| Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
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| 09/23/1998 | CN1194019A Multi-ply paper product |
| 09/02/1998 | EP0861281A1 Thermosetting polymers for composite and adhesive applications |
| 08/06/1998 | DE19804617A1 Soluble siloxane-polyimide for heat-resistant adhesive |
| 07/22/1998 | EP0854179A1 Circuit board adhesives for soldering environments |
| 07/16/1998 | CA2222053A1 Circuit board adhesives for soldering environments |
| 07/14/1998 | US5780581 Plateable structural adhesive for cyanate ester composites |
| 07/01/1998 | EP0850976A1 Polymer polyamines from alternating polyketones |
| 06/30/1998 | US5773561 Polymer sealants/adhesives and use thereof in electronic package assembly |
| 06/30/1998 | US5773509 Heat resistant resin composition, heat resistant film adhesive and process for producing the same |
| 06/25/1998 | DE19756554A1 Hot melt adhesives used to bond copper films on flexible printed substrates to basis materials |
| 06/24/1998 | EP0848770A1 Paper product comprising adhesively joined plies |
| 06/23/1998 | US5770676 Polyimides; molding materials; adhesives |
| 06/18/1998 | DE19754445A1 Verfahren zur Herstellung von Polyesterimidolacken A process for preparing Polyesterimidolacken |
| 06/10/1998 | EP0846202A1 Multi-ply paper product |
| 06/03/1998 | CN1183887A Printed wiring board(s) having polyimidebenzoxazole dielectric layer(s) and manufacture thereof |
| 06/02/1998 | US5760168 Imide oligomers endcapped with phenylethynl phthalic anhydrides and polymers therefrom |
| 05/20/1998 | EP0842212A1 Imide oligomers and co-oligomers containing pendent phenylethynyl groups and polymers therefrom |
| 05/20/1998 | EP0649893B1 Adhesive tape for electronic parts and liquid adhesive |
| 05/20/1998 | EP0598911B1 Film adhesive and production thereof |
| 05/19/1998 | US5753748 Bleed resistant cyanate ester-containing compositions |
| 05/06/1998 | EP0839826A2 Sugar amines and amides and their use as a glue |
| 04/22/1998 | CN1179445A Adhesive resin composition and adhesive sheet |
| 04/15/1998 | EP0835910A1 Curable resin compositions |
| 04/14/1998 | US5739263 Polyimide; heat resistance, adhesion |
| 04/01/1998 | EP0832907A1 Adhesive resin composition and adhesive sheet |
| 03/31/1998 | US5734008 Polyimide film |
| 03/25/1998 | EP0830410A1 Aromatic cyanate ester silane coupling agents |
| 03/18/1998 | CN1176489A Lead-on-chip semiconductor device package having adhesive layer formed from liquid adhesive and method for manufacturing the same |
| 03/17/1998 | US5728473 Multilayer composites on silicon plates, copper films and polyimidesiloxane adhesives |
| 03/10/1998 | US5725948 Polyimide from a bismaleimide and a diamine |
| 03/04/1998 | EP0826294A1 Printed wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof |
| 02/28/1998 | CA2207558A1 Water-based laminating adhesives |
| 02/17/1998 | US5718941 For adhesive compositions |
| 02/12/1998 | DE19733339A1 Film coating unit for flat plates, especially semiconductor wafers |
| 02/10/1998 | CA2143260C One-coat rubber-to-metal bonding adhesive |
| 01/20/1998 | US5710463 High-voltage breakover diode |
| 01/14/1998 | EP0818492A2 Polyamines and their use in aqueous paints and coatings |
| 01/07/1998 | CN1169441A Aromatic polycarbodiimide and sheet using it |
| 12/29/1997 | EP0814138A2 Tape comprising solvent-containing non-tacky, free-standing, fully imidized polyimide film |
| 12/29/1997 | EP0705314B1 One-coat rubber-to-metal bonding adhesive |
| 12/17/1997 | CA2206713A1 Tape comprising solvent-containing non-tacky, free-standing, fully imidized polyimide film |
| 12/03/1997 | EP0810244A2 Aromatic polycarbodiimide and sheet using it |
| 12/02/1997 | US5693406 Embossed tissue paper toweling, bath tissue; wet strength |
| 11/18/1997 | US5689004 Diamines containing pendent phenylethynyl groups |
| 11/12/1997 | EP0235294B1 Polyimides and heat-resistant adhesives comprising the same |
| 11/11/1997 | US5686191 Polyimide adhesive, elasticity |
| 11/11/1997 | US5686180 Water activated adhesive and paper-plastic tape containing same |
| 10/28/1997 | US5681967 Phenylethynyl phthalic anhydride |
| 10/21/1997 | US5679730 Good thixotropy and low stringiness obtained by adding water and a polycarbodimide to the mixture of liquid epoxy resin, thixotropic agent and filler; adhesion to metals; corrosion resistance |
| 10/14/1997 | US5677393 Heat-resistant film adhesive for use in fabrication of printed circuit boards and process for using the same |
| 09/23/1997 | US5670262 High strength films as dielectric layers |
| 09/16/1997 | US5667851 Process for preparing a metallized polymide film containing a hydrocarbyl tin compound |
| 09/10/1997 | EP0794204A2 Latently crosslinking aqueous polyurethane dispersions |
| 09/03/1997 | CN1158607A Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| 08/28/1997 | WO1997031394A1 Semiconductor device and method for manufacturing the same |
| 08/28/1997 | WO1997031078A1 Polyamide based laminating, coverlay, and bond ply adhesive with heat activated cure component |
| 08/20/1997 | EP0672044A4 Bisnadimides. |
| 07/15/1997 | US5648432 Process for controlling morphology and improving thermal-mechanical performance of high performance interpenetrating and semi-interpenetrating polymer networks |
| 07/10/1997 | DE19600135A1 Solvent-free, curable adhesive varnish for copper wire etc. |
| 07/08/1997 | US5646241 Adhesives |
| 06/19/1997 | WO1997021735A1 Modified polyalkadiene-containing compositions |
| 06/18/1997 | EP0778857A2 Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| 06/12/1997 | DE19545571A1 Improved bonding of paper, plastics or metal films etc. |
| 06/10/1997 | US5637670 Polybenzimidazoles via aromatic nucleophilic displacement |
| 05/28/1997 | EP0775716A1 Novel heat-fusible copolymer, and powder, film, laminated heat insulator, electronic module, and capacitor produced from said copolymer, and process for producing the same |
| 05/28/1997 | EP0686170A4 Die-attach compositions |
| 05/27/1997 | US5633328 Release coating composition and release sheet |
| 05/27/1997 | US5633309 Creping adhesives containing oxazoline polymers |
| 05/22/1997 | WO1997018259A1 Method of making free-standing polyimide film |
| 05/22/1997 | WO1997018254A1 Thermosetting polymers for composite and adhesive applications |
| 05/22/1997 | CA2237359A1 Thermosetting polymers for composite and adhesive applications |
| 05/02/1997 | EP0770657A2 Plateable structural adhesive for cyanate ester composites |
| 05/02/1997 | EP0770656A2 Metal-filled, plateable structural adhesive for cyanate ester composites |
| 04/15/1997 | US5621068 Thermoplastic polyimide polymer; thermoplastic polyimide film; polyimide laminate; and method of manufacturing the laminate |
| 04/15/1997 | US5620553 Photopolymerisable liquid compositions for bonding friction material to metal |
| 03/27/1997 | WO1997011226A1 Paper product comprising adhesively joined plies |
| 03/18/1997 | US5612403 Low temperature flexible die attach adhesive and articles using same |
| 03/06/1997 | WO1997008387A1 Multi-ply paper product |
| 02/25/1997 | US5606014 Imide oligomers and co-oligomers containing pendent phenylethynyl groups and polymers therefrom |
| 02/25/1997 | US5605763 Electrically conductive bonding films |
| 02/20/1997 | WO1997006200A1 Imide oligomers and co-oligomers containing pendent phenylethynyl groups and polymers therefrom |
| 02/18/1997 | US5604041 Method of making free-standing polyimide film |
| 02/11/1997 | US5602209 Blend of polyethyleneimine and oxazoline polymer; imparts softness and bleaching resistance to cellulose web |
| 01/29/1997 | EP0755979A2 Thermosetting resin compositions and their use for thin film wiring boards |
| 01/15/1997 | CN1140191A Emery grinding wheel binder |
| 12/12/1996 | WO1996039457A1 Aromatic cyanate ester silane coupling agents |
| 12/12/1996 | CA2221359A1 Aromatic cyanate ester silane coupling agents |
| 12/11/1996 | EP0747434A2 Epoxy resin composition and adhesive based thereon |
| 11/26/1996 | US5578696 Heat resistant adhesive film, an adhesion structure, and method of adhesion |
| 11/14/1996 | WO1996036204A1 Printed wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof |
| 11/14/1996 | WO1996035760A1 Bleed resistant cyanate ester-containing compositions |
| 11/06/1996 | CN1134967A Polyimidesiloxane adhesive |
| 10/22/1996 | US5567800 Imide oligomers endcapped with phenylethynyl phthalic anhydrides and polymers therefrom |
| 09/04/1996 | EP0729995A1 Polyimide and high-temperature adhesive of polyimide |
| 08/28/1996 | EP0728792A2 Heat-resistant adhesive and method of adhesion by using adhesive |
| 08/15/1996 | WO1996007691A3 Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| 08/06/1996 | US5543222 Metallized polyimide film containing a hydrocarbyl tin compound |
| 07/18/1996 | WO1996021693A1 Novel heat-fusible copolymer, and powder, film, laminated heat insulator, electronic module, and capacitor produced from said copolymer, and process for producing the same |
| 06/05/1996 | EP0714555A1 High-voltage breakover diode |
| 06/04/1996 | US5523137 Adhesive paper for tape automated bonding |