| Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
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| 02/15/2012 | CN101501151B 粘接剂组合物和电路部件的连接结构 Connection structure adhesive composition and the circuit member |
| 02/08/2012 | EP2415592A1 Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing same |
| 02/08/2012 | EP2042540B1 Polyimide resin |
| 02/07/2012 | US8110652 Polyimide resin |
| 02/02/2012 | US20120029115 Room-temperature curable epoxy structural adhesive composition and preparation method thereof |
| 01/26/2012 | WO2011126707A3 Article and an adhesive for a roll-shaped paper |
| 01/25/2012 | CN102329582A Durable thermoset binder compositions from 5-carbon reducing sugars and use as wood binders |
| 01/25/2012 | CN102329511A Dedoping-resistant dye-doped polyaniline and preparation method and application thereof |
| 01/19/2012 | US20120012999 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device |
| 01/18/2012 | CN102321447A High-heat-resistance toughened epoxy resin composition and application thereof in bonding sheet and copper-clad board |
| 01/12/2012 | WO2012005079A1 Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each |
| 01/12/2012 | US20120010364 Encapsulated cure systems |
| 01/12/2012 | US20120007259 Latent hardener with improved barrier properties and compatibility |
| 01/11/2012 | CN101803484B Partially rigid flexible circuits and method of making same |
| 01/11/2012 | CN101531880B Canate-bimaleimide resin adhesive and preparation method |
| 01/05/2012 | WO2012002134A1 Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or the photosensitive resin composition film |
| 01/04/2012 | CN102304343A Glue solution for copper-clad substrate, and preparation method thereof |
| 01/04/2012 | CN102304342A Durable thermosets from reducing sugars and primary polyamines |
| 01/03/2012 | CA2634249C Two-stage cure polyimide oligomers |
| 12/29/2011 | WO2011162256A1 Anisotropic conductive material and process for production thereof, and mounting body and process for production thereof |
| 12/28/2011 | CN102300950A 含有马来酰亚胺封端的聚酰亚胺的结构粘合剂 Structural adhesive containing maleimide-terminated polyimide |
| 12/28/2011 | CN101490175B 热固性聚酰亚胺树脂组合物 Thermosetting polyimide resin composition |
| 12/14/2011 | EP2395035A1 Rapid cure thermosets from 5- and 6- membered cyclic enamine compounds made from dialdehydes |
| 12/07/2011 | EP2391690A2 Structural adhesives containing maleimide terminated polyimides |
| 12/07/2011 | EP1942168B1 Adhesive and laminates made by using the same |
| 11/30/2011 | CN102260480A 一种耐高温改性环氧树脂胶粘剂及其制备方法 A modified epoxy resin adhesive and preparation method of high temperature |
| 11/16/2011 | EP2386605A1 Durable thermosets from reducing sugars and primary polyamines |
| 11/16/2011 | EP2386394A1 Durable thermoset binder compositions from 5-carbon reducing sugars and use as wood binders |
| 11/16/2011 | CN102246285A Resin paste for die bonding, method for producing semiconductor device, and semiconductor device |
| 11/16/2011 | CN101735611B Thermosetting resin composition with high heat conductivity, prepreg manufactured by adopting same and copper-clad laminate |
| 11/16/2011 | CN101418204B Halogen-free flameproof adhesive and application thereof in bonding sheet and copper clad laminate |
| 11/10/2011 | WO2011022224A8 Cellulosic composite |
| 11/10/2011 | US20110272973 Method of mounting electrical conductors on a plastic part |
| 10/26/2011 | EP2380867A1 Novel cross-linker |
| 10/20/2011 | WO2011128431A1 Novel cross-linker |
| 10/19/2011 | CN102220102A High-temperature resisting adhesive and preparation method thereof |
| 10/13/2011 | WO2011126707A2 Article and an adhesive for a roll-shaped paper |
| 10/13/2011 | WO2011125778A1 Adhesive composition, bonding sheet, and semiconductor device |
| 10/12/2011 | EP2374853A1 Cyanate ester-based pressure sensitive adhesive |
| 10/12/2011 | CN102216409A Creping adhesives with improved film properties |
| 10/05/2011 | CN102209754A Resin composition for printed wiring board |
| 09/28/2011 | CN102199290A Thermoplastic polyimide adhesive film as well as preparation method and application thereof |
| 09/21/2011 | EP2366751A2 Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition |
| 09/21/2011 | CN102191004A Thermosetting adhesive for flexible basic material and preparation method thereof |
| 09/21/2011 | CN101831073B Method for preparing bisphenol-A phenolic benzoxazine resin |
| 09/14/2011 | CN102181251A Epoxy resin adhesive modified by unsaturated polyimide and preparation method thereof |
| 08/31/2011 | CN102171263A Polyamide resin, resin composition thereof, flame-retardant adhesive composition and adhesive sheet made of said composition, coverlay film, and printed wiring board |
| 08/31/2011 | CN102167963A Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device |
| 08/31/2011 | CN102167960A Adhesive agent for application on a sanitary object |
| 08/25/2011 | US20110204616 Security laminates with interlaminated transparent embossed polymer hologram |
| 08/24/2011 | EP2358836A1 Creping adhesives with improved film properties |
| 08/24/2011 | CN102161875A Attach film composition for semiconductor assembly, attach film for semiconductor assembly using the same and attach belt |
| 08/17/2011 | CN102160163A Semiconductor device and method for manufacturing same |
| 08/17/2011 | CN102153988A Formaldehyde-free protein-containing binder compositions |
| 08/17/2011 | CN102153980A Daub used for making glass steel pipeline threads and preparation method thereof |
| 08/10/2011 | CN102149782A Protein/cationic polymer compositions having reduced viscosity |
| 08/10/2011 | CN101203490B Reactive monomer and resin composition containing same |
| 08/04/2011 | US20110187009 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device |
| 07/28/2011 | WO2011089922A1 Polyimide resin composition, adhesive agent and laminate each comprising same, and device |
| 07/27/2011 | CN102137906A Double-faced adhesive film and electronic component module using same |
| 07/27/2011 | CN102134451A Adhesive film for semiconductor, composite sheet, and method for producing semiconductor using the same |
| 07/20/2011 | CN102131883A Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition |
| 07/20/2011 | CN102131882A Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component |
| 07/20/2011 | CN102127375A Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
| 07/13/2011 | CN101630540B Polyimide film externally coated with metal conductive layer and preparation method thereof |
| 07/13/2011 | CN101218539B Photosensitive adhesive composition, and obtained adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part using the same |
| 07/05/2011 | US7973122 Polyamideimide compositions having multifunctional core structures |
| 06/30/2011 | WO2011077917A1 Polyimide resin, manufacturing method therefor, adhesive resin composition, coverlay film, and circuit board |
| 06/29/2011 | CN102112568A Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device |
| 06/29/2011 | CN102108277A Entropy alloy powder conductive adhesive and manufacturing method thereof |
| 06/22/2011 | EP2334748A1 Protein/cationic polymer compositions having reduced viscosity |
| 06/16/2011 | US20110142784 Adhesive agent for application on a sanitary object |
| 06/15/2011 | EP2333609A2 Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part |
| 06/15/2011 | EP2333015A2 Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition |
| 06/15/2011 | CN101281968B Hydrophilic and corrosion-proof fuel cell part |
| 06/09/2011 | WO2011068157A1 Resin composition for use in formation of bonding layer in multilayer flexible printed circuit board, resin varnish, resin-coated copper foil, manufacturing method for resin-coated copper foil for use in manufacturing of multilayer flexible printed circuit board, and multilayer flexible printed circuit board |
| 06/01/2011 | CN102083886A Primer resin for semiconductor device, and semiconductor device |
| 06/01/2011 | CN102079875A High-heat-resistance halogen-free phosphorus-free thermosetting resin composition, and bonding sheet and copper foil-coated laminated board made of same |
| 06/01/2011 | CN101454378B Polyimide resin |
| 05/31/2011 | US7951251 Adhesive film, flexible metal-clad laminate including the same with improved dimensional stability, and production method therefor |
| 05/12/2011 | WO2011055580A1 Adhesive composition, circuit connecting structure, semiconductor device and adhesion improvement agent for glass |
| 05/12/2011 | US20110112235 Polymerizable composition |
| 05/11/2011 | EP2319893A1 Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition |
| 05/11/2011 | EP2319892A1 Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component |
| 05/05/2011 | WO2011052376A1 Adhesive resin composition, coverlay film, and circuit board |
| 05/05/2011 | WO2011051412A1 Polyamideimide adhesives for printed circuit boards |
| 05/05/2011 | CA2779065A1 Polyamideimide adhesives for printed circuit boards |
| 05/04/2011 | CN102040938A Nano-particle modified cyanate adhesive and preparation method thereof |
| 04/28/2011 | WO2011049011A1 Photosensitive adhesive composition, photosensitive adhesive sheet, and semiconductor devices using same |
| 04/27/2011 | CN102037076A One-liquid type cyanate epoxy composite resin composition |
| 04/21/2011 | US20110092636 Water swellable and water soluble polymers and use thereof |
| 04/20/2011 | EP2311921A1 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device |
| 04/13/2011 | CN1993498B Printed wiring board |
| 04/13/2011 | CN102015954A Adhesive composition and optical film using the same |
| 04/07/2011 | WO2011040442A1 Conductive connection material, method for connection between terminals and method for manufacturing connecting terminal |
| 04/07/2011 | WO2011040416A1 Resin composition, resin sheet, and resin cured product and method for producing same |
| 04/07/2011 | WO2011040415A1 Multilayer resin sheet and method for producing same, method for producing multilayer resin sheet cured product, and highly thermally conductive resin sheet laminate and method for producing same |
| 04/07/2011 | WO2011040399A1 Resin composition, prepreg using same, metal foil with resin, adhesive film, and metal-clad laminate |
| 04/07/2011 | WO2011040194A1 Adhesive resin composition, cover lay film, and circuit board |
| 04/06/2011 | CN102002334A Organic layer composition and liquid crystal display using the same |