| Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
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| 03/30/2011 | EP2301344A1 Wood protection agent as fungicide for use in wood fibre boards |
| 03/30/2011 | EP2222811B1 Creping adhesives comprising blends of high and low molecular weight resins |
| 03/17/2011 | US20110064953 Assemblies and Methods for Reducing Warp and Bow of a Flexible Substrate During Semiconductor Processing |
| 03/16/2011 | EP2295489A1 Linear polyimide precursor, linear polyimide, thermally cured product of the linear polyimide, and method for producing the linear polyimide |
| 03/09/2011 | EP2292713A1 Flame-retardant adhesive composition and laminated film |
| 02/24/2011 | WO2011022668A1 Modified binders for making fiberglass products |
| 02/24/2011 | WO2011022224A1 Cellulosic composite |
| 02/24/2011 | WO2011022222A1 Improved performance polymeric fiber webs |
| 02/24/2011 | CA2771321A1 Modified binders for making fiberglass products |
| 02/23/2011 | CN101979451A Adhesive film, flexible metal-clad laminate, and processes for producing these |
| 02/17/2011 | WO2011019598A1 Curable fiberglass binder |
| 02/17/2011 | WO2011019593A1 Curable fiberglass binder |
| 02/17/2011 | DE112009000990T5 Verbundteil und Verfahren zu seiner Herstellung Composite member, and process for its preparation |
| 02/17/2011 | CA2770101A1 Curable fiberglass binder |
| 02/09/2011 | CN101967362A Special sealant with electrochemical activity for resisting crevice corrosion and preparation method thereof |
| 02/08/2011 | USRE42110 Fibrous sheet binders |
| 02/08/2011 | US7884174 Imide-linked maleimide and polymaleimide compounds |
| 02/02/2011 | CN101134857B Primer, conductor foil with resin, laminate and process for producing the laminate |
| 01/27/2011 | WO2011009812A1 Adhesive system and method of producing a wood based product |
| 01/19/2011 | CN101278026B Adhesive and laminates made by using the same |
| 01/18/2011 | US7871698 Adhesive film, flexible metal-clad laminate, and processes for producing these |
| 01/13/2011 | WO2011004706A1 Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these |
| 01/12/2011 | CN101942280A Adhesive film, flexible metal-clad laminate, and processes for producing these |
| 01/06/2011 | WO2011001942A1 Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same |
| 01/05/2011 | DE10331825B4 Lichtemissionsdiode mit einer Kleberschicht und zugehöriges Herstellverfahren Light emitting diode having an adhesive layer and associated manufacturing process |
| 01/05/2011 | CN101935514A Novel foam structural adhesive and preparation method thereof |
| 01/05/2011 | CN101934663A Thermal transfer sheet |
| 12/29/2010 | CN101932629A Highly adhesive polyimide copper clad laminate and method of making the same |
| 12/22/2010 | CN1957051B Method for producing adhesive film |
| 12/22/2010 | CN101921565A Preparation method of solvent-free and high temperature-resistant adhesive |
| 12/22/2010 | CN101921557A Halogen-free flame-retardant adhesive composition and flexible copper-clad plate using same |
| 12/22/2010 | CN101921482A 热固性聚酰亚胺树脂及其制备方法 Thermosetting polyimide resin and its preparation method |
| 12/15/2010 | CN101914357A Epoxy-organic silicon polyimide adhesive and preparation method thereof |
| 12/09/2010 | WO2010141397A1 Adhesive composition based on benzoxazine-thiol adducts |
| 12/08/2010 | CN101910350A Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor device |
| 12/01/2010 | EP2257141A2 Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
| 11/30/2010 | US7843045 capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional polyimide resin without generation of voids; reaction of 1,3-bis(3-aminophenoxy)benzene, for example, and an acid component |
| 11/24/2010 | CN101027345B Novel polyimide film and adhesive film and flexible metal-clad laminate both obtained with the same |
| 11/17/2010 | CN101885900A Resin composition, bonding sheet and copper-clad plate made using same, manufacturing method thereof |
| 11/11/2010 | WO2010128667A1 Thermosetting polyimide resin composition, cured product, and adhesive |
| 11/10/2010 | CN101884104A Photosensitive adhesive |
| 11/03/2010 | CN101875830A Phenolic resin/phosphate hybrid adhesive and preparation method thereof |
| 11/03/2010 | CN101875825A Halogen-free flame retardant adhesive composition and flexible copper-clad plate using same |
| 10/27/2010 | CN101874090A Creping adhesives comprising blends of high and low molecular weight resins |
| 10/20/2010 | CN101864269A Thermal conductive adhesive |
| 10/20/2010 | CN101864268A Thermal conductive adhesive |
| 10/13/2010 | CN101494953B Preparation method of double-layer method flexibility two-side coated copper plate for multilayer flexibility printed circuit |
| 10/07/2010 | WO2010113813A1 Base-generating agent, photosensitive resin composition, patterning material comprising the photosensitive resin composition, patterning method and article using the photosensitive resin composition |
| 10/07/2010 | WO2010113759A1 Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing same |
| 09/30/2010 | WO2010088648A3 Structural adhesives containing maleimide terminated polyimides |
| 09/29/2010 | EP2231743A2 Curable benzoxazine macromonomers, their preparation and cured products thereof |
| 09/29/2010 | CN101845143A Modified bismaleimide resin as well as preparation method and application thereof |
| 09/23/2010 | US20100239858 Film-like adhesive, adhesive sheet, and semiconductor device using same |
| 09/15/2010 | CN101831264A Isotropic high-performance thermal conductive adhesive for filling carbon nano tube |
| 09/15/2010 | CN101831073A Method for preparing bisphenol-A phenolic benzoxazine resin |
| 09/10/2010 | WO2010102186A1 Adhesive compositions for bonding composites |
| 09/08/2010 | EP2226373A1 Adhesive compositions comprising a cyanate ester resin and amorphous carbon |
| 09/04/2010 | CA2691850A1 Low radio frequency loss, static dissipative adhesives |
| 09/01/2010 | EP2224483A1 Photosensitive adhesive |
| 08/18/2010 | CN1866430B Electrochemical capacitor electrode production method |
| 08/17/2010 | CA2459379C Adhesive for gas barrier laminates and laminated films |
| 08/12/2010 | US20100203324 Laminate of heat resistant film and metal foil, and method for production thereof |
| 08/11/2010 | CN101803484A Partially rigid flexible circuits and method of making same |
| 08/11/2010 | CN101798490A Adhesive composition, adhesive sheet, dicing die attach film and semiconductor device |
| 08/05/2010 | WO2010088648A2 Structural adhesives containing maleimide terminated polyimides |
| 08/03/2010 | CA2390846C Adhesive sheet and adhesive preparation, and production methods thereof |
| 07/28/2010 | EP2210927A1 A red and green dry adhesive, a method producing the same |
| 07/22/2010 | WO2010082658A1 Resin composition |
| 07/21/2010 | CN101781544A Adhesive composition and application thereof |
| 07/14/2010 | CN1784457B Imide-linked maleimide and polymaleimide compounds |
| 07/06/2010 | US7750113 Supramolecular polymers |
| 06/24/2010 | WO2010070947A1 Resin paste for die bonding, method for producing semiconductor device, and semiconductor device |
| 06/23/2010 | EP2198680A1 Partially rigid flexible circuits and method of making same |
| 06/23/2010 | CN101747684A Paste composition for forming heat-resistant conductive patterns on substrate |
| 06/23/2010 | CN101228621B Adhesive composition for semiconductor, semiconductor device using the same and method for producing semiconductor device |
| 06/16/2010 | CN101735611A Thermosetting resin composition with high heat conductivity, prepreg manufactured by adopting same and copper-clad laminate |
| 06/16/2010 | CN101735456A High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby |
| 06/16/2010 | CN101177055B Method of preparing modified benzoxazine glass cloth veneer sheet |
| 06/03/2010 | US20100135940 Semi-crystalline supramolecular polymers |
| 06/02/2010 | CN101717613A High-temperature resistant copper foil glue and preparation and application thereof |
| 05/27/2010 | WO2010059699A1 Creping adhesives with improved film properties |
| 05/27/2010 | CA2740599A1 Creping adhesives with improved film properties |
| 05/19/2010 | CN101709212A High-temperature resistant adhesive containing phosphonyl polyimide and preparation method thereof |
| 05/19/2010 | CN101709029A Polybenzimidazole material and midbody organic diacid thereof as well as preparation methods thereof |
| 05/14/2010 | WO2010053185A1 Resin composition for printed wiring board |
| 05/12/2010 | CN1927976B Preparation method for laminated tube insulating rubberized fabric |
| 05/11/2010 | CA2412738C Stretch releasing pressure sensitive adhesive tapes and articles |
| 04/28/2010 | CN1637034B Polyurethane-imide resin,adhesive composition and adhesive composition for circuit connection |
| 04/15/2010 | WO2010041644A1 Polyamideimide resin, adhesive composition using the resin, ink for printed circuit board using the adhesive composition, cover lay film, adhesive sheet and printed circuit board |
| 04/08/2010 | WO2010038644A1 Polyamide resin, resin composition thereof, flame-retardant adhesive composition and adhesive sheet made of said composition, coverlay film, and printed wiring board |
| 03/25/2010 | WO2010032529A1 Semiconductor device and method for manufacturing the same |
| 03/24/2010 | CN101681104A Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing |
| 03/24/2010 | CN101679832A Adhesive composition and adhesive film using the same |
| 03/24/2010 | CN101679612A Resin composition for interlayer insulation of multilayer printed wiring board |
| 03/18/2010 | DE102008046873A1 Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated adhesive tape particularly for bonding electronic components and conductor tracks |
| 03/16/2010 | US7678315 Process for producing adhesive film |
| 03/11/2010 | WO2010028062A1 Protein/cationic polymer compositions having reduced viscosity |
| 03/11/2010 | CA2734270A1 Protein/cationic polymer compositions having reduced viscosity |
| 03/04/2010 | WO2010024295A1 Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component |
| 03/04/2010 | WO2010024236A1 Double-faced adhesive film and electronic component module using same |