| Patents for C09J 179 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups (1,765) |
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| 10/22/2008 | CN101289544A Process for producing polyimide film and polyimide film |
| 10/16/2008 | WO2008123110A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method |
| 10/08/2008 | EP1977888A1 Laminate |
| 10/08/2008 | CN101281968A Hydrophilic and corrosion-proof fuel cell part |
| 10/01/2008 | CN101278026A Adhesive and laminates made by using the same |
| 09/25/2008 | WO2008114642A1 Film and flexible metal-clad laminate |
| 09/24/2008 | EP1971634A2 Two-stage cure polyimide oligomers |
| 09/24/2008 | CN101271771A Cathode for a wet electrolytic capacitor |
| 09/18/2008 | WO2008111489A1 Fire-retardant adhesive resin composition, and adhesive film using the same |
| 09/17/2008 | EP1969081A1 High temperature heat resistant adhesive tape, with low electrostatic generation, made with a polyetherimide polymer |
| 09/16/2008 | US7425598 Adhesive of epoxy resin and curing agent with xylylene diamine structure |
| 09/04/2008 | WO2008105036A1 Binder resin for electrode of lithium ion secondary battery, composition and paste containing the resin, and electrode of lithium ion secondary battery using the resin |
| 09/03/2008 | CN101258212A Heat resistant adhesive sheet |
| 08/20/2008 | CN101245231A Adhesive composition, adhesive film, and method for producing semiconductor device |
| 08/14/2008 | WO2008096441A1 Thermosetting resin composition containing a compound having a carbon-carbon triple bond, process for low-temperature curing of the same, and cured articles |
| 08/13/2008 | CN100410325C Resin composition and its use in bonding sheet and copper clad plate |
| 08/07/2008 | US20080185700 Secure attachment to wafer chip from dicing through drying steps; laminated olefin polymer and polyimide; uniform thickness and shear strength; impact, moisture and heat resistance |
| 08/06/2008 | CN101238188A Adhesive film and semiconductor device using same |
| 08/05/2008 | US7408010 Adhesives and seals; blends of acrylic ester homopolymers and polymeric matrix selected from polyamides, polyacrylamides, polyimides, polyureaurethanes or polyamideester copolymers |
| 07/23/2008 | CN101228621A Adhesive composition for semiconductor, semiconductor device using the same and method for producing semiconductor device |
| 07/10/2008 | US20080167442 Supramolecular polymers |
| 07/09/2008 | EP1942168A1 Adhesive and laminates made by using the same |
| 07/09/2008 | CN101218539A Photosensitive adhesive composition, and obtained adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part using the same |
| 07/09/2008 | CN100400608C Primer, conductor foil with resin, laminate and process for producing the laminate |
| 07/09/2008 | CN100400529C Fluoro-aromatic organic tetracarboxylic dianhydride and its preparation method and use |
| 07/03/2008 | US20080160304 Polyamideimide compositions having multifunctional core structures |
| 06/18/2008 | CN101203490A Reactive monomer and resin composition containing same |
| 06/11/2008 | EP1624038B1 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 06/11/2008 | CN100393839C Polyaniline conducting adhesive |
| 06/05/2008 | US20080129182 Vacuum envelope for image display device and sealant for image display device |
| 05/29/2008 | DE19809419B4 Adhäsive Zusammensetzung, deren Verwendung und Verfahren zu deren Herstellung Adhesive composition, the use thereof and processes for their preparation |
| 05/14/2008 | CN101177055A Method of preparing modified benzoxazine glass cloth veneer sheet |
| 05/08/2008 | WO2008054012A1 Adhesive tape and semiconductor device using the same |
| 05/08/2008 | WO2008054011A1 Semiconductor electronic component and semiconductor device using the same |
| 05/08/2008 | CA2667853A1 Adhesive tape and semiconductor device using the same |
| 05/08/2008 | CA2667852A1 Semiconductor electronic component and semiconductor device using the same |
| 05/07/2008 | EP1918341A1 Adhesive film and semiconductor device using same |
| 04/29/2008 | US7364797 Adhesive composition and adhesive film |
| 04/16/2008 | CN101163769A Adhesive sheet with base used for flexible printed circuit board, method for producing same, multilayer flexible printed circuit board, and rigid-flex printed circuit board |
| 04/10/2008 | WO2008041646A1 Resin paste for die bonding, method for manufacturing semiconductor device, and semiconductor device |
| 04/10/2008 | WO2008041426A1 Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board |
| 03/27/2008 | US20080075961 condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds, then condensed with excess maleic anhydride to yield imide-extended maleimide compounds |
| 03/25/2008 | US7348397 Supramolecular polymers |
| 03/25/2008 | US7348373 For electronic screen printable pastes |
| 03/25/2008 | US7348080 polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit |
| 03/25/2008 | US7348064 Binders comprising condensation polymers used for lamination of flexible circuits and packaging electronics |
| 03/20/2008 | WO2008032669A1 Polyimide resin composition, process for production thereof, and metal laminate |
| 03/19/2008 | EP1901123A1 Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part |
| 03/18/2008 | US7345105 Conductive adhesive composition |
| 03/11/2008 | US7342053 Resin composition, adhesive film using the same and multilayer printed circuit board |
| 03/05/2008 | EP1895580A1 Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device |
| 03/05/2008 | CN101134857A Primer, conductor foil with resin, laminate and process for producing the laminate |
| 03/05/2008 | CN100372903C Resin adhesive for diamond grinding wheel |
| 02/28/2008 | WO2008023670A1 Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
| 02/28/2008 | US20080050586 Adhesive Film, Flexible Metal-Clad Laminate Including The Same With Improved Dimensional Stability, And Production Method Therefor |
| 02/27/2008 | CN100371411C Adhesive combination and membrane electrode assembly of fuel cell and preparation method thereof |
| 02/19/2008 | US7332547 Adhesives and seals comprising blends of acrylic ester homopolymers and polymeric matrix selected from polyamides, polyacrylamides, polyimides, polyureaurethanes or polyamideester copolymers |
| 02/14/2008 | WO2007018120A9 Adhesive film and semiconductor device using same |
| 02/12/2008 | CA2289083C Preforms for moulding process and resins therefor |
| 02/07/2008 | WO2008015852A1 Adhesive composition, and connection structure for circuit member |
| 02/07/2008 | WO2008015759A1 Film adhesive, adhesive sheet, and semiconductor device using the same |
| 01/31/2008 | WO2008013288A1 Laminate of heat resistant film and metal foil, and method for production thereof |
| 01/24/2008 | WO2008011452A1 Anisotropic conductive adhesive compositions |
| 01/24/2008 | WO2008010514A1 Thermocurable polyimide resin composition |
| 01/24/2008 | WO2008010494A1 Polyimide resin |
| 01/10/2008 | WO2008004615A1 Polyimide resin |
| 01/02/2008 | CN100358961C Stretch releasing pressure sensitive adhesive tapes and articles |
| 11/28/2007 | CN101080471A Polyimide multilayered adhesive film and process for producing the same |
| 10/23/2007 | US7285321 Vaiations in glass transition temperature between layers; electroconductive layer |
| 10/11/2007 | WO2007114462A1 Resin composition for insulating layer |
| 10/11/2007 | WO2007114081A1 Metal laminate |
| 09/27/2007 | WO2007108284A1 Adhesive film |
| 09/27/2007 | US20070225438 Resin Paste for Die Bonding |
| 09/20/2007 | US20070218277 Adhesive Film, Flexible Metal-Clad Laminate, and Processes for Producing These |
| 09/07/2007 | WO2007100016A1 Envelope for display and method for sealing the same |
| 09/07/2007 | WO2007100013A1 Housing for displays and method for sealing the same |
| 09/07/2007 | WO2007099801A1 Process for producing multilayered polyimide film |
| 09/07/2007 | WO2007075589A3 Two-stage cure polyimide oligomers |
| 08/30/2007 | WO2007097365A1 Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet making use of the same |
| 08/30/2007 | WO2007095670A1 Method and composition for priming wood and natural fibres |
| 08/29/2007 | CN101027345A Novel polyimide film and adhesive film and flexible metal-clad laminate both obtained with the same |
| 08/23/2007 | WO2007094276A1 Curable composition |
| 08/08/2007 | CN101014676A Adhesive film and method for manufacturing semiconductor device using same |
| 08/02/2007 | WO2007086434A1 Laminate |
| 07/31/2007 | US7250487 Polyamines; rheology modifiers for paints or coatings; additives for varying fluidity of epoxy paints; thermoplastics for carrying out reversible crosslinking, impact modifiers for polyamides; hot melts, lubricants; hydrogen bonding |
| 07/26/2007 | WO2007083623A1 Polyimide resin composition and metal polyimide laminate |
| 07/25/2007 | CN101003716A Method for preparing binder of polyimide of containing phenolic hydroxyl group |
| 07/18/2007 | CN100999581A Preparation process of boron-containing bene oxazine resin |
| 07/17/2007 | US7244495 Dicing/die bonding adhesion tape |
| 07/12/2007 | US20070158869 coextrusion; lamination; heat resistant polyimides |
| 07/05/2007 | WO2007075716A1 High temperature heat resistant adhesive tape, with low electrostatic generation, made with a polyetherimide polymer |
| 07/04/2007 | CN1993498A Solution, material for plating, insulating sheet, laminate and printed wiring board |
| 06/27/2007 | CN1989008A Adhesive film and use thereof |
| 06/19/2007 | CA2237331C Thermosetting polymers for composite and adhesive applications |
| 05/31/2007 | US20070123694 Polyamines; rheology modifiers for paints or coatings; additives for varying fluidity of epoxy paints; thermoplastics for carrying out reversible crosslinking, impact modifiers for polyamides; hot melts, lubricants; hydrogen bonding; 3-(2-aminoethyl)-imidazolidin-2-one monomer intermediate synthesis |
| 05/31/2007 | US20070123653 Polymerizable compositions in non-flowable forms |
| 05/24/2007 | US20070117263 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material |
| 05/24/2007 | DE102005055096A1 Folie mit reduzierter Oberflächenspannung Foil with reduced surface tension |
| 05/23/2007 | EP1266926B1 Adhesive polyimide resin and adhesive laminate |
| 05/22/2007 | US7220490 Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto |