Patents
Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765)
06/2003
06/26/2003US20030120031 Polymerized aspartate units and succinimide units; dispersants in detergents and cleansers, antiscalants and corrosion inhibitors and personal-care additives for softening and moisturizing
06/26/2003US20030120030 Polymerized aspartate units and succinimide units; dispersants in detergents and cleansers, antiscalants and corrosion inhibitors and personal-care additives for softening and moisturizing
06/26/2003US20030116294 Mixture of anionic and cationic polymer
06/19/2003US20030111519 Fluxing compositions
06/12/2003US20030109666 Thermosetting resin compositions containing maleimide and/or vinyl compounds
05/2003
05/28/2003EP1314748A2 Curable resin compositions
05/27/2003US6569521 Tape comprising pressure sensitive adhesive composition comprising silicone polyurea block copolymer comprising reaction product of polydiorganosiloxane diamine and polyisocyanate, tackifying resin, and nontacky tab
05/21/2003EP1312634A1 Polyaniline-containing film, and process for forming this film
05/14/2003EP1028997B1 Water-activated adhesive and paper-plastic tape containing same
05/08/2003WO2003038005A2 Polymerizable compositions in non-flowable forms
05/08/2003US20030087999 Thermosetting resin compositions containing maleimide and/or vinyl compounds
05/01/2003US20030079847 Fibrous sheet enhancement
04/2003
04/24/2003US20030075292 Fibrous sheet binders
04/23/2003EP1303571A1 Polyimide hybrid adhesives
04/15/2003US6548621 Trimellitic anhydride halide and bis(o-aminophenol) monomers; semiconductor dielectrics
04/15/2003US6548608 Polyetherimide and/or polysulphone, aromatic polyamine-modified epoxy resin and thermoplastic
04/15/2003US6548180 Comprising 3,3',4,4'-biphenyltetracarboxlic acid and p-phenylenediamine polyimide and a polyimidesiloxane adhesive initially formed on a polyethylene terephthalate film, which is removed, and applied to a copper film
04/10/2003WO2003029374A1 Methods of forming polybenzimidazole coating film and of forming film
04/09/2003EP1299492A1 Stretch releasing pressure sensitive adhesive tapes and articles
04/03/2003WO2003027178A2 Polyimide copolymer and methods for preparing the same
04/02/2003EP1179026A4 BRANCHED AND HYPERBRANCHED POLYETHERIMIDES FROM STABLE A1Bn, AB, AA, AND BB MONOMERS; AM ENDCAPPING AGENTS
04/02/2003CN1104441C Modified polyalkadiene-containing compositions
03/2003
03/27/2003US20030060531 Do not require solvent to provide a system having suitable viscosity for convenient handling; rapid cure; adhesively attaching a microelectronic device to a substrate; die-attach paste
03/26/2003CN1406262A Adhesive polyimide resin and adhesive laminate
03/25/2003US6538093 Polyimide silicone resin, process for its production, and polyimide silicone resin composition
03/20/2003WO2003022952A1 Adhesive for gas barrier laminates and laminated films
03/13/2003WO2003020816A1 Fluxing compositions
03/12/2003EP1290101A2 Adhesive compositions containing stable amino-containing polymer latex blends
03/12/2003CN1402768A Pressure sensitive conductive adhesive having hot-melt properties and biomedical electrodes using same
02/2003
02/27/2003US20030040578 Electrode-forming compositions and electrode members
02/26/2003EP1285993A1 Fibrous sheet binders
02/25/2003US6524769 Photosensitive resin
02/25/2003US6524711 Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition
02/20/2003CA2395893A1 Fibrous sheet binders
02/06/2003US20030027885 Polyamides that contain a biphenylene unit, which can be dimerized by exposure; also contain hydroxy groups that react with amide hydrogens to form benzoxazole groups by cyclizing.
02/04/2003US6515048 Adhesive powder
01/2003
01/30/2003US20030023017 Diethyloctandioldicarbamates and diethyloctandioldiallophanates, method for the production and use thereof
01/30/2003US20030019597 Polymeric creping adhesives and creping methods using same
01/22/2003EP1276999A1 Cyanate-based adhesives for and in combination with friction linings and method for producing friction linings that adhere to a support
01/16/2003US20030012882 Adhesive polyimide resin and adhesive laminate
12/2002
12/19/2002US20020193541 Thermosetting resin compositions containing maleimide and/or vinyl compounds
12/18/2002EP1266926A1 Adhesive polyimide resin and adhesive laminate
12/17/2002US6495658 Comonomer compositions for production of imide-containing polyamino acids
12/12/2002WO2002099192A2 Polymeric creping adhesives and creping methods using same
12/12/2002US20020188069 Solventless polyimide silicone resin compositions
12/03/2002US6489013 Polyamideimide with siloxane bonds, high molecular weight acrylic polymer, thermoset resin and solvent; low thermal stress and modulus of elasticity; heat resistance
11/2002
11/28/2002WO2002062871A3 Comonomer compositions for production of imide-containing polyamino acids
11/20/2002EP1258509A1 Solventless polyimide silicone resin compositions
11/05/2002US6475629 Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device
10/2002
10/31/2002US20020161171 Comonomer compositions for production of imide-containing polyamino acids
10/31/2002US20020161077 Heat-resistant composition
10/30/2002EP1252251A1 Stable waterborne polymer compositions containing poly(alkylenimines)
10/30/2002EP1252136A1 Diethyloctandioldicarbamates and diethyloctandioldiallophanates, method for the production and use thereof
10/23/2002CN1375512A Aeolotropic conductive film
10/23/2002CN1093366C Polyimidahenzoxazole dielectric film and printed wiring board(s) made from said film
10/16/2002EP1249434A1 High temperature carbonaceous cement
10/16/2002EP1173499A4 Use of polyamino acid salts in water-borne adhesive applications
10/16/2002CN1092737C Multi-layer paper products
10/02/2002EP1246280A2 Electrode-forming compositions and electrode members
10/02/2002EP1244755A2 Pressure sensitive adhesive and biomedical electrodes using same
10/02/2002CN1091776C 粘合用树脂组合物和粘合片 An adhesive resin composition and an adhesive sheet
09/2002
09/19/2002US20020132887 Composite adhesive
09/19/2002US20020130302 Capable of firmly adhering to an electronic component and a circuit board and achieving good electrical continuity by thermal compression bonding at low temperature at which the circuit board is not eteriorated
09/18/2002CN1369526A Heat resistant compsns.
09/18/2002CN1091300C Lead-on-chip semiconductor device package and its mfg. method
09/17/2002US6451927 Room-temperature flowable polymerizable compound in a non-flowable polymer matrix which are particularly useful in the threadlocking and sealing applications
09/11/2002EP1238312A1 Use of polyimide for adhesive layers, lithographic method for producing microcomponents and method for producing composite material
09/04/2002CN1090196C Aromatic polycarbodiimide and sheet using it
08/2002
08/29/2002US20020117280 Fibrous sheet enhancement
08/28/2002CN1366011A Polyamide-polyesteramide thermosol and its preparing process
08/27/2002US6440258 Polycarbodiimide, epoxy resins and fillers, having heat resistance and flexibility
08/21/2002CN1089357C Polyimidesiolxane adhesive
08/20/2002US6436467 Flexible printed board and method of manufacturing same
08/15/2002WO2002062871A2 Comonomer compositions for production of imide-containing polyamino acids
08/15/2002US20020111439 Polymerizable compositions in non-flowable forms
08/14/2002EP1231240A1 Heat resistant composition
08/06/2002CA2072531C Photopolymerisable liquid compositions
07/2002
07/31/2002CN1361800A Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings
07/24/2002CN1088074C 热塑性聚酰亚胺聚合物 Thermoplastic polyimide polymer
07/10/2002EP1221471A1 Adhesive composition comprising a polyetherimide in epoxide resin
07/09/2002US6417267 Adhesive compositions containing stable amino-containing polymer latex blends
06/2002
06/27/2002US20020081434 Thermosetting resin composition composed mainly of a polycarbodiimide obtained from organic polyisocyanates
06/13/2002WO2002046299A1 Use of polyether amine derivatives for permanent improvement of the adhesive and/or coating compatibility of polyethylene-based shaped bodies, fibres and films
06/13/2002WO2002046298A1 Use of polyether amines for permanent improvement of the adhesive and/or coating compatibility of polyethylene-based shaped bodies, fibres and films
06/13/2002DE10060819A1 Production of polyethylene moldings, fibers and films, comprises shaping a mixture of polyethylene and a polyetheramine derivative as adhesion promoter
06/13/2002DE10060818A1 Verwendung von Polyetheraminen zur dauerhaften Verbesserung der Klebstoff- und/oder Beschichtungs-Kompatibilität von Polyethylen-basierten Formkörpern, Fasern und Folien The use of polyetheramines for permanently improving the adhesive and / or coating compatibility of polyethylene-based moldings, fibers and films
06/06/2002WO2002026888A3 Low temperature bonding adhesive composition
06/06/2002WO2000075255A3 Pressure sensitive adhesive and biomedical electrodes using same
06/05/2002EP0861281B1 Thermosetting bismaleimide polymer for composite and adhesive applications
05/2002
05/28/2002US6395391 Multilayer; metal substrate, adhesive layers
05/16/2002US20020058149 Aromatic polyimide film and film laminate
05/15/2002EP1204691A1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings
05/10/2002WO2002036707A1 Composite adhesive
04/2002
04/30/2002US6379822 Fired and carbonized polycarbodiimide resin and carbon, coke, or graphite powder filler; bonding strength
04/24/2002CN1083514C Paper product comprising adhesively joined plies
04/16/2002US6372859 Thermoresistance adhesive and semiconductor device using the same
04/11/2002WO2001090272A3 Adhesive compositions containing stable amino-containing polymer latex blends
04/04/2002WO2002026888A2 Low temperature bonding adhesive composition
03/2002
03/27/2002EP1189973A1 Composition of and method for making high performance resins for infusion and transfer molding processes
03/20/2002EP1188778A1 Thermosetting resin composition, and resin coated metal foil, prepreg and film-shaped adhesive all using the composition
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