、集成电路制造方法以及集成电路 A dielectric inner layer deposition method, a method of manufacturing an integrated circuit and an integrated circuit
04/25/2012CN102427034A Method of carrying out mirror polishing and thinning on GaAs wafer with ultrathin thickness
04/25/2012CN102427033A 一种形成高阶电常数k和t型金属栅极的形成方法 A method of forming a dielectric constant higher-order k and t-type metal gate formation
04/25/2012CN102427032A 一种高k和金属栅极的制作方法 And a method of manufacturing a high-k metal gate
04/25/2012CN102427031A 一种制作多晶硅侧墙的方法 Method for fabricating a polysilicon sidewall
04/25/2012CN102427030A 一种高k和金属栅极的制作方法 And a method of manufacturing a high-k metal gate
04/25/2012CN102427029A 一种用于栅极相关制程及其后续制程监控的测试器件结构的其制备工艺 A process for their preparation and follow-up processes associated gate process monitoring test device structures for
04/25/2012CN102427028A 在高介电常数金属栅工艺中避免损伤浅沟槽隔离的方法 To avoid damage to the shallow trench isolation method for a high dielectric constant metal gate process
04/25/2012CN102427027A 一种改善半导体自动对准镍硅化物热稳定性的工艺方法 A method of improving self-alignment of the semiconductor nickel silicide process for the thermal stability of
04/25/2012CN102427026A 一种优化的多晶栅极氧化硅硬质掩膜去除方法 An optimization of the gate polycrystalline silicon oxide hard mask removal process
04/25/2012CN102427025A 一种后栅极两晶体管dram的制造方法 A method of producing two back gate of the transistor dram
04/25/2012CN102427024A 一种工艺优化的金半接触结构的制备方法 Preparation method of process optimization of gold half-contact structure
04/25/2012CN102427023A 一种硅纳米线的制备方法 Method for preparing silicon nanowires
04/25/2012CN102427022A 一种减少污染与微尘的处理方法 An approach to reduce pollution and dust
04/25/2012CN102427021A 半导体器件中的射频信号的传输结构及其形成方法 Transmission structure and method of forming a semiconductor device of the radio-frequency signal
04/25/2012CN102427020A 一种有效减少水痕缺陷的晶片清洗方法 An effective reduction of water marks defect wafer cleaning method
04/25/2012CN102427019A 超低介电常数薄膜实现高性能金属-氧化物-金属的方法 The method of metal - high performance ultra low-k film metal - oxide
04/25/2012CN102427018A 去离子棒 Deionized stick
04/25/2012CN102426494A 一种触摸屏基板的粘合方法及其粘结剂 A touch screen substrate, and an adhesive bonding method
04/25/2012CN102423872A 硅片的抛光方法 Wafer polishing method
04/25/2012CN102117840B 一种多重金属扩散快恢复二极管及其制备方法 A multi heavy metal diffusion fast recovery diode and its preparation method
04/25/2012CN102110610B 一种降低金属氧化物半导体管栅极寄生电阻的方法 A method of reducing a metal oxide semiconductor gate parasitic resistance method
04/25/2012CN102110595B 一种对InGaAs与GaAs进行低温金属键合的方法 Kind of InGaAs and GaAs low-temperature bonding method of metal
04/25/2012CN102097286B 一种监控台阶仪测量芯片沟槽深度准确度的方法 A method for measuring the chip level meter to monitor the accuracy of the groove depth
04/25/2012CN102092002B 单晶硅片液体抛光方法 Monocrystalline liquid polishing method
04/25/2012CN102082106B Thermoacoustic flip-chip bonding method of copper salient points
04/25/2012CN101980365B 画素结构及其制造方法 Pixel structure and its manufacturing method
04/25/2012CN101971311B Multi-function tape for a semiconductor package and method of manufacturing a semiconductor device using the same
04/25/2012CN101937928B 一种消除穿通光刻针孔危害的可控硅结构生产方法 A punch through photolithographic pinhole hazards SCR structure production methods to eliminate
04/25/2012CN101911276B 使用至少一个光源校准末端执行器对准的系统和方法 Using at least one system and method for calibrating a light source end aligned with the actuator
04/25/2012CN101901840B 肖特基二极管装置及其制造方法 Schottky diode device and a manufacturing method
04/25/2012CN101901834B 场效应晶体管及其制造方法 The field effect transistor and manufacturing method thereof
04/25/2012CN101901748B 基板处理装置和基板处理方法 The substrate processing apparatus and a substrate processing method
04/25/2012CN101882563B 晶粒取放机构 Grain handling mechanism
04/25/2012CN101881930B 光刻装置 Lithographic apparatus
04/25/2012CN101880907B Electrochemical levelling and polishing processing method with nanometer precision and device thereof
04/25/2012CN101866843B 大间距硅基三维结构电化学腐蚀的方法 Great spacing silicon electrochemical etching method for three-dimensional structure
04/25/2012CN101859715B 一种硅片叠层合金的加热工艺 Heating process a wafer stack Alloys
04/25/2012CN101855709B 通过光通量加热晶片的方法 By heating the wafer flux method
04/25/2012CN101838812B 一种清洗钝化Ge衬底表面的方法 A cleaning method of passivating the surface of the Ge substrate
04/25/2012CN101826553B 场效应晶体管及其制造方法 The field effect transistor and manufacturing method thereof
04/25/2012CN101826498B 显示装置、框架模块及框架模块制作方法 Device, the frame module and method of manufacturing the display frame module
04/25/2012CN101814482B Base island lead frame structure and production method thereof
04/25/2012CN101809713B 阻止晶体管栅极电极的预非晶化 The gate electrode of the transistor to prevent a pre-amorphization
04/25/2012CN101777501B 影像撷取装置的组装方法以及感光芯片的封装方法 Encapsulation method sensitive chip assembly method and apparatus of image capture
04/25/2012CN101771049B Real chip level package power metal oxide semiconductor field effect tube based on a bottom source electrode metal oxide semiconductor field effect tube
04/25/2012CN101770932B 等离子体处理设备 The plasma processing apparatus
04/25/2012CN101767720B 输送装置 Delivery device
04/25/2012CN101764195B 一种制作纳米尺寸相变存储器的方法 A method of nano-size production of a phase change memory
04/25/2012CN101752377B N/P metal crystal orientation for high-K metal gate Vt modulation and its manufacture method
04/25/2012CN101752365B 集成电路结构 Integrated circuit structure
04/25/2012CN101752303B Method of reducing delamination in the fabrication of small-pitch devices
04/25/2012CN101752269B Integrated circuit structure and its forming method
04/25/2012CN101740592B Solid-state imaging device, method for manufacturing solid-state imaging device, and electronic apparatus
04/25/2012CN101740355B 芯片分拣设备的移送装置 Chip sorting equipment transfer device
04/25/2012CN101740332B 一种半导体元件的蚀刻方法 A method of etching a semiconductor element
04/25/2012CN101727118B 一种快速热处理温度测控系统和测控方法 A rapid heat treatment temperature measurement and control system, and monitoring and control methods
04/25/2012CN101719507B 单台面串联平面pn结芯片及其制造方法 Tandem single planar pn junction mesa chip and its manufacturing method
04/25/2012CN101681809B 曝光装置、曝光方法以及器件制造方法 Exposure apparatus, exposure method and device manufacturing method
04/25/2012CN101673692B Two-step etching method for forming bonding pad
04/25/2012CN101673680B 一种在氮化硅沉积工艺中去除氯化铵结晶的方法 A crystalline ammonium chloride is removed in a silicon nitride deposition process, the method
04/25/2012CN101673660B 一种缝隙填充的处理方法和浅沟道隔离槽的制作方法 A method of making treatment gap filling and shallow trench isolation trench
04/25/2012CN101667596B 半导体元件及其制造方法 Semiconductor device and manufacturing method
04/25/2012CN101656214B Semiconductor element and manufacturing method
04/25/2012CN101645422B 基于分立电荷存储模式的高密度、单分散、高可靠纳米硅存储器 Based on the discrete high-density charge storage mode, monodisperse, highly reliable nano-silicon memory
04/25/2012CN101630631B 信息管理方法、信息管理装置以及衬底处理系统 Information management method, an information management apparatus and a substrate processing system
04/25/2012CN101615579B 一种半导体等离子刻蚀工艺 A semiconductor plasma etch process
04/25/2012CN101609828B Semiconductor device and method of manufacturing the same
04/25/2012CN101578691B 可去除隔离层 Isolation layer can be removed
04/25/2012CN101566769B Liquid crystal display and manufacture method therefor
04/25/2012CN101563763B Methods and systems for low interfacial oxide contact between barrier and copper metallization
04/25/2012CN101540303B 抗磨损和晶须的涂覆系统和方法 Abrasion resistant coating systems and methods and whiskers
04/25/2012CN101512747B 基板运送装置以及基板运送方法 Substrate transport apparatus and method for substrate transfer
04/25/2012CN101471233B 形成半导体器件微图案的方法 The method of forming a semiconductor device micropattern
04/25/2012CN101465283B 等离子体处理装置以及等离子体处理方法 The plasma processing apparatus and plasma processing method
04/25/2012CN101443901B 带有多晶硅晶粒的硅化物源极/漏极电极 Silicide source with polysilicon grains / drain electrodes
04/25/2012CN101419965B Circuit device
04/25/2012CN101419904B 等离子体约束装置及等离子体处理装置 The plasma processing apparatus and plasma confinement apparatus
04/25/2012CN101409232B 多晶硅膜的形成方法 The method of forming a polycrystalline silicon film
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