| Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
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| 01/10/2006 | US6984714 Heating, compression; electronics |
| 12/28/2005 | EP1610357A1 Vacuum envelope for image display and sealing material for image display |
| 12/28/2005 | EP1123348B1 Impact-resistant epoxide resin compositions |
| 12/28/2005 | CN1233770C Method for preparing high-temp. resistant adhesive |
| 12/22/2005 | US20050282010 Polyamideimide compositions having multifunctional core structures |
| 12/20/2005 | US6977279 polyurethane blocked with phenolic OH-group in a hydrocarbon resin, a polyamine compound, an epoxy resin, 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine catalyst; curable at room temperature to a uniform film |
| 12/14/2005 | CN1231539C Low temperature bonding adhesive composition |
| 12/01/2005 | WO2005113696A1 Adhesive film and method for manufacturing semiconductor device using same |
| 11/24/2005 | WO2005111165A1 Method for producing adhesive film |
| 11/24/2005 | WO2005111164A1 Adhesive film, flexible metal-clad laminate, and processes for producing these |
| 11/16/2005 | CN1227316C Pressure sensitive conductive adhesive having hot-melt properties and biomedical electrodes using same |
| 11/10/2005 | WO2005105943A1 Resin paste for die bonding |
| 11/09/2005 | CN1226350C Cyanate resin modified by polyether imide |
| 11/02/2005 | CN1692017A Flexible metal laminate and heat-resistant adhesive composition |
| 11/01/2005 | US6960636 Does not require solvent to provide viscosity for handling; low moisture uptake; for adhesives |
| 10/06/2005 | US20050222330 Adding an aromatic bismaleimide resin powder that does not dissolve in liquid curable resins; cyanate ester resin, polyisobornyl or lauryl (meth)acrylate and/or (meth)acrylated polybutadiene; flexibility, heat resistance; semiconductor packages |
| 10/05/2005 | EP1582574A1 Method to improve high temperature cohesive strength with adhesive having multi-phase system |
| 10/05/2005 | CN1676564A Method to improve high temperature cohesive strength with adhesive having multi-phase system |
| 09/29/2005 | WO2005090508A1 Reactive hot melt adhesive |
| 09/28/2005 | EP1580246A1 Reactive hot melt adhesive |
| 09/27/2005 | US6949618 Polyimide with three-dimensional structure and therefore are excellent in mechanical strength and heat resistance as compared with convntional linear polyimides; obtained from a salt of multifunctional amine |
| 09/21/2005 | CN1670107A Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
| 09/15/2005 | WO2005085384A1 Curable liquid compositions containing bisoxazoline |
| 09/14/2005 | CN1667073A Halogen-free flame resistant adhesive for preparing laminated sheet |
| 09/09/2005 | WO2005083771A1 Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality |
| 09/08/2005 | US20050196906 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material |
| 09/08/2005 | US20050196619 Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
| 08/25/2005 | US20050187311 coating resins comprising aromatic cyanates and addition polymers on circuit substrates, then curing with light and heat to form insulation layer with improved surface smoothness and excellent dielectric properties |
| 08/24/2005 | CN1657552A Comonomer compsns. of prodn. of imide-contg. polyamino acids |
| 08/18/2005 | US20050181223 Adhesive layer being obtained by imidization of a polyamic acid mixture, a reaction product of 3,4,3',4'-biphenyltetracarboxylic anhydride with p-phenylenediamine, reaction product of 3,4,3',4'-biphenyltetracarboxylic anhydride with 4,4'-diaminodiphenyl ether; heat/curling resistance, high peel strength |
| 08/17/2005 | EP1299492B1 Stretch releasing pressure sensitive adhesive tapes and articles |
| 08/17/2005 | CN1215144C Adhesive composition for hot bonding and bonding method using same |
| 08/16/2005 | US6929856 Composed mainly of a polyimide, especially a polyimidesiloxane, and has a peel strength of 0.02 N/mm or greater at near room temperature (20-50 degrees C.) and a cured peel strength of 0.3 N/mm or greater. |
| 08/03/2005 | CN1649936A Adhesive resin and film adhesives made by using the same |
| 08/03/2005 | CN1649920A Film adhesives containing maleimide and related compounds and methods for use thereof |
| 07/28/2005 | WO2005068193A1 Adhesive film, flexible metal-clad laminate of enhanced dimensional stability obtained therefrom and process for producing the same |
| 07/28/2005 | US20050165196 Adhesive resin and film adhesive made by using the same |
| 07/21/2005 | US20050158552 Poly(arylene ether) adhesive compositions |
| 07/14/2005 | WO2004099331A3 Imide-linked maleimide and polymaleimide compounds |
| 07/14/2005 | US20050154181 For electronic screen printable pastes |
| 07/14/2005 | US20050154141 Polymerizable compositions in non-flowable forms |
| 07/13/2005 | EP1553134A2 Polyimide compositions having resistance to water sorption, and methods relating thereto |
| 07/13/2005 | CN1637034A Polyurethane-imide resin, adhesive composition and adhesive composition for circuit connection |
| 07/12/2005 | US6916856 Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| 07/07/2005 | US20050148760 Supramolecular polymers |
| 07/06/2005 | EP1550698A2 Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto |
| 06/30/2005 | US20050143534 relatively low lamination temperature; low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-retardant filler, and optionally an adhesion promoter |
| 06/23/2005 | US20050136620 Maleimide compounds in liquid form |
| 06/22/2005 | EP1476406B1 Aqueous dispersions consisting of polycarbodiimides |
| 06/15/2005 | CN1206259C Adhesive polyimide resin and adhesive laminate |
| 06/14/2005 | US6906120 Poly(arylene ether) adhesive compositions |
| 06/02/2005 | US20050118424 particles comprising thermoplastic resins impregnated with carbodiimide compounds, having heat and solvent resistance, used as curing agents, stabilizers, hardeners, adhesives, coatings, paints, reinforcements and in automobiles, electronics, furniture, construction materials and as spacers |
| 05/31/2005 | US6899960 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material |
| 05/25/2005 | CN1203149C Hot melt adhesive having controllable water solubility |
| 05/24/2005 | US6896931 Comprises coating pre-polymer on substrate, heating to cyclize, then curing; improved energy/chemical/solvent resistance |
| 05/19/2005 | US20050107542 Film adhesives containing maleimide compounds and methods for use thereof |
| 05/18/2005 | EP1531657A1 Multi-layer substrates having at least two dissimilar polyimide layers and a conductive layer, useful for electronics-type applications, and compositions relating thereto |
| 05/12/2005 | US20050100719 Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto |
| 05/11/2005 | CN1200976C Heat resistant compsns. |
| 05/03/2005 | US6887580 Adhesive polyimide resin and adhesive laminate |
| 04/21/2005 | US20050085616 Heating; elimination of carbon dioxidea diisocyanate |
| 04/13/2005 | CN1605587A Fluoro-aromatic organic tetracarboxylic dianhydride and its preparation method and use |
| 04/12/2005 | US6878841 Diethyloctandioldicarbamates and diethyloctandioldiallophanates, method for the production and use thereof |
| 04/07/2005 | US20050075438 Composite adhesive |
| 03/24/2005 | US20050065296 Adhesive composition and adhesive film |
| 03/24/2005 | US20050064200 Polycarbodiimides; for electronic parts and lamination treatments; improved storage stability, adhesive strength, and high elastic modulus at high temperatures; for adhesion of copper foil onto glass fiber reinforced epoxy resin substrate |
| 03/23/2005 | EP1516891A1 A binder composition for lamination and an adhesive film using the same |
| 03/15/2005 | US6866934 A thermoplastic resin having a functional group and carbodiimide compound impregnated only in the surface layer section or both surface layer section and inside the base particle and both are strongly bonded by crosslinking reaction |
| 03/09/2005 | EP1512706A2 Thermosetting resin |
| 03/03/2005 | US20050049385 Thermosetting resin |
| 02/24/2005 | US20050043502 The polyimide contains 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane and the addition-condensation polyamide contains carboxylated polybutadiene with an optional acrylonitrile block; low elasticity, excellent flexibility and heat resistance |
| 02/23/2005 | EP1508584A1 Adhesive resin and film adhesives made by using the same |
| 02/16/2005 | EP0842212B1 Imide oligomers and co-oligomers containing pendent phenylethynyl groups and polymers therefrom |
| 02/09/2005 | CN1576295A Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition containing the same, film-forming material and adhesive for electronic parts made thereof |
| 02/08/2005 | US6852814 Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| 02/01/2005 | CA2090560C Heat-resistant adhesive composition |
| 01/25/2005 | US6846550 Heat resistant sealing resin between wire circuit and semiconductor |
| 01/20/2005 | US20050014908 Adhesive for gas barrier laminates and laminated films |
| 01/19/2005 | EP1448669A4 Polyimide copolymer and methods for preparing the same |
| 01/12/2005 | EP1496094A2 An adhesive sheet based on a siloxane-modified polyamideimide resin composition, and a CSP board and a semiconductor device produced by using the sheet |
| 01/12/2005 | EP1496078A1 Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition containing the same, film-forming material and adhesive for electronic parts made thereof |
| 01/12/2005 | CN1563242A Crimped adhesive and preparation method |
| 01/11/2005 | US6841615 Composite Adhesive |
| 12/30/2004 | US20040265601 Adhesion, heat resistance; bonding polyimide to copper foils |
| 12/16/2004 | US20040253457 one or more curable phenylethynyl or imide monomers and liquid or supercritical carbon dioxide; dielectric constant is further reduced by introducing pores; pores are formed concurrently with the polymerization and pores fill with air |
| 12/14/2004 | US6831132 Useful as adhesives in microelectronics industry; film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength |
| 12/01/2004 | CN1551910A Adhesive for gas barrier laminates and laminated films |
| 12/01/2004 | CN1551718A Metal foil adhered laminate |
| 12/01/2004 | CN1551715A Adhesive and adhered thin film |
| 11/30/2004 | US6825245 Solvent-free; controlling viscosity; material handling |
| 11/25/2004 | WO2004101701A1 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 11/24/2004 | CN1549843A Fluxing compositions |
| 11/18/2004 | WO2004099331A2 Imide-linked maleimide and polymaleimide compounds |
| 11/17/2004 | EP1476406A1 Aqueous dispersions consisting of polycarbodiimides |
| 11/16/2004 | US6818680 Curable adhesive compositions |
| 11/11/2004 | US20040225059 Imide-extended liquid bismaleimide resin |
| 11/11/2004 | US20040225026 Imide-linked maleimide and polymaleimide compounds |
| 10/28/2004 | US20040213994 Dicing/die bonding adhesion tape |
| 10/26/2004 | US6808819 Polyimide resin, epoxy resin-curing catalyst, and an epoxy resin |
| 10/20/2004 | EP1290101B1 Adhesive compositions containing stable amino-containing polymer latex blends |