| Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
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| 06/12/2013 | CN102199290B Thermoplastic polyimide adhesive film as well as preparation method and application thereof |
| 06/06/2013 | WO2013079680A1 Aqueous binder composition |
| 06/06/2013 | CA2857238A1 Aqueous urea-modified binder for mineral fibres |
| 06/05/2013 | EP2600435A1 Electrical component, nonaqueous-electrolyte cell, and lead wire and sealable container both for use therein |
| 06/05/2013 | CN103131346A High temperature-resistant carrier adhesive film and preparation method thereof |
| 06/05/2013 | CN102220102B High-temperature resisting adhesive and preparation method thereof |
| 06/05/2013 | CN102181251B Epoxy resin adhesive modified by unsaturated polyimide and preparation method thereof |
| 05/29/2013 | EP2597123A1 Aqueous adhesive for fibrous and/or granular substrates |
| 05/29/2013 | CN103124474A Conductor foil with adhesive layer, conductor-clad laminate, printed wiring board and multilayer wiring board |
| 05/23/2013 | US20130131231 Tackifiers For Composite Articles |
| 05/22/2013 | CN103113744A Multi-element energy saving film as well as preparation method and application thereof |
| 05/15/2013 | EP2592126A1 Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each |
| 05/08/2013 | CN103087671A High temperature-resistant damp heat-resistant polytriazole resin adhesive and preparation method and application |
| 05/08/2013 | CN102260480B High-temperature-resistant modified epoxy resin adhesive and preparation method thereof |
| 05/02/2013 | US20130109798 Resin composition and semiconductor device produced by using the same |
| 05/02/2013 | US20130108851 Polyetherimides, methods of manufacture, and articles formed therefrom |
| 05/01/2013 | CN103074030A Organosilicon bismaleimide conductive adhesive for LED |
| 05/01/2013 | CN103074029A Organosilicon polyimide conductive adhesive for LED |
| 05/01/2013 | CN103074028A Organosilicon polyimide insulation adhesive for LED |
| 05/01/2013 | CN103074027A Phenolphthalein cyanate/benzoxazine resin adhesive resistant to 250 DEG C and preparation method |
| 05/01/2013 | CN103074026A Bismaleimide/cyanate ester resin adhesive resisting to temperature as high as 220 DEG C and preparation method |
| 05/01/2013 | CN103074021A Organosilicon bimaleimide-epoxy conductive adhesive for LED |
| 04/25/2013 | WO2013058054A1 Thermally-detachable sheet |
| 04/25/2013 | WO2013057432A1 Sizing composition having a low formaldehyde content for fire-resistant mineral wool and insulation product obtained |
| 04/24/2013 | CN103059793A Adhesive composition, adhesive layer and lamination structure thereof |
| 04/04/2013 | WO2013048851A1 Amine/thiol curing of benzoxazines |
| 04/03/2013 | CN103013438A Repairing adhesive of textile machine |
| 04/03/2013 | CN101245231B Adhesive composition, adhesive film, and method for producing semiconductor device |
| 03/28/2013 | WO2012075344A3 Improved adhesive film layer for printed circuit board applications |
| 03/27/2013 | CN102363646B Modified bismaleimide resin and preparation method thereof |
| 03/21/2013 | WO2013039029A1 Polyimide resin, resin composition and laminated film that use same |
| 03/20/2013 | CN102985877A Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or the photosensitive resin composition film |
| 03/20/2013 | CN102985505A Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each |
| 03/20/2013 | CN102321447B High-heat-resistance toughened epoxy resin composition and application thereof in bonding sheet and copper-clad board |
| 03/20/2013 | CN101445714B Polyurethane-imide resin, adhesive composition and adhesive composition for circuit connection |
| 03/20/2013 | CN101341226B High temperature heat resistant adhesive tape, with low electrostatic generation, made with a polyetherimide polymer |
| 03/14/2013 | WO2013035787A1 Polymer and composition including same, and adhesive composition |
| 03/06/2013 | CN102952516A Preparation method of polyimide adhesive |
| 03/06/2013 | CN101875830B Phenolic resin/phosphate hybrid adhesive and preparation method thereof |
| 02/27/2013 | CN102947893A Anisotropic conductive material and process for production thereof, and mounting body and process for production thereof |
| 02/27/2013 | CN101921565B Preparation method of solvent-free and high temperature-resistant adhesive |
| 02/20/2013 | EP2558434A1 Novel cross-linker |
| 02/20/2013 | CN102936481A Preparation method of steel adhering glue |
| 02/20/2013 | CN102936466A Modified bisphthalonitrile resin structure glue film and preparation method thereof |
| 02/20/2013 | CN101935514B Novel foam structural adhesive and preparation method thereof |
| 02/13/2013 | CN102925089A Flexible heat-conducting resin, and prepreg and metal base copper clad laminate prepared from same |
| 02/13/2013 | CN101932629B Highly adhesive polyimide copper clad laminate and method of making the same |
| 02/13/2013 | CN101831264B Isotropic high-performance thermal conductive adhesive for filling carbon nano tube |
| 02/13/2013 | CN101602929B Percolation efficiency of the conductivity of electrically conductive adhesives |
| 02/07/2013 | US20130034726 Fluid activatable adhesives and fluids for activating same for use with liner-free labels |
| 02/06/2013 | EP2553031A2 Article and an adhesive for a roll-shaped paper |
| 02/06/2013 | CN101967362B Special sealant with electrochemical activity for resisting crevice corrosion and preparation method thereof |
| 01/31/2013 | WO2013015469A1 Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive |
| 01/23/2013 | CN102892853A An article and an adhesive for a roll-shaped paper |
| 01/23/2013 | CN102888204A Novel conductive adhesive for capacitor and capacitor adopting the novel conductive adhesive |
| 01/17/2013 | WO2013008667A1 Curable resin composition and process for producing cured products using same |
| 01/17/2013 | WO2013008437A1 Polyimide resin composition and laminate including same |
| 01/16/2013 | CN102876280A Cyanate ester/bis-oxazoline thermostable adhesive and preparation method thereof |
| 01/16/2013 | CN102876268A Phenolic aldehyde type cyanate ester adhesive |
| 01/16/2013 | CN102876247A Modified cyanate adhesive film and preparation method thereof |
| 01/16/2013 | CN101910350B Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor device |
| 01/09/2013 | CN101346413B Two-stage cure polyimide oligomers |
| 01/03/2013 | CA2839278A1 Adhesive additive |
| 01/02/2013 | EP2540760A1 Poly(amide-imide) block copolymer, article including same, and display device including the article |
| 01/02/2013 | EP2540759A2 Thermosetting resin composition and cured product of the same |
| 01/02/2013 | CN102079875B High-heat-resistance halogen-free phosphorus-free thermosetting resin composition, and bonding sheet and copper foil-coated laminated board made of same |
| 01/02/2013 | CN101709029B Polybenzimidazole material and midbody organic diacid thereof as well as preparation methods thereof |
| 12/26/2012 | CN102844291A Novel cross-linker |
| 12/26/2012 | CN102838947A Modifier used for adhesive, production method thereof, adhesive, and circuit connection structure body |
| 12/20/2012 | WO2012172972A1 Cross-linked polyimide resin and method for producing same, adhesive resin composition and cured product thereof, cover lay film, circuit board, heat-conductive substrate, and heat-conductive polyimide film |
| 12/12/2012 | CN101649174B Preparation method of high temperature resistant single-component solventless epoxy adhesive |
| 12/12/2012 | CN101258212B 耐热性粘接片 The heat resistance of the adhesive sheet |
| 12/05/2012 | EP2530103A1 Polyimide resin composition, adhesive agent and laminate each comprising same, and device |
| 12/05/2012 | CN102108277B Entropy alloy powder conductive adhesive and manufacturing method thereof |
| 12/05/2012 | CN101979451B Adhesive film, flexible metal-clad laminate, and processes for producing these |
| 11/29/2012 | WO2012160916A1 Adhesive composition, film adhesive, adhesive sheet and semiconductor device |
| 11/28/2012 | CN102803422A Adhesive composition based on benzoxazine-thiol adducts |
| 11/28/2012 | CN102363723B Preparation method for high-temperature resistant copper foil adhesive |
| 11/28/2012 | CN101934663B Thermal transfer sheet |
| 11/28/2012 | CN101874090B Creping adhesives comprising blends of high and low molecular weight resins |
| 11/28/2012 | CN101536185B Adhesive tape and semiconductor device using the same |
| 11/22/2012 | US20120296038 Isocyanurate vinyl ester anchoring adhesive composition |
| 11/22/2012 | US20120295085 Polymide resin composition, adhesive agent and laminate each comprising same, and device |
| 11/21/2012 | CN102786901A Conductive silver adhesive for high-power LED (light-emitting diode) and preparation method and curing and using method thereof |
| 11/14/2012 | CN102782945A Anisotropic conductive film, united object, and process for producing united object |
| 11/14/2012 | CN102775927A Heat-resistant double-faced adhesive tape for electronic industry |
| 10/31/2012 | CN202511041U Light emitting diode (LED) bulb lamp |
| 10/24/2012 | CN102746819A Preparation method of polyimide resin emulsion bonder |
| 10/23/2012 | US8293847 Film-like adhesive, adhesive sheet, and semiconductor device using same |
| 10/18/2012 | WO2012141271A1 Adhesive and adhesive material using same, and usage method therefor |
| 10/18/2012 | WO2012141267A1 Pressure-sensitive adhesive, pressure-sensitive adhesive material using same, and method for using said adhesive and material |
| 10/18/2012 | WO2012141266A1 Adhesive and adhesive material using same, and usage method therefor |
| 10/18/2012 | WO2012140740A1 Pressure-sensitive adhesive composition, pressure-sensitive adhesive material using same, and method for using said composition and material |
| 10/17/2012 | CN102732208A Modified 250 DEG C high temperature resistant cyanate ester/benzoxazine resin adhesive and preparation method thereof |
| 10/17/2012 | CN102732207A Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
| 10/17/2012 | CN102732029A Halogen-free resin composition, bonding sheet and copper-clad laminate |
| 10/10/2012 | CN102719058A One liquid type cyanate-epoxy composite resin composition |
| 10/10/2012 | CN101570679B Filling-free polyimide bonding agent applicable to once coating |
| 10/04/2012 | WO2012134454A1 Dynamically vulcanized thermoplastic elastomer laminates |
| 10/04/2012 | CA2830584A1 Dynamically vulcanized thermoplastic elastomer laminates |