| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 05/10/2012 | WO2012059529A1 Epoxidised elastomer compositions modified by silanes |
| 05/10/2012 | US20120115988 Catalysis of epoxy resin formulations having sparingly soluble catalysts |
| 05/09/2012 | EP2448991A2 A self-imageable film forming polymer, compositions thereof and devices and structures made therefrom |
| 05/09/2012 | EP2448990A1 Polymer compositions and methods of making and using same |
| 05/09/2012 | EP2448989A1 2-component laminating adhesive |
| 05/09/2012 | EP1762582B1 Epoxy resin composition |
| 05/09/2012 | CN102449093A Photocurable adhesive composition, photocurable adhesive layer, and photocurable adhesive sheet |
| 05/09/2012 | CN102449021A Epoxy resin-based coating composition |
| 05/09/2012 | CN102449020A Resin composition for semiconductor encapsulation, and semiconductor device |
| 05/09/2012 | CN102449019A Polymeric glycidyl ethers reactive diluents |
| 05/09/2012 | CN102449018A Epoxy resin composition, prepreg and fiber-reinforced composite material |
| 05/09/2012 | CN102445850A Alkali development-type solder resist, cured product thereof, and printed wiring board prepared by using the same |
| 05/09/2012 | CN102443246A Silicon-containing resin packaging composition |
| 05/09/2012 | CN102443139A Polymercaptan curing agent and preparation method thereof |
| 05/09/2012 | CN102443138A Epoxy resin composition as well as prepreg and copper-foil-clad laminated board prepared by using same |
| 05/09/2012 | CN102443137A Epoxy resin composition for optical semiconductor device, lead frame obtained using the same for optical semiconductor device, and optical semiconductor device |
| 05/09/2012 | CN102443136A Photosensitive resin, curable resin composition containing the same, dry film thereof, and printed circuit board using them |
| 05/09/2012 | CN102443114A Air-dried unsaturated polyester resin with excellent comprehensive property and its preparation method |
| 05/09/2012 | CN102030887B Preparation method of machinable solid buoyancy material |
| 05/09/2012 | CN101864057B Epoxy resin used for powder coating and preparation method thereof |
| 05/08/2012 | US8173823 Method for making an epoxide |
| 05/08/2012 | US8173726 Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby |
| 05/08/2012 | CA2591450C Environmentally friendly demulsifiers for crude oil emulsions |
| 05/03/2012 | WO2012057228A1 Phenol-type oligomer and process for production thereof |
| 05/03/2012 | WO2012057171A1 Resin composition, and prepreg and laminate using same |
| 05/03/2012 | WO2012056629A1 Resin composition |
| 05/03/2012 | WO2011140402A3 Potting for electronic components |
| 05/03/2012 | WO2011032120A3 Underfill for high density interconnect flip chips |
| 05/03/2012 | US20120107732 Curable compositions, method of coating a phototool, and coated phototool |
| 05/02/2012 | EP2445949A1 Hardener composition for epoxy resins |
| 05/02/2012 | EP1697441B1 Novel underfill material having enhanced adhesion |
| 05/02/2012 | CN102439100A One-component epoxy coating compositions |
| 05/02/2012 | CN102433001A Halogen-free flame-retarding material composition and application thereof in bonding sheets, copper clad laminates and laminates |
| 05/02/2012 | CN102432981A Solvent-based insulating glue, round net fetal membrane using the same and preparation method thereof |
| 05/02/2012 | CN102432980A Epoxy resin composition for semiconductor packaging and preparation method thereof |
| 05/02/2012 | CN102432896A Application and preparation method for high viscosity epoxy resin |
| 05/02/2012 | CN102432868A Method for synthesizing low-viscosity epoxy resin curing agent |
| 05/02/2012 | CN102432840A Stereolithography rapid protoyping photosensitive resin prepared by using polypropylene glycol diglycidyl ether diacrylate as prepolymer, and preparation method for stereolithography rapid protoyping photosensitive resin |
| 05/02/2012 | CN102432839A Light-colored cardanol alkyl ether epoxy curing agent and preparation method thereof |
| 05/02/2012 | CN102432838A Epoxy systems for composites |
| 05/02/2012 | CN102432837A Phosphor and nitrogen containing flame retardant curing agent, preparation method and application thereof |
| 05/02/2012 | CN102432836A Halogen-free thermosetting resin composition and prepreg and laminated board manufactured by same |
| 05/02/2012 | CN102432835A Curable compositions |
| 05/02/2012 | CN102432834A Oligomeric halogenated chain extenders for preparing epoxy resins |
| 05/02/2012 | CN102432833A Phosphorus-containing epoxy resin |
| 05/02/2012 | CN102432832A Vinyl ester resin for fiber glass-reinforced plastic mold and preparation method thereof |
| 05/02/2012 | CN102432831A Single-component aqueous epoxy resin emulsion capable of being self-cured at normal temperature, and preparation method thereof |
| 05/02/2012 | CN102432830A Water-based epoxy resin curing agent emulsion and preparation method thereof |
| 05/02/2012 | CN102432829A Sulphur-containing optical epoxy resin and preparation method thereof |
| 05/02/2012 | CN102432795A Sulfonated aqueous UV polyurethane modified epoxy acrylate emulsion and its preparation method |
| 05/02/2012 | CN102432787A Modified hydrocarbylphenol-aldehyde resins for use as tackifiers and rubber compositions containing them |
| 05/02/2012 | CN102432729A Modified epoxy resin by in-situ polymerization of double-bond unsaturated monomer |
| 05/02/2012 | CN101914196B Curing composition for epoxy resin and preparation method and application thereof |
| 05/02/2012 | CN101735564B Vacuum infusion resin for wind turbine blades and preparation method thereof |
| 05/02/2012 | CN101492528B Method for synthesis of alicyclic epoxy resin with catalysis of solid supported heteropoly acid catalyst |
| 04/26/2012 | WO2012053661A1 High-molecular-weight epoxy resin and resin film, resin composition, and cured article using high-molecular-weight epoxy resin |
| 04/26/2012 | WO2012053524A1 Filler composition for space between layers of three-dimensional integrated circuit, coating fluid, and process for producing three-dimensional integrated circuit |
| 04/26/2012 | WO2012053522A1 Sealing resin composition and electronic component device |
| 04/26/2012 | WO2012053377A1 High refractive index resin composition and cured resin |
| 04/26/2012 | WO2012009118A3 Curable resin compositions |
| 04/26/2012 | US20120101246 Epoxy Resin, Method for Producing Same and Epoxy Resin Composition Thereof |
| 04/26/2012 | US20120101238 Hydrogenation process for improving yield of hydrogenated bisphenol-a-based epoxy resin |
| 04/25/2012 | EP2444437A1 Resin composition and organic-electrolyte battery |
| 04/25/2012 | EP2444391A1 Base and radical generator, composition using same and method for curing same |
| 04/25/2012 | CN1997682B Resin composition for semiconductor sealing and semiconductor device |
| 04/25/2012 | CN1934098B 高纯度脂环式环氧化合物、其制备方法、可固化环氧树脂组合物、其固化产物及其应用 High purity cyclic aliphatic epoxy compounds, methods for their preparation, the curable epoxy resin composition, a cured product and its application |
| 04/25/2012 | CN102428130A Anisotropic composite |
| 04/25/2012 | CN102424738A 一种高弹性无溶剂纳米改性环氧树脂及其制备方法与应用 A highly flexible solvent-free nano-modified epoxy resin and its preparation method and application |
| 04/25/2012 | CN101935388B 树脂组合物及其在复合材料线芯制备中的应用 The resin composition and its application in the preparation of composite core material |
| 04/25/2012 | CN101864060B 低表面能环氧纳米杂化材料的制备方法 Low surface energy epoxy nano hybrid materials prepared |
| 04/25/2012 | CN101633724B 环氧树脂组合物 The epoxy resin composition |
| 04/25/2012 | CN101608053B 热固化性树脂组合物 Heat-curable resin composition |
| 04/25/2012 | CN101068846B 环氧树脂组合物及半导体器件 Epoxy resin composition and semiconductor device |
| 04/24/2012 | US8163867 Process for producing polycarbonates and a coordination complex used therefor |
| 04/19/2012 | WO2012050789A1 Low-bake powder coating composition |
| 04/19/2012 | WO2012050777A1 Advanced poly epoxy ester resin compositions |
| 04/19/2012 | WO2012049186A1 Copolymers containing polysiloxane groups and having an epoxy/amine skeletal structure, and use thereof |
| 04/19/2012 | US20120095124 Base and radical generator, composition using same and method for curing same |
| 04/19/2012 | CA2813867A1 Solvent resistant thermoplastic toughened epoxy |
| 04/18/2012 | EP2441787A1 Low-bake powder coating composition |
| 04/18/2012 | EP2441778A1 Photosensitive composition |
| 04/18/2012 | EP2440172A1 Epoxy-containing composition curable by multiple polymerization mechanisms |
| 04/18/2012 | EP2094759B1 Epoxy resins comprising a cycloaliphatic diamine curing agent |
| 04/18/2012 | EP1458579B1 Method of making models |
| 04/18/2012 | CN102421848A Method of storing resin solution and processes for producing prepreg and laminate |
| 04/18/2012 | CN102417808A 一种耐高温胶粘剂及其制备方法 A high temperature adhesive and its preparation method |
| 04/18/2012 | CN102417758A 液态感光阻焊油墨 Liquid photosensitive solder resist ink |
| 04/18/2012 | CN102417693A 汽车传感器专用单组份环氧灌封料及其制造方法 Automotive sensors for one-component epoxy potting compound and its manufacturing method |
| 04/18/2012 | CN101817962B 聚氯乙烯和环氧树脂共混物及其制备方法 PVC and epoxy blends its preparation method |
| 04/18/2012 | CN101600751B 酰胺或硫酯预增长的环氧基封端的韧性改进剂及其制备方法 Amide or thioester growth pre-terminated epoxy toughness modifiers and preparation method |
| 04/17/2012 | US8158724 Curable compositions for advanced processes, and products made therefrom |
| 04/12/2012 | WO2012046553A1 Curing agent composition for epoxy resin, curable resin composition, and cured product thereof |
| 04/12/2012 | WO2012046552A1 Method for producing cured product and cured product |
| 04/12/2012 | WO2012046088A1 Thermosetting resin adhesive containing irradiated thermoplastic toughening agent |
| 04/12/2012 | WO2012020713A3 Resin composition, cured resin product, wiring board, and manufacturing method for wiring board |
| 04/12/2012 | WO2012009120A3 Curable resin compositions |
| 04/12/2012 | WO2011116050A3 Curing agents for epoxy resins |
| 04/12/2012 | US20120088864 Solvent resistance of epoxy resins toughened with polyethersulfone |
| 04/11/2012 | EP2439246A1 Photocurable adhesive composition, photocurable adhesive layer, and photocurable adhesive sheet |
| 04/11/2012 | EP2439223A1 Copolymers containing polysiloxane groups with epoxy/amine as main structure and their use |