Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
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10/19/2004 | CA2229645C Multi-ply paper product |
10/14/2004 | WO2004088707A1 Vacuum envelope for image display and sealing material for image display |
10/14/2004 | US20040202839 water wettability; deodorizing, sterilizing; heat exchangers |
10/13/2004 | EP1465930A2 Supramolecular polymers |
09/29/2004 | EP0998537B1 Adhesive composition for hot bonding and bonding method using same |
09/16/2004 | US20040178423 Adhesive film for underfill and semiconductor device using the same |
09/14/2004 | US6790597 Rapid cure, stable to elevated temperatures, are highly flexible, have low moisture uptake |
09/07/2004 | US6787244 Poly-o-hydroxy amides that cure to form polybenoxazoles |
09/01/2004 | EP1453087A1 Microelectronic assembly |
08/25/2004 | EP1448669A2 Polyimide copolymer and methods for preparing the same |
08/25/2004 | CN1523074A Room temperature printable adhesive paste |
08/18/2004 | EP1447421A1 Room temperature printable adhesive paste |
08/12/2004 | US20040158008 Bonding silicon chip to substrate; mixture of epoxy resin and bismaleimide resin |
08/04/2004 | CN1518621A Polymeric creping adhesives and creping methods using same |
07/28/2004 | EP1441015A1 Methods of forming polybenzimidazole coating film and of forming film |
07/21/2004 | EP0778857B1 Thermosetting resin compositions containing maleimide and/or vinyl compounds |
07/20/2004 | US6764873 Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making same |
07/14/2004 | EP1437393A1 Adhesive for gas barrier laminates and laminated films |
07/14/2004 | CN1157457C Polyamide-polyesteramide thermosol and its preparing process |
07/01/2004 | US20040127626 capable of forming or bonding low-resistance electrodes; silver powder as a conductive agent |
07/01/2004 | US20040127623 thermally stable polyimide resin and can contain a ferrite powder in such a high density as to form a satisfactory closed magnetic circuit structure |
06/29/2004 | US6755938 Comprising anionic polymer having negative charge of 4-12 milliequivalents per gram and cationic polymer having positive charge of 6-12 milliequivalents per gram; board strength, durability |
06/23/2004 | EP1252136B1 Diethyloctandioldicarbamates and diethyloctandioldiallophanates, method for the production and use thereof |
06/08/2004 | US6746819 Article comprising photostructurable polyimide or polyimide mixture for adhesive layer with thickness of <1 mu m between photostructurable epoxy resin and metal or silicon |
06/03/2004 | US20040105990 Backing, adhesive layer, and protective member, where the adhesive layer comprises a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent; improved adhesion, heat resistance, low modulus of elasticity |
06/02/2004 | EP1424352A1 Low temperature polymide adhesive compositions and methods relating thereto |
06/02/2004 | EP1423467A1 Fluxing compositions |
06/01/2004 | US6743841 Solvent-soluble polyimide resin, and an optionally cyclic phenoxyphosphazene compound or polyphosphazene; adhesives for printed wiring boards |
05/27/2004 | US20040099374 Binders comprising condensation polymers used for lamination of flexible circuits and packaging electronics |
05/26/2004 | EP1303571B1 Polyimide hybrid adhesives |
05/26/2004 | CN1500110A Comonomer compsns. of prodn. of imide-contg. polyamino acids |
05/26/2004 | CN1500108A Polyimide copolymer and methods for preparing same |
05/20/2004 | US20040096633 Adhesive film for underfill and semiconductor device using the same |
05/19/2004 | DE4308089B4 Formaldehydfreie Bindemittel für Holz Formaldehyde-free binders for wood |
04/27/2004 | US6727320 Polymerizable compositions in non-flowable forms |
04/22/2004 | US20040077798 Thermosetting resin compositions containing maleimide and/or vinyl compounds |
04/20/2004 | US6723432 Can be cured and bonded to a current collector; adhesion and chemical resistance; for use in manufacture of lithium batteries and electrical double-layer capacitors of various shapes |
04/15/2004 | US20040072933 Curable adhesive compositions |
04/14/2004 | EP1407078A2 Polymeric creping adhesives and creping methods using same |
04/14/2004 | CN1145682C Small chip adhesion agent for microelectronic device |
04/13/2004 | US6720405 Polymerized aspartate units and succinimide units; dispersants in detergents and cleansers, antiscalants and corrosion inhibitors and personal-care additives for softening and moisturizing |
04/06/2004 | US6716312 Fibrous sheet binders |
03/31/2004 | CN1485199A Metal laminating body |
03/16/2004 | US6706841 Recurring units of an aromatic tetracarboxylic acid, an aromatic amine and amino functionalized polysiloxane, a (meth) acrylic compound, and a polymerization initiator has fluidity at 25 degrees c |
03/11/2004 | WO2003059964A3 Supramolecular polymers |
03/10/2004 | CN1480490A Cyanate resin modified by polyether imide |
02/26/2004 | US20040038025 reflectance levels of 20 to 65% in the 600 nm to 900 nm region; polyamide or polyester filaments melt spun with carbon black additive; camoflaging fabrics; antireflectivity |
02/18/2004 | CN1138807C Solvent-free, room temp. curing reactive systems and use thereof in production of adhesives, sealing agents, casting compounds, molded articles or coatings |
02/12/2004 | US20040028824 Comprises coating pre-polymer on substrate, heating to cyclize, then curing; improved energy/chemical/solvent resistance |
02/10/2004 | CA2231173C Paper product comprising adhesively joined plies |
02/05/2004 | US20040023043 Dicing tape |
02/05/2004 | DE10321224A1 Siloxan-modifiziertes Polyimidharz Siloxane-modified polyimide resin |
02/04/2004 | EP1141162B1 Hot melt adhesive having controllable water solubility |
02/03/2004 | US6686441 Comonomer compositions for production of imide-containing polyamino acids |
02/03/2004 | US6686440 Copolymerizing aspartic acid and succinimides with heat; antiscaling agents; cosmetics, cements; superabsorbence; liquid laundery detergents; disposable diapers |
01/28/2004 | CN1471063A High heat-resisting label |
01/22/2004 | US20040013887 Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making same |
01/15/2004 | US20040010062 Heat resistant adhesives; waterproofing; bonding strength |
01/07/2004 | CN1466611A Low temperature bonding adhesive composition |
01/02/2004 | EP1126768B1 Polymerizable compositions in non-flowable forms |
12/30/2003 | US6669869 Capable of firmly adhering to an electronic component and a circuit board and achieving good electrical continuity by thermal compression bonding at low temperature at which the circuit board is not eteriorated |
12/18/2003 | WO2002099192A3 Polymeric creping adhesives and creping methods using same |
12/17/2003 | EP1371701A2 Heat-resistant label |
12/11/2003 | WO2003102049A1 Adhesive resin and film adhesives made by using the same |
12/11/2003 | CA2431665A1 Highly heat-resistant label |
12/10/2003 | EP1368410A2 Comonomer compositions for production of imide-containing polyamino acids |
12/04/2003 | WO2003038005A3 Polymerizable compositions in non-flowable forms |
11/27/2003 | US20030220455 Heat resistant resin composition and adhesive film |
11/20/2003 | US20030215636 A thermoplastic resin having a functional group and carbodiimide compound impregnated only in the surface layer section or both surface layer section and inside the base particle and both are strongly bonded by crosslinking reaction |
11/18/2003 | US6649679 Stable waterborne polymer compositions containing poly(alkylenimines) |
11/13/2003 | US20030212245 Heating, compression; electronics |
11/13/2003 | US20030211317 Stretch releasing pressure sensitive adhesive tape and articles |
11/11/2003 | US6645632 Blend of polyimide and epoxy resin |
11/05/2003 | EP1359144A1 Method for the preparation of bismaleimides |
11/05/2003 | CN1454247A Stretch releasing pressure sensitive adhesive tapes and articles |
10/23/2003 | WO2003027178A3 Polyimide copolymer and methods for preparing the same |
10/23/2003 | US20030199638 Film adhesives containing maleimide compounds and methods for use thereof |
10/21/2003 | US6635138 Method of immobilizing circuitry fingers |
10/14/2003 | US6632523 Polyimidesiloxane made from a dianhydride, an aromatic diamine and a siloxanediamine, an epoxy resin, and a cyanate; tape |
10/09/2003 | WO2003082940A1 Film adhesives containing maleimide and related compounds and methods for use thereof |
10/09/2003 | US20030190477 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material |
10/01/2003 | EP1204691B1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
10/01/2003 | CN1445324A Method for preparing high-temp. resistant adhesive |
09/17/2003 | EP1344795A2 Carbodiimide-containing hardening type reactive particles, process for producing the same, and use of the same |
09/17/2003 | EP1344789A2 Thermosetting resin composition containing malemide and/or vinyl compounds |
09/17/2003 | CN1443229A Adhesive compositions containing stable amino-containing polymer latex blends |
09/03/2003 | EP1339786A1 Use of polyether amines for permanent improvement of the adhesive and/or coating compatibility of polyethylene-based shaped bodies, fibres and films |
09/03/2003 | EP1339785A1 Use of polyether amine derivatives for permanent improvement of the adhesive and/or coating compatibility of polyethylene-based shaped bodies, fibres and films |
08/21/2003 | WO2003068703A1 Aqueous dispersions consisting of polycarbodiimides |
08/21/2003 | US20030158350 Polyimide resin, epoxy resin-curing catalyst, and an epoxy resin |
08/14/2003 | US20030153719 Novel polymer compound, precursor for the same and thin film-forming method using the same polymer precursor |
08/14/2003 | US20030150557 Adhesively bonded chip-and wafer stacks |
08/07/2003 | US20030149207 Use of polybenzoxazoles (PBOS) for adhesion |
08/06/2003 | CN1434845A Stable waterborne polymer compositions containing poly(alkylenimines) |
08/06/2003 | CN1117133C Soluble polyimide coating glue and its preparation and use |
08/05/2003 | CA2188345C Metal-filled, plateable structural adhesives for cyanate ester composites |
07/24/2003 | WO2003059964A2 Supramolecular polymers |
07/16/2003 | EP1326938A1 Composite adhesive |
07/09/2003 | CN1113937C Thermosetting resin composition |
07/03/2003 | US20030125510 Comomer compositions for production of imide-containing polyamino acids |