Patents
Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765)
05/1996
05/08/1996EP0710690A2 Polyimide film
05/08/1996EP0710683A1 Adhesion promoter for polyurethane adhesive compositions
04/1996
04/23/1996US5510425 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides
04/16/1996US5508357 Solubility in solvent, low melting point
04/10/1996EP0705314A1 One-coat rubber-to-metal bonding adhesive
03/1996
03/26/1996US5502143 Block polymers
03/19/1996US5500294 Modified acrylonitrile-butadiene copolymer
03/14/1996WO1996007691A2 Thermosetting resin compositions containing maleimide and/or vinyl compounds
02/1996
02/06/1996US5489637 Low temperature flexible die attach adhesive and articles using same
01/1996
01/24/1996EP0693517A1 Curable silicone-modified polyimide compositions
01/09/1996US5482583 Process and agent for anchoring securing elements in drill holes
01/03/1996EP0689571A1 Three-layer polyimidesiloxane adhesive tape
12/1995
12/26/1995US5478916 From 4,4'-oxydiphthalic acid and a diamine blend of 3,3'-oxydianiline and p-phenylenediamine
12/20/1995EP0604460B1 Adhesive film
12/13/1995EP0686170A1 Die-attach compositions
12/06/1995CN1113083A Thermoplastic polyimide polymer, thermoplastic polyimide film, polyimide laminate, and process for producing the laminate
12/05/1995US5473040 Polyimidesiloxane film of low heat-conductivity
11/1995
11/29/1995CN1112584A Heat resistant resin composition, heat resistant film adhesive and process for producing the same
11/23/1995WO1995031827A1 High-voltage breakover diode
11/02/1995EP0679706A1 Metallized polyimide film containing a hydrocarbyl tin compound
10/1995
10/18/1995EP0544741B1 Cyanate ester adhesives for electronic applications
10/17/1995US5459184 Moisture-actuated hot melt adhesive
10/11/1995EP0676456A1 Heat-resistant adhesive film for printed board and method of use thereof
09/1995
09/20/1995EP0672044A1 Bisnadimides
09/19/1995US5451616 Photopolymerisable liquid compositions for forming heat curable solid film adhesives
07/1995
07/24/1995EP0705314A4 One-coat rubber-to-metal bonding adhesive
07/19/1995EP0663417A1 Thermoplastic polyimide polymer, thermoplastic polyimide film, polyimide laminate, and process for producing the laminate
06/1995
06/22/1995DE4417164C1 High voltage tripping diode used as stationary spark voltage distributor
05/1995
05/02/1995US5412059 Polybenzimidazoles via aromatic nucleophilic displacement
04/1995
04/26/1995EP0649893A1 Adhesive tape for electronic parts and liquid adhesive
04/11/1995US5406124 Thermoplastic polyimides
03/1995
03/21/1995US5399907 Semiconductor with flexible polymer substrate
02/1995
02/09/1995WO1995004100A1 Thermoplastic polyimide polymer, thermoplastic polyimide film, polyimide laminate, and process for producing the laminate
01/1995
01/31/1995US5386000 A curable adhesives is a reaction product of cyanate ester with at least one polymer selected from the group consisting of additional polymer, epoxy resins, polyesters, polyurethanes , polyureas, polyethers; coldsetting resins; high strength
12/1994
12/13/1994US5372891 Flexible copper/polyimide and barbituric acid modified bismaleimide blend/polyimide laminate
12/06/1994US5371178 Rapidly curing adhesive and method
12/06/1994US5371168 From 3,3',4,4',benzophenonetetracarboxylic acid and 3,3'-diaminobenzophenone with phthalic anhydride end groups; high tensile shear adhesive strength
10/1994
10/25/1994CA1332769C Hot melt adhesive comprising water soluble polyalkyloxazoline and water insoluble polymer
10/13/1994WO1994019402A3 Die-attach compositions
10/05/1994EP0618269A1 Thermosetting resin compositions and their use for thin film wiring boards
09/1994
09/29/1994WO1994021744A1 Three-layer polyimidesiloxane adhesive tape
09/27/1994US5350635 Cyanate resin adhesive for polyimide film
09/21/1994CN1092448A Three-layer polyimidesiloxane adhesive tape
09/15/1994DE4308089A1 Formaldehyde-free binders for wood
09/06/1994US5344982 Adhesives, composites, films, matrices; solvent resistance, modulus, high glass transition temperature
09/01/1994WO1994019402A2 Die-attach compositions
08/1994
08/31/1994CN1091452A One-coat rubber-to-metal bonding adhesive
07/1994
07/07/1994WO1994014911A1 Heat-resistant adhesive film for printed board and method of use thereof
07/06/1994EP0605112A2 Insulating adhesive tape, and lead frame and semiconductor device employing the tape
07/06/1994EP0604460A1 Adhesive film.
06/1994
06/29/1994EP0604319A1 Polyimide solution compositions and process for preparing same
06/29/1994EP0604038A2 Plasticized polyetherimide adhesive compositions
06/23/1994WO1994013669A1 Bisnadimides
06/23/1994CA2150566A1 Bisnadimides
06/01/1994EP0598971A1 Compound capable of adhering on smooth aluminium surfaces and binding with P.T.F.E. film
06/01/1994EP0598911A1 Film adhesive and production thereof
04/1994
04/14/1994WO1994007968A1 One-coat rubber-to-metal bonding adhesive
04/05/1994US5300812 Plasticized polyetherimide adhesive composition and usage
04/05/1994US5300620 Heat-resistant adhesive and method of adhesion by using adhesive
03/1994
03/31/1994WO1994006844A1 Fast-curing adhesive of adjustable viscosity
03/29/1994US5298288 Coating a heat curable liquid dielectric on a substrate
02/1994
02/22/1994US5288519 Insulation layer for mold; hydrolysis of polyamic acid, degreasing, curing, surface oxidation-reduction of formed polyimide
02/22/1994CA1327253C Polymeric amides
02/15/1994US5286417 Fusible electroconductive adhesive
02/08/1994US5284899 Resin paste for tight sealing
02/02/1994EP0580614A1 Process and means for anchoring fastening elements in boreholes
01/1994
01/18/1994US5280102 Heat-resistant bonding materials
01/13/1994DE4322491A1 Release coating compsn. used for making release film - contg. adduct of poly:amine and mono:isocyanate with long alkyl chain, cpd. reacting with active hydrogen and diluent
01/11/1994US5278276 Polyamic acid precursor; prepared from bis/aminophenoxyphenyl/ compounds and tetracarboxylic acid dianhydrides
12/1993
12/09/1993WO1993024583A1 Film adhesive and production thereof
12/09/1993WO1993024564A1 Low temperature flexible die attach adhesive and articles using same
12/07/1993US5268432 Heat resistant modified bismaleimide adhesive composition
12/07/1993US5268404 One-coat rubber-to-metal bonding adhesive
11/1993
11/10/1993EP0396667B1 Processable polyimide adhesive and matrix composite resin
11/03/1993EP0568222A2 Method of producing modified polyimide layer having improved adhesion to metal
10/1993
10/19/1993US5254412 Heat resisting adhesive material
10/12/1993US5252700 Polyamic acid or polyimide endblocked with aromatic dicarboxylic anhydrides
10/05/1993US5250600 Polyhydroxyl polyesters and polyethers modified with cyanate ester
09/1993
09/07/1993US5242755 High temperature adhesive
09/02/1993WO1993017059A1 Rapidly curing adhesive and method
09/02/1993WO1993016987A1 Low temperature flexible die attach adhesive and articles using same
09/01/1993EP0557906A1 Heat-resistant adhesive composition
08/1993
08/10/1993US5234522 Method of producing flexible printed-circuit board covered with coverlay
08/04/1993EP0553612A2 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides
07/1993
07/28/1993EP0552984A2 Methods of making thin-film wiring boards, thin-film wiring boards made thereby, and adhesive materials
07/21/1993EP0551747A1 Polyetherimide flexible films
07/11/1993CA2085653A1 Polyetherimide/dimethylsiloxane copolymer adhesive system for bonding copper foil to polyetherimide flexible films
06/1993
06/30/1993EP0549159A2 Method and adhesive for making electrical and mechanical connections
06/08/1993US5218034 Polyimide film with tin or tin salt incorporation resulting in improved adhesion
06/03/1993DE4240224A1 New polyamide-polyamic acid block copolymers or flexible laminates - based on bi:phenyl-3,3,4,4-tetra:carboxylic acid di:anhydride and para-phenylenediamine
05/1993
05/25/1993US5213648 Identification cards
05/18/1993US5212279 Hot-melt adhesive and its use in polyimide film and printed circuit board
05/18/1993US5212276 Polyimides with improved compression moldability
04/1993
04/27/1993US5205894 Polyimide and high-temperature adhesive of polyimide
04/06/1993US5200474 Polyimide adhesive composition including barbituric acid modifier
03/1993
03/18/1993WO1993005122A1 Adhesive film
03/17/1993EP0532461A1 Polymers containing bispyrazole units
03/17/1993EP0531867A1 Resin paste for tight sealing
03/10/1993CA2077569A1 Polymers containing bispyrazole units
03/04/1993WO1992018697A3 Process and means for anchoring fastening elements in boreholes
1 ... 6 7 8 9 10 11 12 13 14 15 16 17 18