| Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
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| 03/04/2010 | WO2010024087A1 Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition |
| 02/11/2010 | WO2010016305A1 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device |
| 02/10/2010 | EP2151715A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device |
| 02/10/2010 | CN101646741A Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method |
| 02/03/2010 | CN100587018C Adhesive film and method for manufacturing semiconductor device using same |
| 01/20/2010 | EP2145910A1 Linear polyimide precursor having asymmetric structure, polyimide, and their production methods |
| 01/20/2010 | CN101629062A Polyimide-epoxy resin adhesive and preparation method and application thereof |
| 01/14/2010 | WO2009125980A3 Adhesive composition and optical film using the same |
| 01/14/2010 | DE102008031555A1 Polymerisierbare Zusammensetzung enthaltend anorganische Partikel mit organischer Hülle The polymerizable composition comprising inorganic particles with organic shell |
| 01/13/2010 | CN100580009C Preparation process of boron-containing bene oxazine resin |
| 12/30/2009 | WO2009157147A1 One-liquid type cyanate epoxy composite resin composition |
| 12/30/2009 | EP2139027A1 Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them |
| 12/30/2009 | CN100575438C Film adhesive and semiconductor package using the same |
| 12/23/2009 | EP2135910A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method |
| 12/23/2009 | CN101611076A Binder resin for electrode of lithium ion secondary battery, composition and paste containing the resin, and electrode of lithium ion secondary battery using the resin |
| 12/23/2009 | CN100572416C Thermosetting resin composition and use thereof |
| 12/17/2009 | WO2009117729A3 Anti-bleed compounds, compositions and methods for use thereof |
| 12/16/2009 | EP2133398A1 Fire-retardant adhesive resin composition, and adhesive film using the same |
| 12/16/2009 | CN101602929A Percolation efficiency of the conductivity of electrically conductive adhesives |
| 12/10/2009 | WO2009147997A1 Coverlay film |
| 12/08/2009 | CA2448612C Polymeric creping adhesives and creping methods using same |
| 12/03/2009 | WO2009145339A1 Linear polyimide precursor, linear polyimide, thermally cured product of the linear polyimide, and method for producing the linear polyimide |
| 12/02/2009 | CN101591521A Fluorene-containing polyimide adhesive and preparation method thereof |
| 11/25/2009 | CN100562427C Adhesive film and use thereof |
| 11/24/2009 | CA2198745C Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| 11/18/2009 | CN101580687A Fluorenyl-containing polyimide high temperature-resistant adhesive and preparation method thereof |
| 10/29/2009 | WO2009131070A1 Bonded member and process for producing the same |
| 10/21/2009 | CN101560371A High temperature resistant thermosetting polyimide adhesive and preparation method thereof |
| 10/15/2009 | WO2009125980A2 Adhesive composition and optical film using the same |
| 10/14/2009 | CN100549118C Adhesive composition containing light-sensitive polymer and bonding tablet using the composition |
| 10/13/2009 | CA2230047C Imide oligomers and co-oligomers containing pendent phenylethynyl groups and polymers therefrom |
| 10/01/2009 | CA2658439A1 Bioadhesive composition formed using click chemistry |
| 09/30/2009 | CN101546847A Lithium secondary battery and method of manufacturing the same |
| 09/29/2009 | CA2388300C Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 09/16/2009 | CN101531880A Canate-bimaleimide resin adhesive and preparation method |
| 09/02/2009 | EP2096671A1 Adhesive tape and semiconductor device using the same |
| 09/02/2009 | CN101519575A Rubber adhesive and preparation method thereof |
| 08/26/2009 | CN101516616A Laminate of heat resistant film and metal foil, and method for production thereof |
| 08/13/2009 | WO2009099918A1 Highly adhesive polyimide copper clad laminate and method of making the same |
| 08/12/2009 | CN101506321A Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
| 08/05/2009 | CN101501153A Film adhesive, adhesive sheet, and semiconductor device using the same |
| 08/05/2009 | CN101501151A Adhesive composition and connection structure for circuit member |
| 08/05/2009 | CN100522603C Adhesive film, flexible metal-clad laminate of enhanced dimensional stability obtained therefrom and process for producing the same |
| 07/23/2009 | WO2009090922A1 Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor device |
| 07/22/2009 | CN101490198A Anisotropic conductive adhesive compositions |
| 07/15/2009 | EP2079108A1 Semiconductor electronic component and semiconductor device using the same |
| 07/14/2009 | CA2217834C Curable resin compositions |
| 07/08/2009 | CN100512602C Adhesive and adhered thin film |
| 06/25/2009 | US20090159205 Method for preparing a moisture curable hot melt adhesive |
| 06/18/2009 | US20090155610 Heat-resistant adhesive sheet |
| 06/17/2009 | EP2070961A1 Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board |
| 06/11/2009 | WO2009072492A1 Photosensitive adhesive |
| 06/04/2009 | WO2009070647A1 Creping adhesives comprising blends of high and low molecular weight resins |
| 06/04/2009 | CA2706446A1 Creping adhesives comprising blends of high and low molecular weight resins |
| 06/03/2009 | CN101445714A Polyurethane-imide resin, adhesive composition and adhesive composition for circuit connection |
| 05/27/2009 | CN100491446C Aromatic polyimide and its preparation and use |
| 05/26/2009 | US7537839 An anaerobically curable mixture of aryldicyanate ester, a (meth)acrylate monomer, a peroxide and saccharin used for threadlocking nuts and bolt; oil repellant, eliminating degreasing ; high bonding strength; heat resistance; toughness; metal adhesion; high-speed fixing; joints; construction materials |
| 05/20/2009 | EP1508584B1 Adhesive resin and film adhesives made by using the same |
| 05/14/2009 | WO2009059511A1 A red and green dry adhesive, a method producing the same |
| 05/06/2009 | EP2055757A1 Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
| 05/05/2009 | US7528404 Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality |
| 04/29/2009 | EP2053108A1 Film adhesive, adhesive sheet, and semiconductor device using the same |
| 04/29/2009 | CN101418205A Halogen-free flameproof adhesive and application thereof in prepreg and multiple layer printed plate aspect |
| 04/29/2009 | CN101418204A Halogen-free flameproof adhesive and application thereof in bonding sheet and copper clad laminate |
| 04/22/2009 | CN101412298A Method of producing flexible single-sided polyimide copper-clad laminate |
| 04/15/2009 | EP2048209A1 Adhesive composition, and connection structure for circuit member |
| 04/15/2009 | EP1777278B1 Adhesive composition and sheet having an adhesive layer of the composition |
| 04/08/2009 | EP2045295A1 Thermocurable polyimide resin composition |
| 04/08/2009 | EP2044165A1 Anisotropic conductive adhesive compositions |
| 04/08/2009 | CN101402831A Thermal-activated adhesive film and method of producing the same |
| 04/08/2009 | CN100475926C Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 04/02/2009 | US20090087591 Low temperature bonding electronic adhesives |
| 04/01/2009 | EP2042540A1 Polyimide resin |
| 04/01/2009 | CN101400752A Adhesive film |
| 03/26/2009 | WO2009037834A1 Primer resin for semiconductor device, and semiconductor device |
| 03/25/2009 | EP2039716A1 Polyimide resin |
| 03/25/2009 | CN100473262C Metal foil adhered laminate |
| 03/19/2009 | WO2009035867A1 Partially rigid flexible circuits and method of making same |
| 03/18/2009 | CN101389459A Process for producing multilayered polyimide film |
| 02/25/2009 | CN101374657A Laminate |
| 02/18/2009 | CN101370892A Polyimide resin composition and metal polyimide laminate |
| 02/18/2009 | CN100462403C High temperature resisting dipping glue and application thereof |
| 02/17/2009 | CA2343553C High temperature cabonaceous cement |
| 02/10/2009 | US7488532 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 01/14/2009 | CN101346413A Two-stage cure polyimide oligomers |
| 01/07/2009 | CN101341226A High temperature heat resistant adhesive tape, with low electrostatic generation, made with a polyetherimide polymer |
| 12/18/2008 | WO2008153208A1 Resin composition for interlayer insulation of multilayer printed wiring board |
| 12/16/2008 | CA2391005C Creping adhesives |
| 12/16/2008 | CA2296043C Adhesive composition for hot bonding and bonding method using same |
| 12/11/2008 | WO2008149625A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device |
| 12/10/2008 | CN100441652C Method for preparing binder of polyimide of containing phenolic hydroxyl group |
| 11/27/2008 | WO2008143253A1 Adhesive composition and adhesive film using the same |
| 11/27/2008 | US20080289758 Reactive Hot Melt Adhesive |
| 11/26/2008 | EP1995290A1 Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet making use of the same |
| 11/26/2008 | CN100438157C Negative electrode for non-aqueous electrolyte secondary battery, producing method therefor, and non-aqueous electrolyte secondary battery |
| 11/20/2008 | WO2008140107A1 Linear polyimide precursor having asymmetric structure, polyimide, and their production methods |
| 11/12/2008 | EP1989261A1 Method and composition for priming wood and natural fibres |
| 11/06/2008 | WO2008133293A1 Adhesive sheet |
| 10/30/2008 | WO2008129056A1 Wood materials based on polyamine-containing binding agents |
| 10/23/2008 | WO2008126717A1 Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them |