| Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
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| 05/18/2007 | WO2007055176A1 Pressure-sensitive adhesive base and adhesive patch of percutaneous absorption type |
| 05/16/2007 | CN1962784A Hot-melt adhesive and process for preparing same |
| 05/02/2007 | EP1778742A1 Bonding compositions |
| 05/02/2007 | EP1778411A1 Polymeric materials via click chemistry |
| 05/02/2007 | CN1957051A Method for producing adhesive film |
| 04/25/2007 | EP1777278A1 Adhesive composition and sheet having an adhesive layer of the composition |
| 04/24/2007 | US7208566 Imide-linked maleimide and polymaleimide compounds |
| 04/18/2007 | CN1950475A Resin paste for die bonding |
| 04/17/2007 | CA2219124C Printed wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof |
| 04/12/2007 | WO2007040261A1 Adhesive and laminates made by using the same |
| 04/11/2007 | CN1946823A Adhesive film, flexible metal-clad laminate, and process for producing the same |
| 04/11/2007 | CN1309761C Adhesive resin and film adhesives made by using the same |
| 03/15/2007 | WO2007029609A1 Heat resistant adhesive sheet |
| 03/15/2007 | WO2007029534A1 Polyamide acid containing metal ultrafine metal particle |
| 03/14/2007 | CN1927976A Preparation method for laminated tube insulating rubberized fabric |
| 03/14/2007 | CN1304460C Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition, film-forming material and adhesive for electronic parts |
| 02/20/2007 | US7179684 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material |
| 02/15/2007 | WO2007018120A1 Adhesive film and semiconductor device using same |
| 02/14/2007 | EP1276999B1 Use of CYANATE-BASED ADHESIVES FOR AND IN COMBINATION WITH FRICTION LININGS AND METHOD FOR PRODUCING FRICTION LININGS THAT ADHERE TO A SUPPORT |
| 02/14/2007 | CN1914246A Thermosetting resin composition and use thereof |
| 02/13/2007 | US7175914 Base material having thereon polyaniline-containing film surface, and process for forming film surface on base material |
| 01/31/2007 | CN1297618C Halogen-free flame resistant adhesive for preparing laminated sheet |
| 01/25/2007 | WO2007010902A1 Thermoplastic resin composition for semiconductor, adhesive film, lead frame or semiconductor device compirisng the same, and method for manufacture of semiconductor device using the same |
| 01/24/2007 | CN1902049A Adhesive film, flexible metal-clad laminate of enhanced dimensional stability obtained therefrom and process for producing the same |
| 01/24/2007 | CN1901260A Negative electrode for non-aqueous electrolyte secondary battery, producing method therefor, and non-aqueous electrolyte secondary battery |
| 01/24/2007 | CN1900205A High temperature inorganic adhesive |
| 01/24/2007 | CN1900164A Blend of polyimide polymer and its use as high temperature resisting dipping glue |
| 01/11/2007 | WO2007004569A1 Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part |
| 01/09/2007 | US7160946 Adding an aromatic bismaleimide resin powder that does not dissolve in liquid curable resins; cyanate ester resin, polyisobornyl or lauryl (meth)acrylate and/or (meth)acrylated polybutadiene; flexibility, heat resistance; semiconductor packages |
| 01/02/2007 | US7157587 Imide-extended liquid bismaleimide resin |
| 12/28/2006 | WO2006137369A1 Reactive monomer and resin composition containing same |
| 12/14/2006 | WO2006132165A1 Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device |
| 12/14/2006 | US20060281872 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 12/12/2006 | US7147920 Backing, adhesive layer, and protective member, where the adhesive layer comprises a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent; improved adhesion, heat resistance, low modulus of elasticity |
| 12/06/2006 | CN1287980C Metal laminating body |
| 12/05/2006 | US7144956 adhesives and seals comprising blends of acrylic ester homopolymers and polymeric matrix selected from polyamides, polyacrylamides, polyimides, polyureaurethanes or polyamideester copolymers |
| 11/23/2006 | US20060263928 Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality |
| 11/22/2006 | CN1866430A Electrochemical capacitor electrode production method |
| 11/14/2006 | CA2209753C New polyamines and their use in aqueous coating compositions |
| 11/02/2006 | WO2006115146A1 Adhesive sheet with base used for flexible printed circuit board, method for producing same, multilayer flexible printed circuit board, and rigid-flex printed circuit board |
| 11/02/2006 | EP1716590A1 Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality |
| 11/02/2006 | EP1716215A1 Curable liquid compositions containing bisoxazoline |
| 10/19/2006 | US20060235194 Novel polymer compound, precursor for the same and thin film-forming method using the same polymer precursor |
| 10/19/2006 | US20060235184 Novel polymer compound, precursor for the same and thin film-forming method using the same polymer precursor |
| 10/18/2006 | CN1280375C Adhesive for laminated product, anchoring agent, laminated films, multiplayer packaging material and packaging bag |
| 10/11/2006 | CN1844244A Resin composition and its use in bonding sheet and copper clad plate |
| 09/21/2006 | DE102005012813A1 Composition, useful as adhesive such as sealing adhesive for the gloss foil lamination, comprises a polymer obtained by radical polymerization, and an amino compound |
| 09/20/2006 | EP1189973B1 Composition of and method for making high performance resins for infusion and transfer molding processes |
| 09/05/2006 | US7102015 Maleimide compounds in liquid form |
| 08/31/2006 | US20060194939 Aqueous dispersions consisting of polycarbodiimides |
| 08/23/2006 | CN1821338A Resin adhesive for diamond grinding wheel |
| 08/15/2006 | US7090920 laminate comprising thermoplastic substrate, conductive metal foil at least partially disposed on substrate, adhesive disposed between substrate and the metal foil, poly(arylene ether) resin, thermosetting resin, poly(vinyl butyral-co-vinyl acetate) resin toughening agent; circuit board applications |
| 08/10/2006 | WO2006082828A1 Isotropic adhesive film and flexible metal-clad laminate |
| 08/08/2006 | US7087311 three-dimensional polyimide formed from a tetra[amino(phenyl)]adamantane and tetracarboxylic acid monomers; excellent mechanical strength and heat resistance compared to films with linear polyimides |
| 08/02/2006 | EP1238312B1 Use of polyimide for adhesive layers, lithographic method for producing microcomponents and method for producing composite material |
| 08/02/2006 | CN1810856A Aromatic polyimide and its prepn and use |
| 07/26/2006 | CN1809917A Assembly for bonding a semiconductor die to substrate with oxazoline derivative bearing an electron donor or acceptor functional group |
| 07/18/2006 | US7078093 Stretch releasing pressure sensitive adhesive tape and articles |
| 07/06/2006 | DE10025251B4 Verwendung eines Cyanatharz-Klebers zum Verkleben von Reibbelägen auf einem Substrat Using a cyanate resin adhesive for bonding friction materials on a substrate |
| 07/05/2006 | CN1262711C Polymeric creping adhesives and creping methods using same |
| 06/22/2006 | WO2006064700A1 Polyimide multilayered adhesive film and process for proucing the same |
| 06/21/2006 | CN1791647A Primer, conductor foil with resin, laminate and process for producing the laminate |
| 06/21/2006 | CN1789361A Film adhesive and semiconductor package using the same |
| 06/14/2006 | EP1620495A4 Imide-linked maleimide and polymaleimide compounds |
| 06/14/2006 | CN1788065A Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 06/13/2006 | US7060786 Heat resistant resin composition and adhesive film |
| 06/13/2006 | US7060784 Polyimide precursor resin solution composition sheet |
| 06/07/2006 | CN1784457A Imide-linked maleimide and polymaleimide compounds |
| 06/07/2006 | CN1782011A Thermosol and soft package lithium ion cell polar ear containing said thermosol |
| 05/31/2006 | CN1778856A Polyaniline conducting adhesive |
| 05/30/2006 | US7052936 Use of polybenzoxazoles (PBOS) for adhesion |
| 05/24/2006 | DE10136382B4 Phenylverknüpfte Polybenzoxazolcyanate, Verfahren zu ihrer Herstellung und ihre Verwendung als Dielektrikum mit guten Klebe- und Fülleigenschaften und zum Verkleben Phenylverknüpfte Polybenzoxazolcyanate, processes for their preparation and their use as dielectric materials with good adhesion and filling properties, and for bonding |
| 05/09/2006 | US7041747 An adhesive composition includes a room-temperature polymerizable component including a phenyl-containing (meth)acrylates and a polymeric matrix present in an amount to render the composition non-flowable at temperatures of 120 degrees F.; seals; threadlocking; nuts and bolts; storage stability |
| 05/03/2006 | EP1465930B1 Supramolecular polymers |
| 04/26/2006 | CN1764999A Vacuum envelope for image display device and sealant for image display device |
| 04/19/2006 | CN1252144C Adhesive of fixing matrix for microelectronic device |
| 04/11/2006 | US7026436 Binders comprising condensation polymers used for lamination of flexible circuits and packaging electronics |
| 03/30/2006 | WO2006033267A1 Novel polyimide film and adhesive film and flexible metal-clad laminate both obtained with the same |
| 03/30/2006 | US20060068211 Low temperature polyimide adhesive compositions and methods relating thereto |
| 03/30/2006 | US20060068210 Low temperature polyimide adhesive compositions and methods relating thereto |
| 03/29/2006 | CN1247698C Resin composition |
| 03/28/2006 | US7018718 Adhesive film for underfill and semiconductor device using the same |
| 03/23/2006 | US20060061255 Vacuum envelope for image display device and sealant for image display device |
| 03/09/2006 | DE10008121B4 Verfahren zur Herstellung von Polyamidsäure und Polyimid und Haft- oder Klebemittel, das aus der oder dem so hergestellten Polyamidsäure oder Polyimid besteht A process for the production of polyamide acid and polyimide, and the adhesive or bonding agent which consists of or the polyamide acid or polyimide produced in this way |
| 03/07/2006 | US7008693 Highly heat-resistant label |
| 02/23/2006 | WO2006019650A1 Bonding compositions |
| 02/23/2006 | CA2575076A1 Bonding compositions |
| 02/22/2006 | EP1131370B1 Hydroxy-functionalized poly(amino ether) salts |
| 02/15/2006 | CN1733469A Flexible metal foil-polyimide laminate and making method |
| 02/14/2006 | CA2296237C Essentially colorless, transparent polyimide coatings and films |
| 02/09/2006 | WO2006013950A1 Solution, material for plating, insulating sheet, laminate and printed wiring board |
| 02/08/2006 | EP1624038A1 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 02/02/2006 | WO2006011404A1 Adhesive film and use thereof |
| 02/01/2006 | EP1620495A2 Imide-linked maleimide and polymaleimide compounds |
| 01/31/2006 | US6991707 Polymeric creping adhesives and creping methods using same |
| 01/26/2006 | US20060019109 three-dimensional polyimide formed from a tetra[amino(phenyl)]adamantane and tetracarboxylic acid monomers; excellent mechanical strength and heat resistance compared to films with linear polyimides |
| 01/25/2006 | CN1238458C Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same |
| 01/25/2006 | CN1238401C Polyimide copolymer and methods for preparing same |
| 01/18/2006 | EP1244755B1 Pressure sensitive adhesive and biomedical electrodes using same |
| 01/18/2006 | CN1721492A Adhesive combination and membrane electrode assembly of fuel cell and preparation method thereof |