| Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
|---|
| 03/20/2002 | EP0866809B1 Modified polyalkadiene-containing compositions |
| 03/19/2002 | US6359107 Composition of and method for making high performance resins for infusion and transfer molding processes |
| 03/12/2002 | US6355750 Curable adhesive comprising siloxane-containing maleimide compound and free radical- or photoinitiator; semiconductors, integrated circuits |
| 03/06/2002 | EP1184403A2 Polyimide silicone resin, process for its production, and polyimide silicone resin composition |
| 02/26/2002 | US6350844 Polyimide film and electric/electronic equipment bases with the use thereof |
| 02/20/2002 | EP1180559A1 Binder composition for fibrous sheet |
| 02/19/2002 | CA2188344C Plateable structural adhesive for cyanate ester composites |
| 02/13/2002 | EP1179026A1 BRANCHED AND HYPERBRANCHED POLYETHERIMIDES FROM STABLE A1Bn, AB, AA, AND BB MONOMERS; AM ENDCAPPING AGENTS |
| 02/07/2002 | US20020016438 From a tetracarboxylic dianhydride and a diaminosiloxane containing little cyclic siloxane oligomer; good adhesiveness and reliability, for electronis and semiconductors |
| 02/06/2002 | CN1334280A Polyimide useful for high-temp. adhesive |
| 02/04/2002 | CA2354238A1 Fibrous sheet enhancement |
| 01/23/2002 | EP1173499A1 Use of polyamino acid salts in water-borne adhesive applications |
| 01/23/2002 | CN1332779A Polyamideimidesiloxane hot melt adhesive |
| 01/17/2002 | WO2002004572A1 Polyimide hybrid adhesives |
| 01/17/2002 | WO2002004571A1 Stretch releasing pressure sensitive adhesive tapes and articles |
| 01/17/2002 | US20020007042 Die attach adhesives for use in microelectronic devices |
| 01/16/2002 | EP1126768A4 Polymerizable compositions in non-flowable forms |
| 01/02/2002 | EP1167484A2 Poly(arylene ether) adhesive compositions |
| 01/02/2002 | CN1329651A Adhesive powder |
| 12/26/2001 | CN1328588A Impact-resistant epoxide resin compositions |
| 12/25/2001 | US6333390 Branched and hyperbranched polyetherimides |
| 12/25/2001 | US6333101 Method of adhering adherends |
| 12/20/2001 | US20010052838 Adhesive resin composition and method of producing the same, chip coil component |
| 12/18/2001 | US6331226 Using an adhesive prepared by adding a polycarbodiimide resin with an epoxy resin; excellent adhesion and heat resistance; liquid crystalline polymer |
| 12/11/2001 | US6329050 Adhesive for electronic parts and adhesive tape for electronic parts |
| 11/29/2001 | WO2001090272A2 Adhesive compositions containing stable amino-containing polymer latex blends |
| 11/28/2001 | EP1028997A4 Water-activated adhesive and paper-plastic tape containing same |
| 11/28/2001 | CN1324391A Hot melt adhesive having controllable water solubility |
| 11/14/2001 | CN1321715A Adhesive of fixing matrix for microelectronic device |
| 11/07/2001 | EP1151053A1 Adhesive powder |
| 11/06/2001 | US6313248 Curable solid aromatic diamine bismaleimide and liquid alkenylphenyl resins; decreased weight loss upon aging |
| 11/01/2001 | WO2001081492A1 Cyanate-based adhesives for and in combination with friction linings and method for producing friction linings that adhere to a support |
| 10/31/2001 | DE10025251A1 Cyanatbasierte Klebstoffe für und in Kombination mit Reibbelängen sowie Verfahren zum Herstellen von auf einer Unterlage haftenden Reibbelägen Cyanatbasierte Adhesives and in combination with Reibbelängen and method for producing adhesive on a base friction linings |
| 10/24/2001 | EP0848770B1 Tissue paper product comprising adhesively joined plies |
| 10/24/2001 | EP0846202B1 Multi-ply paper product |
| 10/23/2001 | US6307008 Polyimide for high temperature adhesive |
| 10/18/2001 | US20010031828 Film-type adhesive for electronic components, and electronic components bonded therewith |
| 10/18/2001 | DE10014587A1 Sealing of pores in structural components, especially of plasma reactors for the manufacture and processing of semiconductor wafers, with a polyimide |
| 10/17/2001 | EP1146065A1 Die attach adhesives for use in microelectronic devices |
| 10/14/2001 | CA2343632A1 Die attach adhesives for use in microelectronic devices |
| 10/10/2001 | EP1141163A1 Polyamideimidesiloxane hot melt adhesive |
| 10/10/2001 | EP1141162A1 Hot melt adhesive having controllable water solubility |
| 09/25/2001 | US6294259 Polyimide hybrid adhesives |
| 09/13/2001 | US20010021753 Polymer compositions, their preparation and their use |
| 09/12/2001 | EP1131370A1 Hydroxy-functionalized poly(amino ether) salts |
| 09/06/2001 | US20010018986 Resin compound, and adhesive film, metal-clad adhesive film, circuit board, and assembly structure, using the resin compound |
| 09/06/2001 | DE10008120A1 Polyimide obtained using polyamic acid, is useful as a high temperature adhesive used for semiconductor assemblies and insulative adhesive tape |
| 08/29/2001 | EP1126768A1 Polymerizable compositions in non-flowable forms |
| 08/21/2001 | US6277242 Creping adhesive containing an admixture of PAE resins |
| 08/16/2001 | EP1123348A2 Impact-resistant epoxide resin compositions |
| 08/09/2001 | WO2001057112A1 Adhesive polyimide resin and adhesive laminate |
| 08/09/2001 | WO2001056978A1 Diethyloctandioldicarbamates and diethyloctandioldiallophanates, method for the production and use thereof |
| 08/09/2001 | DE10004498A1 New diethyloctandiol dicarbamate and diethyloctandiol diallophanate positional isomers are used for vehicle and electronic parts |
| 08/09/2001 | CA2398648A1 Diethyloctandioldicarbamates and diethyloctandioldiallophanates, method for the production and use thereof |
| 08/07/2001 | US6270616 Metal-filled, plateable structural adhesives for cyanate ester composites |
| 07/31/2001 | US6268033 Polyimide |
| 07/24/2001 | US6265530 Die attach adhesives for use in microelectronic devices |
| 07/24/2001 | US6265042 Adhesive tape for electronic parts |
| 07/05/2001 | WO2001048113A1 Adhesive for molded polybenzimidazole resin and united polybenzimidazole molding produced with the same |
| 06/28/2001 | WO2001046332A1 Stable waterborne polymer compositions containing poly(alkylenimines) |
| 06/26/2001 | US6252010 Siloxane-modified polyamideimide resin composition, adhesive film, adhesive sheet and semiconductor device |
| 05/31/2001 | DE19955969A1 Verwendung von Polyimid für Haftschichten und lithographisches Verfahren zur Herstellung von Mikrobauteilen The use of polyimide for subbing layers, and lithographic process for manufacturing micro-components |
| 05/30/2001 | CN1066474C Heat resistant resin composition, heat resistant film adhesive and process for producing same |
| 05/29/2001 | US6239232 Polyetherimide or polysulphone with polyepoxide partially reacted with aromatic polyamine |
| 05/25/2001 | WO2001037050A1 Use of polyimide for adhesive layers, lithographic method for producing microcomponents and method for producing composite material |
| 05/23/2001 | CN1296507A Adhesives and resins, and process for their production |
| 05/16/2001 | CN1065895C One-coating rubber-to-metal bonding adhesive |
| 05/15/2001 | US6232428 Essentially colorless, transparent polyimide coatings and films |
| 05/15/2001 | US6232366 Pressure sensitive conductive adhesive having hot-melt properties and biomedical electrodes using same |
| 05/08/2001 | US6228452 Adhesive tape for electronic parts |
| 04/17/2001 | US6218496 Diamine is a mixture of about 5 to about 30 mole % of a siloxane-containing diamine and about 70 to about 95 mole % of a non-siloxane containing diamine. |
| 04/17/2001 | US6217996 Aromatic polyimide film and its composite sheet |
| 04/17/2001 | CA2004131C A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism |
| 04/10/2001 | US6214158 Saturation with aromatic tetracarboxylic acid and diamine in solvent, catalyst; heating, curing |
| 03/28/2001 | CN1288925A Soluble polyimide coating glue and its preparation and use |
| 03/22/2001 | DE19944159A1 Emissionsarmer, biologisch abbaubarer Klebstoff Low-emission, biodegradable glue |
| 03/21/2001 | EP1085072A2 Low-emission biodegradable adhesive |
| 03/21/2001 | CN1288033A Low diffusing biological degradation adhesion agent |
| 03/20/2001 | US6204565 Support substrate having conductive interconnection pattern; photosensitive adhesive bump |
| 02/27/2001 | US6194499 Adhesives for hot bonding of substrates |
| 02/14/2001 | EP1076262A1 Photosensitive resin |
| 02/13/2001 | US6187874 Comprising, as a resin component, two polyimide resins different in glass transition temperature by at least 20 degrees c from each other, and an epoxy resin |
| 02/08/2001 | WO2001009219A1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 02/06/2001 | US6184337 Heat resistance; for use in semiconductors |
| 02/01/2001 | DE19935325A1 Lösemittelfreie, raumtemperaturhärtende Reaktivsysteme und ihre Verwendung zur Herstellung von Klebstoffen, Dichtungsmassen, Vergußmassen, Formteilen oder Beschichtungen Solvent-free, room temperature curing reactive systems and their use for the production of adhesives, sealants, casting compounds, moldings or coatings |
| 01/24/2001 | CN1061073C Three-layer polyimidesiloxane adhesive tape |
| 01/16/2001 | US6174988 Use of polyamino acid salts in water-borne adhesive applications |
| 12/14/2000 | WO2000075255A2 Pressure sensitive adhesive and biomedical electrodes using same |
| 12/06/2000 | EP1057850A2 LCP bonding method |
| 12/05/2000 | US6156820 Polyamideimidesiloxane hot melt adhesive |
| 11/23/2000 | WO2000069948A1 Composition of and method for making high performance resins for infusion and transfer molding processes |
| 11/23/2000 | CA2372361A1 Composition of and method for making high performance resins for infusion and transfer molding processes |
| 11/14/2000 | US6146497 Adhesives and resins, and processes for their production |
| 11/07/2000 | US6144108 Semiconductor device and method of fabricating the same |
| 10/31/2000 | US6140454 Comprising an epoxy resin, a phenolic resin and a polycarbodiimide resin; integrated circuit package resin composition |
| 10/19/2000 | WO2000026267A9 BRANCHED AND HYPERBRANCHED POLYETHERIMIDES FROM STABLE A1Bn, AB, AA, AND BB MONOMERS; AM ENDCAPPING AGENTS |
| 10/17/2000 | US6133408 Polyimide resin for cast on copper laminate and laminate produced therefrom |
| 10/17/2000 | US6132865 Adhesive tape for electronic parts |
| 10/12/2000 | WO2000059985A1 Use of polyamino acid salts in water-borne adhesive applications |
| 10/12/2000 | CA2367297A1 Use of polyamino acid salts in water-borne adhesive applications |