Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
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05/08/1996 | EP0710690A2 Polyimide film |
05/08/1996 | EP0710683A1 Adhesion promoter for polyurethane adhesive compositions |
04/23/1996 | US5510425 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides |
04/16/1996 | US5508357 Solubility in solvent, low melting point |
04/10/1996 | EP0705314A1 One-coat rubber-to-metal bonding adhesive |
03/26/1996 | US5502143 Block polymers |
03/19/1996 | US5500294 Modified acrylonitrile-butadiene copolymer |
03/14/1996 | WO1996007691A2 Thermosetting resin compositions containing maleimide and/or vinyl compounds |
02/06/1996 | US5489637 Low temperature flexible die attach adhesive and articles using same |
01/24/1996 | EP0693517A1 Curable silicone-modified polyimide compositions |
01/09/1996 | US5482583 Process and agent for anchoring securing elements in drill holes |
01/03/1996 | EP0689571A1 Three-layer polyimidesiloxane adhesive tape |
12/26/1995 | US5478916 From 4,4'-oxydiphthalic acid and a diamine blend of 3,3'-oxydianiline and p-phenylenediamine |
12/20/1995 | EP0604460B1 Adhesive film |
12/13/1995 | EP0686170A1 Die-attach compositions |
12/06/1995 | CN1113083A Thermoplastic polyimide polymer, thermoplastic polyimide film, polyimide laminate, and process for producing the laminate |
12/05/1995 | US5473040 Polyimidesiloxane film of low heat-conductivity |
11/29/1995 | CN1112584A Heat resistant resin composition, heat resistant film adhesive and process for producing the same |
11/23/1995 | WO1995031827A1 High-voltage breakover diode |
11/02/1995 | EP0679706A1 Metallized polyimide film containing a hydrocarbyl tin compound |
10/18/1995 | EP0544741B1 Cyanate ester adhesives for electronic applications |
10/17/1995 | US5459184 Moisture-actuated hot melt adhesive |
10/11/1995 | EP0676456A1 Heat-resistant adhesive film for printed board and method of use thereof |
09/20/1995 | EP0672044A1 Bisnadimides |
09/19/1995 | US5451616 Photopolymerisable liquid compositions for forming heat curable solid film adhesives |
07/24/1995 | EP0705314A4 One-coat rubber-to-metal bonding adhesive |
07/19/1995 | EP0663417A1 Thermoplastic polyimide polymer, thermoplastic polyimide film, polyimide laminate, and process for producing the laminate |
06/22/1995 | DE4417164C1 High voltage tripping diode used as stationary spark voltage distributor |
05/02/1995 | US5412059 Polybenzimidazoles via aromatic nucleophilic displacement |
04/26/1995 | EP0649893A1 Adhesive tape for electronic parts and liquid adhesive |
04/11/1995 | US5406124 Thermoplastic polyimides |
03/21/1995 | US5399907 Semiconductor with flexible polymer substrate |
02/09/1995 | WO1995004100A1 Thermoplastic polyimide polymer, thermoplastic polyimide film, polyimide laminate, and process for producing the laminate |
01/31/1995 | US5386000 A curable adhesives is a reaction product of cyanate ester with at least one polymer selected from the group consisting of additional polymer, epoxy resins, polyesters, polyurethanes , polyureas, polyethers; coldsetting resins; high strength |
12/13/1994 | US5372891 Flexible copper/polyimide and barbituric acid modified bismaleimide blend/polyimide laminate |
12/06/1994 | US5371178 Rapidly curing adhesive and method |
12/06/1994 | US5371168 From 3,3',4,4',benzophenonetetracarboxylic acid and 3,3'-diaminobenzophenone with phthalic anhydride end groups; high tensile shear adhesive strength |
10/25/1994 | CA1332769C Hot melt adhesive comprising water soluble polyalkyloxazoline and water insoluble polymer |
10/13/1994 | WO1994019402A3 Die-attach compositions |
10/05/1994 | EP0618269A1 Thermosetting resin compositions and their use for thin film wiring boards |
09/29/1994 | WO1994021744A1 Three-layer polyimidesiloxane adhesive tape |
09/27/1994 | US5350635 Cyanate resin adhesive for polyimide film |
09/21/1994 | CN1092448A Three-layer polyimidesiloxane adhesive tape |
09/15/1994 | DE4308089A1 Formaldehyde-free binders for wood |
09/06/1994 | US5344982 Adhesives, composites, films, matrices; solvent resistance, modulus, high glass transition temperature |
09/01/1994 | WO1994019402A2 Die-attach compositions |
08/31/1994 | CN1091452A One-coat rubber-to-metal bonding adhesive |
07/07/1994 | WO1994014911A1 Heat-resistant adhesive film for printed board and method of use thereof |
07/06/1994 | EP0605112A2 Insulating adhesive tape, and lead frame and semiconductor device employing the tape |
07/06/1994 | EP0604460A1 Adhesive film. |
06/29/1994 | EP0604319A1 Polyimide solution compositions and process for preparing same |
06/29/1994 | EP0604038A2 Plasticized polyetherimide adhesive compositions |
06/23/1994 | WO1994013669A1 Bisnadimides |
06/23/1994 | CA2150566A1 Bisnadimides |
06/01/1994 | EP0598971A1 Compound capable of adhering on smooth aluminium surfaces and binding with P.T.F.E. film |
06/01/1994 | EP0598911A1 Film adhesive and production thereof |
04/14/1994 | WO1994007968A1 One-coat rubber-to-metal bonding adhesive |
04/05/1994 | US5300812 Plasticized polyetherimide adhesive composition and usage |
04/05/1994 | US5300620 Heat-resistant adhesive and method of adhesion by using adhesive |
03/31/1994 | WO1994006844A1 Fast-curing adhesive of adjustable viscosity |
03/29/1994 | US5298288 Coating a heat curable liquid dielectric on a substrate |
02/22/1994 | US5288519 Insulation layer for mold; hydrolysis of polyamic acid, degreasing, curing, surface oxidation-reduction of formed polyimide |
02/22/1994 | CA1327253C Polymeric amides |
02/15/1994 | US5286417 Fusible electroconductive adhesive |
02/08/1994 | US5284899 Resin paste for tight sealing |
02/02/1994 | EP0580614A1 Process and means for anchoring fastening elements in boreholes |
01/18/1994 | US5280102 Heat-resistant bonding materials |
01/13/1994 | DE4322491A1 Release coating compsn. used for making release film - contg. adduct of poly:amine and mono:isocyanate with long alkyl chain, cpd. reacting with active hydrogen and diluent |
01/11/1994 | US5278276 Polyamic acid precursor; prepared from bis/aminophenoxyphenyl/ compounds and tetracarboxylic acid dianhydrides |
12/09/1993 | WO1993024583A1 Film adhesive and production thereof |
12/09/1993 | WO1993024564A1 Low temperature flexible die attach adhesive and articles using same |
12/07/1993 | US5268432 Heat resistant modified bismaleimide adhesive composition |
12/07/1993 | US5268404 One-coat rubber-to-metal bonding adhesive |
11/10/1993 | EP0396667B1 Processable polyimide adhesive and matrix composite resin |
11/03/1993 | EP0568222A2 Method of producing modified polyimide layer having improved adhesion to metal |
10/19/1993 | US5254412 Heat resisting adhesive material |
10/12/1993 | US5252700 Polyamic acid or polyimide endblocked with aromatic dicarboxylic anhydrides |
10/05/1993 | US5250600 Polyhydroxyl polyesters and polyethers modified with cyanate ester |
09/07/1993 | US5242755 High temperature adhesive |
09/02/1993 | WO1993017059A1 Rapidly curing adhesive and method |
09/02/1993 | WO1993016987A1 Low temperature flexible die attach adhesive and articles using same |
09/01/1993 | EP0557906A1 Heat-resistant adhesive composition |
08/10/1993 | US5234522 Method of producing flexible printed-circuit board covered with coverlay |
08/04/1993 | EP0553612A2 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides |
07/28/1993 | EP0552984A2 Methods of making thin-film wiring boards, thin-film wiring boards made thereby, and adhesive materials |
07/21/1993 | EP0551747A1 Polyetherimide flexible films |
07/11/1993 | CA2085653A1 Polyetherimide/dimethylsiloxane copolymer adhesive system for bonding copper foil to polyetherimide flexible films |
06/30/1993 | EP0549159A2 Method and adhesive for making electrical and mechanical connections |
06/08/1993 | US5218034 Polyimide film with tin or tin salt incorporation resulting in improved adhesion |
06/03/1993 | DE4240224A1 New polyamide-polyamic acid block copolymers or flexible laminates - based on bi:phenyl-3,3,4,4-tetra:carboxylic acid di:anhydride and para-phenylenediamine |
05/25/1993 | US5213648 Identification cards |
05/18/1993 | US5212279 Hot-melt adhesive and its use in polyimide film and printed circuit board |
05/18/1993 | US5212276 Polyimides with improved compression moldability |
04/27/1993 | US5205894 Polyimide and high-temperature adhesive of polyimide |
04/06/1993 | US5200474 Polyimide adhesive composition including barbituric acid modifier |
03/18/1993 | WO1993005122A1 Adhesive film |
03/17/1993 | EP0532461A1 Polymers containing bispyrazole units |
03/17/1993 | EP0531867A1 Resin paste for tight sealing |
03/10/1993 | CA2077569A1 Polymers containing bispyrazole units |
03/04/1993 | WO1992018697A3 Process and means for anchoring fastening elements in boreholes |