| Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
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| 02/05/2014 | CN103555221A Preparation method of bionic gecko tape |
| 02/05/2014 | CN103555220A Preparation method of conductive bionic gecko adhesive tape |
| 02/05/2014 | CN102191004B Thermosetting adhesive for flexible basic material and preparation method thereof |
| 01/22/2014 | CN101864268B Thermal conductive adhesive |
| 01/15/2014 | EP2133398B1 Fire-retardant adhesive resin composition, and adhesive film using the same |
| 01/08/2014 | CN103502327A Dynamically vulcanized thermoplastic elastomer laminates |
| 01/08/2014 | CN102732029B Halogen-free resin composition, bonding sheet and copper-clad laminate |
| 01/03/2014 | WO2014003056A1 Method for producing semiconductor device |
| 01/01/2014 | CN103484054A High-temperature resistant adhesive used for polyether ether ketone bonding |
| 01/01/2014 | CN103483586A Modified polyimide resin, adhesive composition containing modified polyimide resin and covering film containing adhesive composition |
| 12/25/2013 | CN103476895A Adhesive and adhesive material using same, and usage method therefor |
| 12/25/2013 | CN103476894A Adhesive, adhesive material using same, and method for using said adhesive and material |
| 12/25/2013 | CN103467987A Toughening modification method for bismaleimide resin |
| 12/25/2013 | CN102936466B Modified bisphthalonitrile resin structure glue film and preparation method thereof |
| 12/25/2013 | CN102634021B Thermoplastic polyimide resin and preparation method thereof |
| 12/25/2013 | CN102216409B Creping adhesives with improved film properties |
| 12/25/2013 | CN101665670B Adhesive film material for connecting micro-interface reinforced structural adhesive and preparation method thereof |
| 12/19/2013 | US20130338313 Amide-extended crosslinking compounds and methods for use thereof |
| 12/18/2013 | CN103459544A Adhesive and adhesive material using same, and usage method therefor |
| 12/18/2013 | CN103450838A Bio-based flame resistant thermosetting binders with improved wet resistance |
| 12/18/2013 | CN103450824A Water-soluble amine and carbohydrate thermosetting material |
| 12/18/2013 | CN103450822A Thermosetting membrane for adhesion of bulletproof fiber and processing method of thermosetting membrane |
| 12/18/2013 | CN102329511B Dedoping-resistant dye-doped polyaniline and preparation method and application thereof |
| 12/12/2013 | WO2013183679A1 Adhesive composition or underfill composition |
| 12/12/2013 | WO2013183293A1 Polyimide resin composition, film, adhesive agent and component |
| 12/12/2013 | US20130331484 Hybrid Adhesive and the Use Thereof in Engineered Wood Boards |
| 12/11/2013 | EP2671920A1 Thermosetting resin composition, cured product thereof, and interlayer adhesive film for printed wiring board |
| 12/11/2013 | EP2671904A1 Curable resin composition and cured product thereof |
| 12/11/2013 | CN103436197A Conductive adhesive for over-temperature overcurrent protective element and production method thereof |
| 12/11/2013 | CN102533191B High temperature-resistant halogen-free ion migration-resistant epoxy resin adhesive |
| 12/05/2013 | WO2013179943A1 Adhesive sheet for production of semiconductor device having bump electrodes and production method for semiconductor device |
| 12/04/2013 | EP2669349A1 Aqueous amine-carbohydrate thermosets having reduced weight loss upon cure and improved early dry strength |
| 12/04/2013 | EP2669325A1 Bio-based flame resistant thermosetting binders with improved wet resistance |
| 12/04/2013 | CN102618206B Polyimide adhesive |
| 11/28/2013 | US20130317155 Flexible benzoxazine resin |
| 11/27/2013 | CN103409092A Solvent-free epoxy-tetramaleimide resin adhesive and preparation method thereof |
| 11/21/2013 | WO2013173742A1 Adhesive for 3d printing |
| 11/21/2013 | US20130309489 Thermosetting resin composition, cured product of the same, and interlaminar adhesive film used for printed wiring board |
| 11/20/2013 | CN103396756A Adhesive composition and optical film using same |
| 11/20/2013 | CN102643625B Conductive frame sealing glue, preparation method thereof and liquid crystal display screen |
| 11/13/2013 | CN103386796A Composite board, preparation method thereof and composite substrate |
| 11/13/2013 | CN102618200B Organosilicone-epoxy-polyimide adhesive and preparation method thereof |
| 11/13/2013 | CN102015954B Adhesive composition and optical film using the same |
| 10/31/2013 | WO2013132432A9 Intermediate transfer members for use with indirect printing systems |
| 10/31/2013 | US20130289156 Production method for polyamide acid particles, production method for polyimide particles, polyimide particles and bonding material for electronic component |
| 10/31/2013 | US20130288120 Polyimide resin composition and laminate including polyimide resin composition |
| 10/30/2013 | CN103374307A Gummed copper foil, production method for same, multilayer flexible circuit board and production method for same |
| 10/30/2013 | CN102131882B Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component |
| 10/30/2013 | CN101490198B Anisotropic conductive adhesive compositions |
| 10/24/2013 | WO2013157565A1 Thermal adhesive polyimide film, method for producing thermal adhesive polyimide film, and polyimide/metal laminate using thermal adhesive polyimide film |
| 10/23/2013 | CN103370371A Thermosetting resin composition, cured product thereof, and interlayer adhesive film for printed wiring board |
| 10/23/2013 | CN103360973A Masking sheet for manufacture of semiconductor device and method for manufacturing semiconductor device |
| 10/16/2013 | CN102559118B High-temperature-resistant conductive adhesive and preparation method thereof |
| 10/16/2013 | CN101921557B Halogen-free flame-retardant adhesive composition and flexible copper-clad plate using same |
| 10/09/2013 | EP2647685A1 Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet |
| 10/09/2013 | CN103347930A Curable resin composition and cured product thereof |
| 10/09/2013 | CN102618195B Light shading adhesive, laminated plate, preparation method of light shading adhesive, and application of light shading adhesive |
| 10/03/2013 | WO2013003675A3 Adhesive additive |
| 09/25/2013 | CN102666658B Polyimide resin, manufacturing method therefor, adhesive resin composition, coverlay film, and circuit board |
| 09/25/2013 | CN101546847B Lithium secondary battery and method of manufacturing the same |
| 09/19/2013 | WO2013138414A1 Adhesive compositions having a reduced cure time and methods for making and using same |
| 09/19/2013 | WO2013136807A1 Polyimide precursor varnish and polyimide resin, and use thereof |
| 09/19/2013 | US20130245160 Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet |
| 09/18/2013 | CN102304343B Glue solution for copper-clad substrate, and preparation method thereof |
| 09/18/2013 | CN101875825B Halogen-free flame retardant adhesive composition and flexible copper-clad plate using same |
| 09/12/2013 | WO2013132432A1 Intermediate transfer members for use with indirect printing systems |
| 09/11/2013 | CN103298855A Polyimide resin composition and laminate including same |
| 09/11/2013 | CN103289633A Polyimide-based adhesive composition, cured product, adhesive sheet, laminate, and flexible printed circuit board |
| 09/11/2013 | CN103289593A High-temperature-resistant pressure-sensitive adhesive-film for COF and preparation method thereof |
| 09/11/2013 | CN102618033B Composition, LED (light-emitting diode) circuit board substrate comprising same and preparation method thereof |
| 09/04/2013 | CN103275670A Flame-retardant adhesive |
| 09/04/2013 | CN103275669A High temperature resistance and low dielectric glass cloth honeycomb sandwich adhesive and preparation method thereof |
| 09/04/2013 | CN103275668A Application of multi-component super-molecule hydrogel as adhesion agent |
| 09/04/2013 | CN103275638A Electronic heat-resistant glass insulating tape |
| 09/04/2013 | CN103274354A Preparation method of gecko structure simulating adhesive |
| 08/28/2013 | CN103265701A Preparation method of bismaleimide prepolymer and conductive silver adhesive prepared thereby |
| 08/28/2013 | CN102421849B Thermosetting polyimide resin composition, cured product, and adhesive |
| 08/21/2013 | CN102604584B High-peeling polyimide adhesive and preparation method thereof |
| 08/15/2013 | US20130209812 Anticorrosion coatings |
| 08/14/2013 | CN103242797A Polyimide adhesive |
| 08/14/2013 | CN103242790A High temperature resistant mica tape adhesive and preparation method thereof |
| 08/14/2013 | CN103242768A High-tenacity bismaleimide resin carrier structure adhesive film and preparation method thereof |
| 08/14/2013 | CN103242767A High-temperature-resistant bismaleimide resin carrier structure adhesive film and preparation method thereof |
| 08/14/2013 | CN103242656A Multi-component super-molecular hydrogel and preparation method thereof |
| 08/07/2013 | EP2623574A1 Conductive adhesive composition, electronic device, positive electrode laminate, and method for manufacturing electronic device |
| 08/07/2013 | CN103232818A Thermoplastic polyimide (TPI) adhesive film, double-sided base material containing same and preparation method thereof |
| 08/07/2013 | CN102676096B Preparation method of organosilicon conductive adhesive containing nanorod-shaped zinc oxide |
| 08/01/2013 | WO2013112445A1 Method for the preparation of wood composite from soy flour |
| 07/31/2013 | CN103228753A Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet |
| 07/17/2013 | CN102209754B Resin composition for printed wiring board |
| 07/17/2013 | CN102149782B Protein/cationic polymer compositions having reduced viscosity |
| 07/17/2013 | CN101679612B Resin composition for interlayer insulation of multilayer printed wiring board |
| 07/10/2013 | EP2612879A1 Polyimide resin composition and laminate including same |
| 07/10/2013 | CN103199257A Binder for electrode of lithium battery and lithium battery containing the binder |
| 07/03/2013 | CN103189464A Adhesive composition, method for producing semiconductor device, and semiconductor device |
| 07/03/2013 | CN103189463A Conductive adhesive composition, electronic device, positive electrode laminate, and method for manufacturing electronic device |
| 07/03/2013 | CN103184029A Light curing adhesive for splicing capacitive touch screen and preparation method of light curing adhesive |
| 06/20/2013 | WO2013089410A1 Cyanate ester resin composition for manufacturing circuit board and flexible metal-clad laminates including same |
| 06/19/2013 | CN103160229A Glue liquor for environment-friendly light laminated board, laminated board and preparation method of glue liquor |
| 06/12/2013 | CN103144388A Preparation method and application of polyaniline/titanium dioxide/graphene conductive composite membrane |