| Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
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| 10/03/2012 | CN102712755A Polyimide resin composition, adhesive agent and laminate each comprising same, and device |
| 10/03/2012 | CN102709201A Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them |
| 09/27/2012 | US20120244351 Multilayer resin sheet and method for producing the same, method for producing cured multilayer resin sheet, and highly thermally conductive resin sheet laminate and method for producing the same |
| 09/27/2012 | US20120244347 Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film |
| 09/19/2012 | CN102676112A Low-temperature curing cyanate ester adhesive and preparation method thereof |
| 09/19/2012 | CN102676096A Preparation method of organosilicon conductive adhesive containing nanorod-shaped zinc oxide |
| 09/19/2012 | CN102676082A Fiber, fiber aggregate and adhesive having the same |
| 09/12/2012 | CN102666658A Polyimide resin, manufacturing method therefor, adhesive resin composition, coverlay film, and circuit board |
| 09/12/2012 | CN102666631A Polyamideimide adhesives for printed circuit boards |
| 09/12/2012 | CN101523587B Resin paste for die bonding, method for manufacturing semiconductor device, and semiconductor device |
| 09/05/2012 | EP2493953A1 Polyamideimide adhesives for printed circuit boards |
| 08/29/2012 | EP2492331A1 Photosensitive adhesive composition, photosensitive adhesive sheet, and semiconductor devices using same |
| 08/29/2012 | CN102040938B Nano-particle modified cyanate adhesive and preparation method thereof |
| 08/29/2012 | CN101501153B Film adhesive, adhesive sheet, and semiconductor device using the same |
| 08/22/2012 | CN102643625A Conductive frame sealing glue, preparation method thereof and liquid crystal display screen |
| 08/15/2012 | CN102640576A Resin composition for use in formation of bonding layer in multilayer flexible printed circuit board, resin varnish, resin-coated copper foil, manufacturing method for resin-coated copper foil for use in manufacturing of multilayer flexible printed circuit board |
| 08/15/2012 | CN102634021A Thermoplastic polyimide resin and preparation method thereof |
| 08/09/2012 | WO2012105659A1 Adhesive tape |
| 08/09/2012 | WO2012105558A1 Thermosetting resin composition, cured product thereof, and interlayer adhesive film for printed wiring board |
| 08/09/2012 | WO2012105547A1 Curable resin composition and cured product thereof |
| 08/08/2012 | EP2484739A1 Conductive connection material, method for connection between terminals and method for manufacturing connecting terminal |
| 08/08/2012 | EP2484724A1 Multilayer resin sheet and method for producing same, method for producing multilayer resin sheet cured product, and highly thermally conductive resin sheet laminate and method for producing same |
| 08/08/2012 | EP2484710A1 Resin composition, prepreg using same, metal foil with resin, adhesive film, and metal-clad laminate |
| 08/08/2012 | CN102627932A High temperature resistant epoxy-imine resin adhesive and preparation method thereof |
| 08/08/2012 | CN101560371B High temperature resistant thermosetting polyimide adhesive and preparation method thereof |
| 08/01/2012 | CN102618206A Polyimide adhesive |
| 08/01/2012 | CN102618200A Organosilicone-epoxy-polyimide adhesive and preparation method thereof |
| 08/01/2012 | CN102618195A Light shading adhesive, laminated plate, preparation method of light shading adhesive, and application of light shading adhesive |
| 08/01/2012 | CN102618033A Composition, LED (light-emitting diode) circuit board substrate comprising same and preparation method thereof |
| 07/31/2012 | US8231761 Creping adhesive modifier and process for producing paper products |
| 07/25/2012 | CN102604584A High-peeling polyimide adhesive and preparation method thereof |
| 07/25/2012 | CN102604094A Crosslinking fluorine-containing polyimide and synthesis method thereof |
| 07/18/2012 | EP1989261B1 Method and composition for priming wood and natural fibres |
| 07/18/2012 | CN102597153A Adhesive composition, circuit connecting structure, semiconductor device and adhesion improvement agent for glass |
| 07/18/2012 | CN102584884A Benzoxazine monomer, benzoxazine precursor and low-dielectric benzoxazine resin |
| 07/18/2012 | CN102582206A Preparation method of copper-clad plate made from nano composite plastic |
| 07/18/2012 | CN101506321B Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
| 07/12/2012 | US20120177918 Simple adhesive coacervates and methods of making and using thereof |
| 07/11/2012 | CN102575139A Photosensitive adhesive composition, photosensitive adhesive sheet, and semiconductor devices using same |
| 07/11/2012 | CN102575084A Multilayer resin sheet and method for producing same, method for producing multilayer resin sheet cured product, and highly thermally conductive resin sheet laminate and method for producing same |
| 07/11/2012 | CN102574985A Resin composition, prepreg using same, metal foil with resin, adhesive film, and metal-clad laminate |
| 07/11/2012 | CN102559118A High-temperature-resistant conductive adhesive and preparation method thereof |
| 07/11/2012 | CN102559092A Conductive adhesive for circuit board, single/double-sided multi-layer printed circuit board, and production method |
| 07/11/2012 | CN102558861A Halogen-free phosphate-free high-heat-resistance thermosetting resin composition as well as bonding sheet and copper clad laminate prepared from same |
| 07/04/2012 | CN102549102A Conductive connection material, method for connection between terminals and method for manufacturing connecting terminal |
| 07/04/2012 | CN102549068A Resin composition, resin sheet, and resin cured product and method for producing same |
| 07/04/2012 | CN102533209A Binder for lithium secondary battery, negative electrode for lithium secondary battery, lithium secondary battery, binder precursor solution for lithium secondary battery, and method for manufacturing negative electrode for lithium secondary battery |
| 07/04/2012 | CN102533208A Stable reactive thermosetting formulations of reducing sugars and amines |
| 07/04/2012 | CN102533191A High temperature-resistant halogen-free ion migration-resistant epoxy resin adhesive |
| 07/04/2012 | CN101921482B Thermosetting polyimide resin and preparation method thereof |
| 07/04/2012 | CN101466774B Polyimide resin |
| 06/27/2012 | EP2467521A1 Cellulosic composite |
| 06/27/2012 | EP2467520A1 Improved performance polymeric fiber webs |
| 06/27/2012 | EP2467429A1 Modified binders for making fiberglass products |
| 06/27/2012 | CN101580687B Fluorenyl-containing polyimide high temperature-resistant adhesive and preparation method thereof |
| 06/20/2012 | EP2465987A1 Improved nonwoven of synthetic polymer |
| 06/20/2012 | EP2464773A1 Curable fiberglass binder |
| 06/20/2012 | EP2464770A1 Curable fiberglass binder |
| 06/20/2012 | CN101611076B Binder resin for electrode of lithium ion secondary battery, composition and paste containing the resin, and electrode of lithium ion secondary battery using the resin |
| 06/13/2012 | CN202276542U Composition heat conducting copper foil base plate |
| 06/13/2012 | CN101370892B Polyimide resin composition and metal polyimide laminate |
| 06/07/2012 | WO2012075344A2 Improved adhesive film layer for printed circuit board applications |
| 06/07/2012 | WO2012073851A1 Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet |
| 06/05/2012 | US8193107 Modified binders for making fiberglass products |
| 05/31/2012 | US20120135251 Photosensitive polyimide having silicon modified group, adhesive composition and semiconductor package including the same |
| 05/31/2012 | US20120135152 Stable reactive thermosetting formulations of reducing sugars and amines |
| 05/31/2012 | US20120133061 Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same |
| 05/30/2012 | EP2456828A1 Adhesive system and method of producing a wood based product |
| 05/30/2012 | CN101402831B Thermal-activated adhesive film and method of producing the same |
| 05/24/2012 | WO2012066897A1 Anisotropic conductive film, united object, and process for producing united object |
| 05/23/2012 | EP1995290B1 Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet making use of the same |
| 05/23/2012 | CN102471664A Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same |
| 05/23/2012 | CN102471586A 粘合剂体系和生产木基产品的方法 Binder system and method for the production of wood-based products |
| 05/23/2012 | CN102471461A Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these |
| 05/16/2012 | EP2452964A1 Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these |
| 05/09/2012 | CN102443170A Thermosetting polyphenylquinoxaline resin, its preparation method and application |
| 05/09/2012 | CN101418205B Halogen-free flameproof adhesive and application thereof in prepreg and multiple layer printed plate |
| 05/02/2012 | CN101845143B Modified bismaleimide resin as well as preparation method and application thereof |
| 04/26/2012 | WO2012053589A1 Adhesive composition, method for producing semiconductor device, and semiconductor device |
| 04/18/2012 | CN102421849A Thermosetting polyimide resin composition, cured product, and adhesive |
| 04/18/2012 | CN102417808A 一种耐高温胶粘剂及其制备方法 A high temperature adhesive and its preparation method |
| 04/13/2012 | CA2754313A1 New dispersion adhesives, a process for preparing them and use thereof |
| 04/12/2012 | US20120088109 Linear polyimide precursor, linear polyimide and heat-cured product thereof, and method for producing them |
| 04/11/2012 | EP2438130A1 Adhesive composition based on benzoxazine-thiol adducts |
| 04/05/2012 | WO2012043025A1 Conductive adhesive composition, electronic device, positive electrode laminate, and method for manufacturing electronic device |
| 04/04/2012 | EP2436734A1 Thermosetting resin composite and cured product thereof |
| 03/21/2012 | CN102382584A Slice for forming semiconductor chip protective film |
| 03/21/2012 | CN101529590B Semiconductor electronic component and semiconductor device using the same |
| 03/14/2012 | EP2428535A1 Thermosetting polyimide resin composition, cured product, and adhesive |
| 03/08/2012 | US20120059119 Thermosetting polyimide resin composition, cured product, and adhesive |
| 03/07/2012 | CN102369101A Film for resin spacer, light-receiving device and method for manufacturing same, and MEMS device and method for manufacturing same |
| 03/01/2012 | US20120048606 Adhesive composition, film-like adhesive, and connection structure for circuit member |
| 02/29/2012 | CN102365341A Base-generating agent, photosensitive resin composition, patterning material comprising the photosensitive resin composition, patterning method and article using the photosensitive resin composition |
| 02/29/2012 | CN102363723A Preparation method for high-temperature resistant copper foil adhesive |
| 02/29/2012 | CN102363646A Modified bismaleimide resin and preparation method thereof |
| 02/29/2012 | CA2750986A1 Novel aqueous resorcinol-formaldehyde-latex dispersions, adhesion-improved fibres, processes for production thereof and use thereof |
| 02/29/2012 | CA2750981A1 Novel bonding agents based on carbodiimides, aqueous resorcinol-formaldehyde-latex dispersions comprising bonding agent, adhesion-improved fibres, processes for production thereofand use thereof |
| 02/22/2012 | EP2039716B1 Polyimide resin |
| 02/22/2012 | CN101522744B 聚酰胺酰亚胺树脂、粘接剂、挠性基板材料、挠性层叠板及挠性印刷电路板 Polyamide-imide resins, adhesives, flexible board materials, flexible laminate and the flexible printed circuit board |
| 02/15/2012 | CN102352037A Preparation of benzoxazine resin with oxazolidine ring structure |