Patents
Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765)
10/2004
10/19/2004CA2229645C Multi-ply paper product
10/14/2004WO2004088707A1 Vacuum envelope for image display and sealing material for image display
10/14/2004US20040202839 water wettability; deodorizing, sterilizing; heat exchangers
10/13/2004EP1465930A2 Supramolecular polymers
09/2004
09/29/2004EP0998537B1 Adhesive composition for hot bonding and bonding method using same
09/16/2004US20040178423 Adhesive film for underfill and semiconductor device using the same
09/14/2004US6790597 Rapid cure, stable to elevated temperatures, are highly flexible, have low moisture uptake
09/07/2004US6787244 Poly-o-hydroxy amides that cure to form polybenoxazoles
09/01/2004EP1453087A1 Microelectronic assembly
08/2004
08/25/2004EP1448669A2 Polyimide copolymer and methods for preparing the same
08/25/2004CN1523074A Room temperature printable adhesive paste
08/18/2004EP1447421A1 Room temperature printable adhesive paste
08/12/2004US20040158008 Bonding silicon chip to substrate; mixture of epoxy resin and bismaleimide resin
08/04/2004CN1518621A Polymeric creping adhesives and creping methods using same
07/2004
07/28/2004EP1441015A1 Methods of forming polybenzimidazole coating film and of forming film
07/21/2004EP0778857B1 Thermosetting resin compositions containing maleimide and/or vinyl compounds
07/20/2004US6764873 Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making same
07/14/2004EP1437393A1 Adhesive for gas barrier laminates and laminated films
07/14/2004CN1157457C Polyamide-polyesteramide thermosol and its preparing process
07/01/2004US20040127626 capable of forming or bonding low-resistance electrodes; silver powder as a conductive agent
07/01/2004US20040127623 thermally stable polyimide resin and can contain a ferrite powder in such a high density as to form a satisfactory closed magnetic circuit structure
06/2004
06/29/2004US6755938 Comprising anionic polymer having negative charge of 4-12 milliequivalents per gram and cationic polymer having positive charge of 6-12 milliequivalents per gram; board strength, durability
06/23/2004EP1252136B1 Diethyloctandioldicarbamates and diethyloctandioldiallophanates, method for the production and use thereof
06/08/2004US6746819 Article comprising photostructurable polyimide or polyimide mixture for adhesive layer with thickness of <1 mu m between photostructurable epoxy resin and metal or silicon
06/03/2004US20040105990 Backing, adhesive layer, and protective member, where the adhesive layer comprises a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent; improved adhesion, heat resistance, low modulus of elasticity
06/02/2004EP1424352A1 Low temperature polymide adhesive compositions and methods relating thereto
06/02/2004EP1423467A1 Fluxing compositions
06/01/2004US6743841 Solvent-soluble polyimide resin, and an optionally cyclic phenoxyphosphazene compound or polyphosphazene; adhesives for printed wiring boards
05/2004
05/27/2004US20040099374 Binders comprising condensation polymers used for lamination of flexible circuits and packaging electronics
05/26/2004EP1303571B1 Polyimide hybrid adhesives
05/26/2004CN1500110A Comonomer compsns. of prodn. of imide-contg. polyamino acids
05/26/2004CN1500108A Polyimide copolymer and methods for preparing same
05/20/2004US20040096633 Adhesive film for underfill and semiconductor device using the same
05/19/2004DE4308089B4 Formaldehydfreie Bindemittel für Holz Formaldehyde-free binders for wood
04/2004
04/27/2004US6727320 Polymerizable compositions in non-flowable forms
04/22/2004US20040077798 Thermosetting resin compositions containing maleimide and/or vinyl compounds
04/20/2004US6723432 Can be cured and bonded to a current collector; adhesion and chemical resistance; for use in manufacture of lithium batteries and electrical double-layer capacitors of various shapes
04/15/2004US20040072933 Curable adhesive compositions
04/14/2004EP1407078A2 Polymeric creping adhesives and creping methods using same
04/14/2004CN1145682C Small chip adhesion agent for microelectronic device
04/13/2004US6720405 Polymerized aspartate units and succinimide units; dispersants in detergents and cleansers, antiscalants and corrosion inhibitors and personal-care additives for softening and moisturizing
04/06/2004US6716312 Fibrous sheet binders
03/2004
03/31/2004CN1485199A Metal laminating body
03/16/2004US6706841 Recurring units of an aromatic tetracarboxylic acid, an aromatic amine and amino functionalized polysiloxane, a (meth) acrylic compound, and a polymerization initiator has fluidity at 25 degrees c
03/11/2004WO2003059964A3 Supramolecular polymers
03/10/2004CN1480490A Cyanate resin modified by polyether imide
02/2004
02/26/2004US20040038025 reflectance levels of 20 to 65% in the 600 nm to 900 nm region; polyamide or polyester filaments melt spun with carbon black additive; camoflaging fabrics; antireflectivity
02/18/2004CN1138807C Solvent-free, room temp. curing reactive systems and use thereof in production of adhesives, sealing agents, casting compounds, molded articles or coatings
02/12/2004US20040028824 Comprises coating pre-polymer on substrate, heating to cyclize, then curing; improved energy/chemical/solvent resistance
02/10/2004CA2231173C Paper product comprising adhesively joined plies
02/05/2004US20040023043 Dicing tape
02/05/2004DE10321224A1 Siloxan-modifiziertes Polyimidharz Siloxane-modified polyimide resin
02/04/2004EP1141162B1 Hot melt adhesive having controllable water solubility
02/03/2004US6686441 Comonomer compositions for production of imide-containing polyamino acids
02/03/2004US6686440 Copolymerizing aspartic acid and succinimides with heat; antiscaling agents; cosmetics, cements; superabsorbence; liquid laundery detergents; disposable diapers
01/2004
01/28/2004CN1471063A High heat-resisting label
01/22/2004US20040013887 Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making same
01/15/2004US20040010062 Heat resistant adhesives; waterproofing; bonding strength
01/07/2004CN1466611A Low temperature bonding adhesive composition
01/02/2004EP1126768B1 Polymerizable compositions in non-flowable forms
12/2003
12/30/2003US6669869 Capable of firmly adhering to an electronic component and a circuit board and achieving good electrical continuity by thermal compression bonding at low temperature at which the circuit board is not eteriorated
12/18/2003WO2002099192A3 Polymeric creping adhesives and creping methods using same
12/17/2003EP1371701A2 Heat-resistant label
12/11/2003WO2003102049A1 Adhesive resin and film adhesives made by using the same
12/11/2003CA2431665A1 Highly heat-resistant label
12/10/2003EP1368410A2 Comonomer compositions for production of imide-containing polyamino acids
12/04/2003WO2003038005A3 Polymerizable compositions in non-flowable forms
11/2003
11/27/2003US20030220455 Heat resistant resin composition and adhesive film
11/20/2003US20030215636 A thermoplastic resin having a functional group and carbodiimide compound impregnated only in the surface layer section or both surface layer section and inside the base particle and both are strongly bonded by crosslinking reaction
11/18/2003US6649679 Stable waterborne polymer compositions containing poly(alkylenimines)
11/13/2003US20030212245 Heating, compression; electronics
11/13/2003US20030211317 Stretch releasing pressure sensitive adhesive tape and articles
11/11/2003US6645632 Blend of polyimide and epoxy resin
11/05/2003EP1359144A1 Method for the preparation of bismaleimides
11/05/2003CN1454247A Stretch releasing pressure sensitive adhesive tapes and articles
10/2003
10/23/2003WO2003027178A3 Polyimide copolymer and methods for preparing the same
10/23/2003US20030199638 Film adhesives containing maleimide compounds and methods for use thereof
10/21/2003US6635138 Method of immobilizing circuitry fingers
10/14/2003US6632523 Polyimidesiloxane made from a dianhydride, an aromatic diamine and a siloxanediamine, an epoxy resin, and a cyanate; tape
10/09/2003WO2003082940A1 Film adhesives containing maleimide and related compounds and methods for use thereof
10/09/2003US20030190477 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
10/01/2003EP1204691B1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings
10/01/2003CN1445324A Method for preparing high-temp. resistant adhesive
09/2003
09/17/2003EP1344795A2 Carbodiimide-containing hardening type reactive particles, process for producing the same, and use of the same
09/17/2003EP1344789A2 Thermosetting resin composition containing malemide and/or vinyl compounds
09/17/2003CN1443229A Adhesive compositions containing stable amino-containing polymer latex blends
09/03/2003EP1339786A1 Use of polyether amines for permanent improvement of the adhesive and/or coating compatibility of polyethylene-based shaped bodies, fibres and films
09/03/2003EP1339785A1 Use of polyether amine derivatives for permanent improvement of the adhesive and/or coating compatibility of polyethylene-based shaped bodies, fibres and films
08/2003
08/21/2003WO2003068703A1 Aqueous dispersions consisting of polycarbodiimides
08/21/2003US20030158350 Polyimide resin, epoxy resin-curing catalyst, and an epoxy resin
08/14/2003US20030153719 Novel polymer compound, precursor for the same and thin film-forming method using the same polymer precursor
08/14/2003US20030150557 Adhesively bonded chip-and wafer stacks
08/07/2003US20030149207 Use of polybenzoxazoles (PBOS) for adhesion
08/06/2003CN1434845A Stable waterborne polymer compositions containing poly(alkylenimines)
08/06/2003CN1117133C Soluble polyimide coating glue and its preparation and use
08/05/2003CA2188345C Metal-filled, plateable structural adhesives for cyanate ester composites
07/2003
07/24/2003WO2003059964A2 Supramolecular polymers
07/16/2003EP1326938A1 Composite adhesive
07/09/2003CN1113937C Thermosetting resin composition
07/03/2003US20030125510 Comomer compositions for production of imide-containing polyamino acids
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