Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
12/1998
12/16/1998EP0695318B1 Increasing the molecular weight of polyesters and premix useful for this process
12/16/1998CN1201986A Electronic component material containing insect repellent, electronic mail using the material and manufacture thereof
12/15/1998US5849857 Production method for photo-sensitive resin and liquid photo-sensitive resin composition
12/15/1998US5849460 Photosensitive resin composition and method for using the same in manufacture of circuit boards
12/09/1998EP0882108A1 Polyamide based laminating, coverlay, and bond ply adhesive with heat activated cure component
12/09/1998EP0445192B2 Aqueous polyurethane and polyurethane carbamide dispersions, and a process for flock-coating moulded elastomeric products and for heat-sealing textile articles using these dispersions
12/09/1998CN1201053A Flame-retardant resin composition and semiconductive sealing material made of same
12/09/1998CN1201051A Solidifiable composition based on polymer containing free carboxy
12/09/1998CN1201045A Resin rice-milling roller and making method therefor
12/08/1998US5847027 Hardeners for elastic epoxy resin systems
12/03/1998DE19824193A1 Flame resistant resin composition useful for encapsulation of semiconductor devices
12/02/1998EP0881262A2 Curable composition on the basis of polymers containing free carboxylic groups
12/02/1998EP0880553A1 Increasing the molecular weight of polycondensates
12/02/1998EP0880552A1 Increasing the molecular weight of polyamides
12/01/1998US5844053 Organo-polysiloxane derivartives
12/01/1998US5843550 Adhesive tape for tape automated bonding
12/01/1998CA1340156C Coating compositions based on polyepoxides and polyacid curing agents
12/01/1998CA1340155C Coating composition based on polyepoxides and urethane-containing polyacid curing agents
11/1998
11/26/1998WO1998053008A1 Curable sealant composition
11/26/1998CA2290425A1 Curable sealant composition
11/25/1998EP0879854A2 A resin composition for a fibre reinforced composite, a prepreg and a fibre reinforced composite
11/25/1998EP0879257A1 Polymerizable substances based on epoxides
11/25/1998EP0598872B1 Additives for polymer compositions
11/24/1998US5840829 Plateable structural adhesive for cyanate ester composites
11/24/1998US5840825 Gas barrier coating compositions containing platelet-type fillers
11/24/1998US5840384 Reaction product of acrylic polymer or polyester having carboxyl functionality, epoxy resin and tertiary amine; smoothness, gloss, adhesion, processability, retorting resistance, minimal generation of fumes
11/24/1998CA1340142C Flexibilizer combinations for epoxy resins
11/19/1998WO1998051853A1 Nonaqueous sizing for glass and carbon fibers
11/19/1998WO1998051744A1 Epoxy resin composition
11/18/1998EP0878505A1 Heat-fusible compositions and multi-layer moldings comprising layers made therefrom
11/18/1998EP0877763A1 Process for thickening thermoset resin molding compound compositions
11/17/1998US5837785 Epoxy curing agent and one-component (type) epoxy resin composition
11/17/1998US5837771 Epoxy resin with phosphonic acid anhydride in a di or tetracarbonic acid anhydride hardener
11/17/1998US5837770 Process for producing flame retardant thermoplastic polyester resin composition
11/17/1998US5837749 Photoinitiator
11/11/1998EP0877057A2 A compatible blend containing an epoxy-modified block copolymer, a process, a thermoplastic resin composition, resin compositions and an asphalt composition containing an epoxy-modified block copolymer
11/11/1998EP0877056A2 A compatible blend containing an epoxy-modified block copolymer, a process, a thermoplastic resin composition, resin compositions and an asphalt composition containing an epoxy-modified block copolymer
11/11/1998CN1198760A Thermosetting resin compositions
11/11/1998CN1040652C Binder composition for power paints, preparation and application thereof
11/10/1998US5834565 Curable polyphenylene ether-thermosetting resin composition and process
11/10/1998US5834537 Curable material which phase separates during heat curing process
11/10/1998US5833746 Used in resin compositions for encapsulating semiconductors, high loading and high flowability without lowering strength of encapsulating compound
11/05/1998WO1998049236A1 Novel composition, antisticking agents, and thermal transfer recording films
11/05/1998WO1998049214A1 Nitrogen-containing epoxy resins for photocurable coating applications
11/04/1998CN1198010A Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device
11/04/1998CN1197817A Ink jet print head containing radiation curable resin layer
11/03/1998US5830975 Polyamide-based powder composition for the coating of metal substrates
11/03/1998US5830973 From a diphosphinic acid and a polyepoxide
11/03/1998US5830945 Macromonomers having reactive side groups
11/03/1998US5830580 Acrylic polymer protective bonding coating
11/03/1998CA1340117C Epoxide resins containing polyesters based on polyalkyline glycols
10/1998
10/29/1998WO1998047968A1 Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device
10/28/1998EP0857186A4 Thermosetting resin compositions
10/28/1998EP0843685A4 Ionizing radiation curing of epoxy resin systems incorporating cationic photoinitiators
10/27/1998US5827908 Naphthalene and or biphenyl skeleton containing epoxy resin composition
10/27/1998US5827907 Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
10/27/1998US5827575 Comprises a hydroxyl- and carboxyl-containing acrylic resin, a melamine resin, an alicyclic epoxy-containing compound, a neutralizing agent and a coloring pigment
10/22/1998WO1998046649A1 Higher modulus compositions incorporating particulate rubber
10/21/1998EP0557476B1 Aminoplast resin or aminoplast resin precursor
10/21/1998CN1196363A Mixtures of thermosets and oxidized polyarylene sulfides
10/20/1998US5824424 Cationic electrodepositable coating composition and coating method using the same
10/14/1998EP0870805A2 Epoxy composition for printed circuit boards
10/14/1998EP0858615A4 Thermosetting anti-reflective coatings and method for making same
10/14/1998EP0779902B1 Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound
10/14/1998CN1195680A Powder paints and its preparation and use
10/13/1998US5821318 Hardener composition for epoxy resins
10/13/1998US5821309 Self-supporting films
10/13/1998US5821305 Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound
10/08/1998WO1998044031A1 Vinylchloride-based resin composition having flame retardancy, and an electric wire and a cable having flame retardancy
10/08/1998WO1998044007A1 Radiation-polymerizable composition and printing inks containing same
10/07/1998EP0869153A2 Mixtures of thermosetting polymers and oxidised polyarylene sulfides
10/07/1998EP0869148A1 Epoxy resin composition and method for producing the same
10/07/1998EP0868487A1 Thermoplastic moulding materials based on polyethylene terephthalate for use in injection moulding of parts
10/07/1998EP0868485A1 Compositions comprising hydroxy-functional polymers
10/07/1998CN1195357A Polymer material, process for its production and use thereof
10/06/1998US5817736 Epoxy resin mixtures for prepregs and composites based on phosphorus-modified epoxies, dicy and/or aminobenzoic compounds
10/01/1998WO1998042762A1 Chemical compositions
10/01/1998CA2284841A1 Chemical compositions
09/1998
09/30/1998EP0867549A1 Fibre containing moulding with thermosetting binder and method of production
09/30/1998EP0867488A1 Ink jet print head containing a radiation curable resin layer
09/30/1998EP0867475A2 Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device
09/30/1998EP0737222B1 High solids coating composition
09/30/1998CN1194279A Resin composition and adhesive film made from said composition
09/30/1998CN1040007C Stabilizer mixture
09/30/1998CA2233579A1 Epoxy resin composition and method for producing the same
09/29/1998US5814412 Moldings of thermosetting resins such as polyesters with metal compounds
09/23/1998EP0866109A1 Adhesive, process for the preparation thereof, and process for mounting components
09/22/1998US5811486 Phosphorus-free epoxy resin and an epoxy-free hardener comprising a conversion product of a phosphonic acid anhydride and an alcohol having at least two hydroxyl groups
09/22/1998US5811188 For dielectrics, prepregs or other electrical equipmewnt
09/15/1998US5807959 For semiconductors
09/15/1998US5807954 Metal-nitrogen polymer compositions comprising organic electrophiles
09/15/1998US5806275 Chemical anchor bolt and cap assembly
09/11/1998WO1998039393A1 Crosslinker for film forming composition
09/09/1998EP0862794A1 Sealing material with wavelength converting effect, application and production process
09/09/1998EP0794979B1 Blends of cyanate-triazine copolymers and epoxy resins
09/09/1998CN1039703C Polymer-modified cements composite with improved chemical resitance, and products thereof
09/08/1998US5804671 Radiation curable rheology modifiers
09/08/1998US5804616 Epoxy-polysiloxane polymer composition
09/05/1998CA2231008A1 Polymeric composition for radiation shielding
09/02/1998EP0861874A1 Use of a mixture containing phenoxy resin as an additive for a thermoplastic polymer to reduce its diffusion coefficient