Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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09/02/1998 | EP0861862A2 Method for reinforcing structures |
09/02/1998 | EP0861277A1 Powderable reactive resin compositions |
09/02/1998 | EP0754209B1 Curable resin composition, coating composition, coating method and coated article |
09/02/1998 | CN1192228A Non-aqueous solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
09/02/1998 | CN1192227A Solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
09/01/1998 | US5801216 Flexible resin-clay composite, method of preparation and use |
08/28/1998 | CA2230151A1 Method for reinforcing structures |
08/27/1998 | WO1998037134A1 Low-cost high-performance no-flow underfills for flip-chip applications |
08/26/1998 | EP0860473A1 Aqueous resin composition and aqueous paint |
08/25/1998 | US5798422 Aromatic hydroxycarboxylic acid resins and their use |
08/25/1998 | US5798400 Epoxy resin compound |
08/25/1998 | US5798398 Useful in non-blushing coatings of high gloss, long pot life and fast cure time |
08/25/1998 | US5798158 Layered molding including fluoroplastic layer crosslinked with rubber layer |
08/19/1998 | EP0859403A1 Pressure sensitive adhesive composition for the polishing of the back of a wafer |
08/19/1998 | EP0859374A2 Process for producing highly reactive modified phenolic resin, and molding material, material for electrical/electronic parts and semiconductor sealing material |
08/19/1998 | EP0859027A1 Curable compositions |
08/19/1998 | EP0858617A2 Low-shrinkage light-curable resin |
08/19/1998 | EP0858615A1 Thermosetting anti-reflective coatings and method for making same |
08/19/1998 | EP0858472A1 Photosensitive resin composition |
08/19/1998 | CN1190665A Pressure sensitive adhesive composition and use thereof |
08/18/1998 | US5795618 Forming an adhesive layer on a substrate, dispersion of cured powder amino resins for heat resistance, oxidation and roughening surface then treatment with electroless deposition of metals to form conductors |
08/13/1998 | WO1998034992A1 Method for gluing a surface to a component |
08/13/1998 | WO1998034982A1 Primer for plastic films |
08/13/1998 | WO1998034586A1 Foaming shaving cream |
08/13/1998 | DE19705027A1 Verfahren zum Verkleben eines Bauelements mit einer Oberfläche A process for bonding a component with a surface |
08/13/1998 | DE19704635A1 Schäumende Rasiercreme Foamy shaving cream |
08/13/1998 | CA2280050A1 Primer for plastic films |
08/13/1998 | CA2279849A1 Method for cementing a component to a surface |
08/12/1998 | EP0857188A1 Self-dispersing curable epoxy resin esters |
08/12/1998 | EP0857186A1 Thermosetting resin compositions |
08/12/1998 | EP0374258B1 High refractive index lens and method for its production |
08/12/1998 | CA2229300A1 Curable composition |
08/11/1998 | US5792826 Process for producing highly reactive low-viscosity modified phenolic resins |
08/11/1998 | US5792814 Method for preparing modified resins and their applications |
08/11/1998 | CA1339996C Resin compositions and a method of curing the same |
08/06/1998 | WO1998033849A1 High-melting polyamide resin compositions and molded articles thereof |
08/06/1998 | WO1998033645A1 Die adhesive or encapsulant of epoxy siloxane and polyepoxy resin |
08/05/1998 | EP0856560A2 Solvent-free two-liquid type normal temperature curable liquid polymer composition and its use |
08/05/1998 | EP0856556A2 Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method |
08/05/1998 | CN1189847A Use of silicone-modified epoxy resins as sealing compound for electrical working or electronic assemly |
08/05/1998 | CN1189841A Epoxy resin compsn. for printed wiring board and laminated board produced with the use of the same |
08/04/1998 | US5789520 Curing agent for resins and resin composition containing the same |
08/04/1998 | US5789482 Epoxy resin with anhydride, toughener and active hydrogen-containing compound |
07/30/1998 | WO1998032792A1 Epoxy-polysiloxane polymer composition |
07/30/1998 | DE19702278A1 Apparatus for insulating high voltage machinery component(s) |
07/29/1998 | EP0855427A1 Aqueous dispersion composition |
07/29/1998 | EP0734418B1 Impact-modified polymer blends containing a liquid crystalline polymer |
07/23/1998 | WO1998032138A1 Electric insulation compositions based on epoxy-silicone hybrid resins |
07/23/1998 | WO1998031750A1 Latent catalysts for epoxy curing systems |
07/23/1998 | WO1998031738A1 Thermosetting resin compositions |
07/23/1998 | WO1998031722A1 One-pack cold moisture curable resin compositions |
07/22/1998 | CN1188497A Curable compositions |
07/21/1998 | US5783644 Curable epoxy resin composition |
07/14/1998 | US5780581 Plateable structural adhesive for cyanate ester composites |
07/14/1998 | US5780571 Naphthalene ring-containing resins, resin compositions and cured products thereof |
07/14/1998 | US5780555 Epoxy resin system |
07/14/1998 | US5780532 Aqueous coating of carboxyl acrylic resin-epoxy resin product |
07/14/1998 | US5780195 Polyester resin crosslinked with polyfunctional epoxy resin in presence of catalyst |
07/09/1998 | WO1998029491A1 Polymer-organoclay-composites and their preparation |
07/09/1998 | WO1998029470A1 Polyester elastomers, processes for preparing the same, and compositions of the same |
07/09/1998 | WO1998029469A1 Curatives for epoxy resin, curing accelerator, and epoxy resin composition |
07/09/1998 | DE19800178A1 Fire=proof epoxy] resin material for semiconductor encapsulation |
07/09/1998 | CA2246269A1 Polymer-organoclay-composites and their preparation |
07/08/1998 | EP0851894A1 Semi-interpenetrating polymer networks of epoxy and polyolefin resins, methods therefor, and uses thereof |
07/08/1998 | EP0851885A1 Cross-linked biobased materials and uses thereof |
07/08/1998 | EP0779906B1 Epoxy resin mixtures for prepregs and composites |
07/07/1998 | US5776998 Non-aqueous solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
07/07/1998 | US5776569 Coating composition for metal containers |
07/07/1998 | US5776376 Blend of epoxy and unsaturated ester monomers |
07/07/1998 | CA2055379C Heat-curable resin composition containing acrylic polymer having alicyclic epoxide functions |
07/02/1998 | WO1998028788A1 Manufacture of semiconductor device |
07/02/1998 | WO1998028356A1 Material containing polyreactions products and method for the production thereof |
07/02/1998 | DE19757591A1 Composition for production of floor and wall coverings and insulating material |
07/01/1998 | EP0851726A2 Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same |
07/01/1998 | EP0850976A1 Polymer polyamines from alternating polyketones |
07/01/1998 | EP0850973A1 Phenolic hydroxyl-containing modified resin, curable composition thereof, epoxidation product of said modified resin, and curable composition thereof |
07/01/1998 | EP0850436A1 Toner resin compositions |
07/01/1998 | CN1186027A Distributing composition for magnetic display |
06/30/1998 | US5773533 Epoxy resin reacted with carboxy-functional phosphinic or phosphonic acid and hardener |
06/30/1998 | US5773528 Photocurable, for electronics packaging |
06/30/1998 | US5773509 Heat resistant resin composition, heat resistant film adhesive and process for producing the same |
06/30/1998 | US5773501 Flame retardant styrene resin composition |
06/25/1998 | WO1998026912A1 Carbon fiber prepreg and method of production thereof |
06/25/1998 | DE19756554A1 Hot melt adhesives used to bond copper films on flexible printed substrates to basis materials |
06/24/1998 | CN1185473A Liquid-state epoxy resin potting material |
06/23/1998 | US5770658 Alk(en)yl and hydroxy-substituted aromatic acid modified epoxy resins |
06/23/1998 | US5770268 Dipping the substrate into a liquid comprising polyester, a functional polyol compound and a cycloaliphatic epoxy compound, a thermal curing catalyst, withdrawing the substrate from the solution, thermally curing the coating |
06/18/1998 | WO1998025988A1 Epoxy resin-amine addition products for use as emulsifiers for epoxy resins; aqueous based epoxy resin dispersions and process for producing the same |
06/18/1998 | CA2242975A1 Epoxy resin-amine addition products for use as emulsifiers for epoxy resins; aqueous based epoxy resin dispersions and process for producing the same |
06/17/1998 | EP0848292A1 Photo-curable resin composition |
06/17/1998 | EP0847876A1 Dispersion composition for magnetic display |
06/17/1998 | CN1185166A Epoxy resin moulding materials fire-proofed without halogens |
06/17/1998 | CN1038759C Glass size compositions and glass fibers coated therewith |
06/16/1998 | US5767218 Metal-nitrogen polymer compositions comprising organic electrophiles |
06/16/1998 | US5767187 Interpenetrating polymer network compositions |
06/16/1998 | US5767177 Injection mouldable thermosetting composition especially for motor vehicle bodies, method of production and method or recycling |
06/16/1998 | US5767176 Aqueous dispersion composition containing microcrystalline cellulose and composition using the same |
06/16/1998 | US5766768 Ionic emulsion polymers and their preparation |
06/16/1998 | US5766767 Coating composition process for forming cured film and coated article |
06/16/1998 | US5766670 Via fill compositions for direct attach of devices and methods for applying same |