Patents
Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765)
01/1993
01/28/1993DE4224567A1 Adhesive tape for tape automated bonding - has adhesive layer comprising polyamide resin, layer contg. inorganic filler, layer contg. siloxane] epoxide] resin and layer contg. maleimide resin
01/19/1993US5180627 Heat resistant adhesive composition
01/13/1993EP0522736A2 Photopolymerisable liquid compositions
12/1992
12/23/1992EP0519634A2 Amorphous polyimide powder, preparation process of the powder, and heat-resistant adhesive and bonding method by use of the powder
11/1992
11/04/1992EP0511813A2 Heat-resistant adhesive and method of adhesion by using adhesive
10/1992
10/29/1992WO1992018697A2 Process and means for anchoring fastening elements in boreholes
10/20/1992CA1309006C Organopolysiloxane hot-melt adhesive
10/15/1992DE4139069A1 Verfahren und mittel zum verankern von schrauben in bohrloechern A method and means for anchoring screws in boreholes
09/1992
09/01/1992US5143961 Hot melt adhesive comprising water soluble polyalkyloxazoline and water insoluble polymer
09/01/1992US5143785 Curable adhesive
08/1992
08/04/1992US5135815 Reactive-oligoimide adhesives, laminates, and methods of making the laminates
06/1992
06/10/1992EP0489429A1 Method of producing flexible printed-circuit board covered with cover layer
06/03/1992EP0488066A1 Chemically etchable adhesives
06/03/1992EP0488062A1 Laminates utilizing chemically etchable adhesives
05/1992
05/27/1992CA2055919A1 Chemically etchable adhesives
05/27/1992CA2055878A1 Laminates utilizing chemically etchable adhesives
05/06/1992EP0483699A1 Reactive-oligoimide adhesives, laminates, and methods of making the laminates
05/01/1992CA2054282A1 Reactive-oligoimide adhesives, laminates, and methods of making the laminates
03/1992
03/25/1992EP0476575A2 Polyimide film with tin or tin salt incorporation resulting in improved adhesion
03/22/1992CA2051795A1 Polyimide film with tin or tin salt incorporation resulting in improved adhesion
03/17/1992US5096998 Unsaturated imide end groups, multilayer flexible metal-clad laminates
03/05/1992WO1992003516A1 Cyanate ester adhesives for electronic applications
03/03/1992US5093202 Method of gluing substrates using a composition comprising an arylaliphatic copolyimide with ether chain formations and an epoxy resin
02/1992
02/11/1992US5087689 Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines
01/1992
01/28/1992US5084345 Laminates utilizing chemically etchable adhesives
01/15/1992EP0466616A1 Limpid poly(imide-amide) solutions at room temperature and stable when stored and their method of preparation
01/10/1992CA2046477A1 Ambient temperature clear polyimide-polyamide solutions remaining stable during storage and process for obtaining same
12/1991
12/18/1991EP0461466A1 Heat-resistant adhesive and adhesion method using said adhesive
09/1991
09/25/1991EP0447692A1 Laminated product
09/17/1991US5049421 Using polyimide adhesive; curing
07/1991
07/23/1991CA1286818C Rapid curing, thermally stable adhesive
06/1991
06/19/1991EP0428598A4 Processible polyimide blends
06/11/1991US5023107 Improved adhesion; pretreatment with magnesium salt and alkyl quaternary ammonium salt or (poly)biguanide; dentistry
05/1991
05/29/1991EP0428618A1 Polyimide insulated coaxial electric cable
05/29/1991EP0428598A1 Processible polyimide blends
05/29/1991CA2004130A1 High performance epoxy based laminating adhesive
03/1991
03/19/1991US5001193 Epoxy adhesive for bonding of automotive parts made from bulk or sheet molding compound containing polymeric toughening agent and Mannich Base
02/1991
02/26/1991US4996290 Polyester amides containing imide groups, process for their production and their use as hot-melt adhesives
02/26/1991US4996101 Interpenetrating polymer network of thermoplastic polyisoimides and thermosetting resin
11/1990
11/20/1990CA1276746C Copolyimides with a combination of flexibilizing groups
10/1990
10/17/1990EP0392354A1 Curable bismaleimide adducts
10/13/1990CA2014380A1 Curable bismaleimide adducts
10/03/1990EP0390119A1 Heat-resistant bonding materials
10/02/1990CA1274938A1 Polyimide and high-temperature adhesive of polyimide
10/02/1990CA1274937A1 Polyimide for high-temperature adhesive
09/1990
09/26/1990EP0388638A1 Polyesteramides containing imide groups, process for their preparation and their use as hotmelt adhesives
09/25/1990US4959440 Polymide for high-temperature adhesive
09/25/1990US4959437 Process for producing a low thermally expansive and highly adhesive silicon-containing polyimide and a precursor thereof
09/18/1990CA2012362A1 Polyester amides containing imide groups, process for their production and their use as hot-melt adhesives
09/11/1990US4956423 Polyamides and polyamidepolyether copolymers, blends
09/11/1990US4956393 Structures exhibiting improved transmission of ultrahigh frequency electromagnetic radiation and structural materials which allow their construction
09/11/1990CA1274030A1 Polyalkyloxazoline-reinforced acrylic pressure- sensitive adhesive composition
09/04/1990US4954578 Fine domain composite films of polyimide mixtures
08/1990
08/29/1990EP0384704A2 Die attach material and die attach process
07/1990
07/24/1990US4943620 Method for the preparation of a silicone-based pressure-sensitive adhesive
07/04/1990EP0375874A2 Epoxy adhesive for bonding of automotive parts made from bulk or sheet molding compound
07/03/1990US4939317 Polyimide insulated coaxial electric cable
06/1990
06/26/1990US4937317 From 4,4'-isophthaloyldiphthalic anhydride and m-phenylenediamine
05/1990
05/29/1990CA1269783A1 Heat sealable water dispersible adhesive
05/17/1990WO1990005153A1 Processable polyimide adhesive and matrix composite resin
05/16/1990CN1042168A Polyimide film die attach adhesives
05/02/1990EP0366307A2 Fine domain composite films of polyimide mixtures
05/01/1990CA1268592A1 Polyimide and high-temperature adhesive of polyimide
04/1990
04/24/1990CA1268278A1 Moisture actuated hot melt adhesive
04/04/1990EP0361728A2 Adhesive polyimide compositions
03/1990
03/07/1990EP0357006A1 Structures exhibitting improved transmission of ultrahigh frequency electromagnetic radiation and structural materials which allow their construction
02/1990
02/22/1990WO1990001777A1 Polyimide insulated coaxial electric cable .
02/22/1990WO1990001522A1 Processible polyimide blends
01/1990
01/30/1990US4896788 Packaging means having tab sealing means attached with solvent-free hot melt adhesive, hot melt adhesive therefor and method of adhesive bonding using said adhesive
01/30/1990CA1264911A1 Elongated molding granules and injection-molding process employing them
12/1989
12/19/1989CA1263983A1 Aqueous adhesive compositions
09/1989
09/27/1989EP0333734A1 Attachment of semiconductor die to lead frame by means of an adhesive resin
08/1989
08/30/1989EP0329833A2 Polymeric amides
08/29/1989US4861862 Polyetherimide amide from polyoxyalkylene diimide dicarboxylic acid
08/22/1989US4859530 High temperature adhesive for polymide films
08/16/1989EP0232655B1 Compositions comprising arylaliphatic copolyimides with ether links and epoxy resins, and their use as adhesives
07/1989
07/11/1989US4847349 Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines
06/1989
06/20/1989US4840693 Organopolysiloxane hot-melt adhesive
06/14/1989EP0319839A2 Silicone rubber adhesive films
04/1989
04/11/1989US4820779 Adduct of a carbinol-containing polyimide oligomer terminated with epoxide-reactive groups and a polyepoxide
04/04/1989US4818615 Elongated molding granules and injection-molding process employing them
03/1989
03/28/1989CA1251798A1 High temperature stable adhesive composition employing aromatic polyimide and polyisoimide bis- acetylene additives
01/1989
01/25/1989EP0300821A2 Method of adhesion using organopolysiloxane hot-melt adhesive
01/11/1989EP0298668A2 High temperature adhesive for polyimide films and its use
01/11/1989EP0298319A1 Hot melt adhesive comprising water soluble polyalkyloxazoline and water insoluble polymer
01/10/1989US4797466 High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine
01/04/1989EP0297756A1 Processes for producing a silicon-containing polyimide and a precursor therefor
01/04/1989EP0297451A1 Hot melt adhesive comprising an N-substituted polyalkyleneimine and acid functional component
12/1988
12/28/1988EP0296505A1 Aqueous compositions containing a polymeric fat acid polyamide
09/1988
09/28/1988EP0283805A2 Packaging with a heat-resistant bonded tongue, especially a tab on a wall part of a container, adhesive therefor and method of bonding this tab
06/1988
06/01/1988EP0269421A2 Polyalkyloxazoline-reinforced acrylic pressure-sensitive adhesive composition
06/01/1988EP0269420A2 Moldable medical adhesive
05/1988
05/25/1988CN87107692A Method of fabricating semiconductor devices
05/19/1988WO1988003704A1 Attachment of semiconductor die to lead frame by means of an adhesive resin
04/1988
04/26/1988US4740830 Low temperature single step curing polyimide adhesive
04/12/1988US4737410 Polyalkyloxazoline-reinforced acrylic pressure-sensitive adhesive composition
03/1988
03/29/1988US4734482 Polyimide from ether diamine having the indane structure and high-temperature adhesive of polyimide
03/09/1988EP0258556A2 Carbinol-containing polyimide oligomers terminated with epoxide-reactive groups, and the epoxide adducts thereof
12/1987
12/22/1987US4714726 Bismaleimide, silver powder, electron donor solvent
12/09/1987EP0248384A1 Elongated molding granules and injection-molding process employing them
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