| Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
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| 10/11/2000 | EP1042398A1 Adhesives and resins, and processes for their production |
| 10/10/2000 | US6129982 Aromatic polyimide film having improved adhesion |
| 09/19/2000 | CA1341099C Structures exhibiting improved transmission of ultrahigh frequency electromagnetic radiation and structural materials which allow their construction |
| 09/12/2000 | US6117951 Polyimide composition for LOC adhesive tapes |
| 09/06/2000 | CN1265698A Adhesive composition for hot bonding and bonding method using same |
| 09/05/2000 | US6114450 Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resin |
| 08/29/2000 | US6111030 A latent activatable composite comprising a base system chosen from the group consisting of epoxies, polysulfides and polycyanoacrylates which cures upon activation by the reaction of base system and amine terminated polyamide curative |
| 08/23/2000 | EP1028997A1 Water-activated adhesive and paper-plastic tape containing same |
| 08/03/2000 | WO2000026267A8 BRANCHED AND HYPERBRANCHED POLYETHERIMIDES FROM STABLE A1Bn, AB, AA, AND BB MONOMERS; AM ENDCAPPING AGENTS |
| 07/26/2000 | EP1022301A1 Essentially colorless, transparent polyimide coatings and films |
| 07/13/2000 | WO2000020483A3 Impact-resistant epoxide resin compositions |
| 07/06/2000 | WO2000039236A1 Polyamideimidesiloxane hot melt adhesive |
| 06/20/2000 | US6077886 Having improved non slump and sag resistance properties |
| 06/15/2000 | WO2000034406A1 Adhesive powder |
| 06/08/2000 | DE19856254A1 Klebstoffpulver Adhesive powder |
| 05/30/2000 | US6068932 Thermosetting resin composition |
| 05/11/2000 | WO2000026267A1 BRANCHED AND HYPERBRANCHED POLYETHERIMIDES FROM STABLE A1Bn, AB, AA, AND BB MONOMERS; AM ENDCAPPING AGENTS |
| 05/11/2000 | WO2000025628A1 Polymerizable compositions in non-flowable forms |
| 05/10/2000 | EP0998537A1 Adhesive composition for hot bonding and bonding method using same |
| 05/04/2000 | WO2000024841A1 Hot melt adhesive having controllable water solubility |
| 05/04/2000 | CA2347291A1 Hot melt adhesive having controllable water solubility |
| 04/25/2000 | US6054528 Aqueous compositon of a bis(1,3,4-oxadiazolin-5-one) such as 1,4-bis(1,3,4-oxadiazolin-5-one-2-yl) butane, and a polyamine having more than 2 primary or secondary amine groups; curable to form clear coats; gives off no volatiles |
| 04/20/2000 | DE19845607A1 Schlagfeste Epoxidharz-Zusammensetzungen Resistant epoxy resin compositions |
| 04/19/2000 | CN1251119A Polymeric amines |
| 04/13/2000 | WO2000020483A2 Impact-resistant epoxide resin compositions |
| 04/13/2000 | CA2346634A1 Impact-resistant epoxide resin compositions |
| 04/05/2000 | EP0991306A1 Film for flexible printed wiring board |
| 04/05/2000 | EP0990686A2 Adhesive film for semiconductor package |
| 04/04/2000 | US6045886 Adhesive tape for electronic parts |
| 03/29/2000 | EP0663417B1 Polyimide laminate comprising thermoplastic polyimide polymer or thermoplastic polyimide film, and process for producing the laminate |
| 03/29/2000 | CN1248603A Small chip adhesion agent for microelectronic device |
| 03/28/2000 | US6042685 Multiple wire printed circuit board and process for making the same |
| 03/08/2000 | EP0984051A1 Heat-resistant adhesives and semiconductor devices produced therewith |
| 03/08/2000 | EP0880555B1 Method of making free-standing polyimide film |
| 03/07/2000 | US6034168 N-substituted alkyleneimine copolymer |
| 01/05/2000 | EP0969065A2 Die attach adhesives for use in microelectronic |
| 12/14/1999 | US6001507 Non-aqueous electrolyte secondary battery |
| 11/30/1999 | US5994432 Storage-stable/clear solutions of poly(imideamides) |
| 11/17/1999 | EP0689571B1 Three-layer polyimidesiloxane adhesive tape |
| 11/16/1999 | US5986038 Adhesive composition |
| 11/09/1999 | US5980690 Creping adhesives containing oxazoline polymers and methods of use thereof |
| 11/03/1999 | EP0953621A1 Adhesive resin composition and sealing resin composition |
| 10/26/1999 | US5972518 Corrosion protection of iron/steel by emeraldine base polyaniline |
| 10/05/1999 | US5961768 Apparatus for applying adhesive sheets |
| 09/28/1999 | US5959068 Adhesive tape for electronic parts and liquid adhesive |
| 09/21/1999 | US5955543 Polymer adhesives for electroconductive or thermal conductive fillers |
| 09/14/1999 | US5952438 Polymeric polyamines from alternating polyketones |
| 08/31/1999 | US5945188 Insulating film of adhesive layer, polyamide resin, inorganic filler, epoxy resin layer with siloxane |
| 08/24/1999 | US5942592 Reacting a diamine mixture comprising diaminopolysiloxane, an alicyclic diamine and an aromatic diamine with aromatic tetracarboxylic acid or anhydride and polyimidizing the resulting polyamic acid |
| 08/19/1999 | DE19805620A1 Hot melt adhesive for gumming paper, e.g. envelopes, postage stamps or packaging material |
| 08/10/1999 | US5935372 Adhesive sealant for bonding metal parts to ceramics |
| 08/10/1999 | CA2156835C Three-layer polyimidesiloxane adhesive tape |
| 08/03/1999 | US5932345 Thermally fusible adhesive copolymer, articles made therefrom, and method for producing the same |
| 07/28/1999 | EP0931803A1 Polymer compositions, their preparation and their use |
| 07/28/1999 | EP0775716B1 Novel heat-fusible copolymer, and powder, film, laminated heat insulator, electronic module, and capacitor produced from said copolymer, and process for producing the same |
| 07/27/1999 | US5928757 Polyimide |
| 07/22/1999 | WO1999036465A1 Adhesives and resins, and processes for their production |
| 07/22/1999 | CA2317686A1 Adhesives and resins, and processes for their production |
| 07/20/1999 | US5925711 Polyamines and their use in aqueous coating compositions |
| 07/13/1999 | US5922167 Bending integrated circuit chips |
| 06/02/1999 | EP0919593A1 Aromatic polyimide film having improved adhesion |
| 05/20/1999 | WO1999024505A1 Water-activated adhesive and paper-plastic tape containing same |
| 05/18/1999 | US5905115 Adduct of oligosaccharide and polyalkylene-amine; adhesives, biodegradable; amination, condensation |
| 05/06/1999 | EP0913429A2 Siloxane-modified polyamideimide resin composition adhesive film, adhesive sheet and semiconductor device |
| 04/28/1999 | CN1215501A Semiconductor device and method for manufacturing the same |
| 04/27/1999 | US5897339 Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same |
| 04/14/1999 | EP0908497A2 Dispensable resin paste |
| 04/07/1999 | EP0830410B1 Aromatic cyanate ester silane coupling agents |
| 04/06/1999 | US5891540 Adhesive tape for electronic parts |
| 03/17/1999 | EP0714555B1 High-voltage breakover diode |
| 03/10/1999 | EP0676456B1 Heat-resistant adhesive film for printed board and method of use thereof |
| 02/11/1999 | WO1999006499A1 Adhesive composition for hot bonding and bonding method using same |
| 02/09/1999 | US5869161 Tape comprising solvent-containing non-tacky, free-standing, fully imidized polyimide film |
| 02/02/1999 | US5866250 Adhesive tape for electronic parts and liquid adhesive |
| 01/27/1999 | EP0893465A2 Self hardenining aqueous binders for coatings, adhesives and sealings |
| 01/24/1999 | CA2243391A1 Aqueous coating, adhesive and sealant compositions containing oxadiazolinones and polyamines |
| 01/12/1999 | US5859181 Reacting diaminopolysiloxane, alicyclic diamine, aromatic tetracarboxylic acid, imidating resulting polyamic acid |
| 01/12/1999 | US5859170 Aromatic ploycarbodiimine and sheet using it |
| 01/12/1999 | US5858554 Paper towels; wet strength |
| 01/12/1999 | US5858171 Applying to surface of drying cylinder diluted creping adhesive comprising oxazoline polymer and resin which is reaction product of polyamide and epihalohydrin, creping paper from surface |
| 01/05/1999 | US5856425 From maleimide and a liquid diamine |
| 12/23/1998 | CN1202908A Modified polyalkadiene-containing compositions |
| 12/22/1998 | US5851616 Adhesive tape for electronic parts and liquid adhesive |
| 12/09/1998 | EP0883170A1 Semiconductor device and method for manufacturing the same |
| 12/09/1998 | EP0882108A1 Polyamide based laminating, coverlay, and bond ply adhesive with heat activated cure component |
| 12/03/1998 | WO1998054267A1 Heat-resistant adhesives and semiconductor devices produced therewith |
| 12/02/1998 | EP0880555A1 Method of making free-standing polyimide film |
| 12/01/1998 | US5843550 Adhesive tape for tape automated bonding |
| 11/25/1998 | CN1200156A Paper product comprising adhesively joined plies |
| 11/24/1998 | US5840829 Plateable structural adhesive for cyanate ester composites |
| 11/24/1998 | US5840823 Aqueous polyurethane dispersions having latent crosslinking properties |
| 11/17/1998 | US5837768 Multipolymer blend of polyoxazoline, polyethyleneimine and modified polyethyleneimine |
| 11/04/1998 | CN1197819A 热固性树脂组合物 The thermosetting resin composition |
| 11/03/1998 | US5830949 Adhesive resin composition and adhesive sheet |
| 10/14/1998 | EP0842212A4 Imide oligomers and co-oligomers containing pendent phenylethynyl groups and polymers therefrom |
| 10/13/1998 | US5821628 Semiconductor device and two-layer lead frame for it |
| 10/13/1998 | US5821294 Water-based laminating adhesives |
| 10/07/1998 | EP0869151A2 Thermosetting resin composition |
| 10/01/1998 | CA2285082A1 Polymeric amines |
| 09/30/1998 | EP0866809A1 Modified polyalkadiene-containing compositions |