| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 05/30/2012 | CN102483573A Alkali-developable photocurable resin composition, dried film and cured product of the composition, and printed wiring board comprising the dried film or the cured product |
| 05/30/2012 | CN102483571A Photosensitive composition and printed wiring board |
| 05/30/2012 | CN102482400A 环氧树脂组合物 The epoxy resin composition |
| 05/30/2012 | CN102482399A 催化含难溶催化剂的环氧树脂配制剂 Catalyzed epoxy resin formulations containing insoluble catalyst |
| 05/30/2012 | CN102482398A Engineered crosslinked thermoplastic particles for interlaminar toughening |
| 05/30/2012 | CN102482242A Diepoxy compound, process for producing same, and composition containing the diepoxy compound |
| 05/30/2012 | CN102477228A 一种反应性液体纳米添加物的制备方法 Method for preparing a reactive liquid nano-additive |
| 05/30/2012 | CN102061062B Synthetic resin composition for cast-in-situ medium-voltage bus |
| 05/30/2012 | CN102030969B Synthetic resin composition for pouring low-voltage bus on site |
| 05/30/2012 | CN102030885B Hydroxyl-contained alicyclic epoxy resin and preparation method thereof |
| 05/30/2012 | CN101970526B Epoxy resin composition and molded object |
| 05/30/2012 | CN101942072B Synthetic method of epoxy acrylate |
| 05/30/2012 | CN101861518B Monolith separation medium for chromatographic use and method of producing the same |
| 05/30/2012 | CN101772526B Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device |
| 05/30/2012 | CN101679607B Catalyst for curing epoxides |
| 05/30/2012 | CN101659740B Self-crosslinking sulfonate-base epoxy ester aqueous dispersion and anti-corrosive primer thereof |
| 05/30/2012 | CN101633771B Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions |
| 05/30/2012 | CN101611069B Crystalline resin cured product, crystalline resin composite body and method for producing the same |
| 05/30/2012 | CN101544807B Epoxy anti-fouling material and preparation method and use of same |
| 05/30/2012 | CN101516993B Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 05/30/2012 | CN101463179B Aqueous self-emulsifying epoxy resin emulsion and preparation thereof |
| 05/30/2012 | CN101433134B Solder resist material, wiring board using the solder resist material, and semiconductor package |
| 05/30/2012 | CN101389684B Curable epoxy resin composition |
| 05/30/2012 | CN101384638B Epoxy resin composition for sealing of semiconductor and semiconductor device |
| 05/30/2012 | CN101291990B Thermosetting resin composition and use thereof |
| 05/30/2012 | CN101235126B Integrated utilization method for byproduct of vanillin production |
| 05/30/2012 | CN101223206B Pre-applied sealing resin composition, semiconductor device and method for manufacturing semiconductor device using the same |
| 05/30/2012 | CN101166789B Composition containing fluorine-containing aromatic polymer and laminated body containing fluorine-containing aromatic polymer |
| 05/29/2012 | US8187790 Polymer for resist and resist composition manufactured using the same |
| 05/24/2012 | WO2012067270A1 One component epoxy resin composition |
| 05/24/2012 | WO2012067092A1 Epoxy resin composition for transparent sheets and cured product thereof |
| 05/24/2012 | WO2012067071A1 Polyfunctional epoxy compound |
| 05/24/2012 | WO2012067040A1 Resist underlayer film forming composition, and method for forming resist pattern using same |
| 05/24/2012 | US20120130040 Polymer Compositions and Methods of Making and Using Same |
| 05/24/2012 | US20120130013 Method For Producing Epoxide Amine Addition Compounds |
| 05/24/2012 | US20120129978 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 05/24/2012 | US20120126187 Heat transfer compositions |
| 05/24/2012 | CA2818172A1 Structural adhesive compositions |
| 05/23/2012 | EP2455424A1 Method for continuous production of a prepolymer based on phenol resins, oxazolines and epoxides |
| 05/23/2012 | EP2454309A2 Heat-resistant, chemical resistant, room temperature curable, solvent-free resin compositions to apply as protective coating |
| 05/23/2012 | EP2454308A1 Epoxy resin composition |
| 05/23/2012 | EP2454307A1 Oxygen barrier compositions and related methods |
| 05/23/2012 | EP2253666B1 Curable resin composition and cured resin |
| 05/23/2012 | CN102472970A 光固化性热固化性树脂组合物 The photocurable and thermosetting resin composition of the |
| 05/23/2012 | CN102472928A Liquid crystal sealing agent for liquid crystal dropping method and liquid crystal display cell using same |
| 05/23/2012 | CN102471560A Energy ray-curable epoxy resin composition having excellent curing properties in deep portions |
| 05/23/2012 | CN102471495A Aluminum chelate-based latent curing agent |
| 05/23/2012 | CN102471464A Liquid resin composition and semiconductor device formed using same |
| 05/23/2012 | CN102471463A 表面保护层用热固性树脂组合物 A surface protective layer with a thermosetting resin composition |
| 05/23/2012 | CN102471462A Aluminum chelate-based latent curing agents and process for preparation thereof |
| 05/23/2012 | CN102471461A Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these |
| 05/23/2012 | CN102471460A 布线板的保护膜用热固性组合物 The protective film of the wiring board with the thermosetting composition |
| 05/23/2012 | CN102471459A 抗冲击性改进的基于环氧树脂的组合物 Improved impact resistance of the compositions based on epoxy resins |
| 05/23/2012 | CN102471458A Resin composition for fiber-reinforced composite materials, cured product thereof, fiber-reinforced composite materials, moldings of fiber-reinforced resin, and process for production thereof |
| 05/23/2012 | CN102471457A 双-组份层合粘合剂 Dual - component laminating adhesive |
| 05/23/2012 | CN102471456A 快速固化性优异的能量射线固化型环氧树脂组合物 Rapid curability energy-ray-curable epoxy resin composition |
| 05/23/2012 | CN102471455A 阻氧组合物以及相关方法 Oxygen barrier compositions and related methods |
| 05/23/2012 | CN102471454A 制备粒状环氧树脂的方法 The method of preparing a granular epoxy resin |
| 05/23/2012 | CN102468192A Method of manufacturing semiconductor device |
| 05/23/2012 | CN102464964A Adhesive composition |
| 05/23/2012 | CN102464863A Color pavement cementing material and application thereof |
| 05/23/2012 | CN102464862A Thermosetting composition |
| 05/23/2012 | CN102464860A 剑杆带固化剂及其制造方法 Rapier band and its manufacturing method of the curing agent |
| 05/23/2012 | CN102464792A Method and device for reducing volatile matters of o-cresol-formaldehyde epoxy resin |
| 05/23/2012 | CN101982480B Solvent-containing high-temperature corrosion-resistant flame-resistant anti-fouling thermoplastic resin |
| 05/23/2012 | CN101914194B Self-emulsified nonionic terpenyl epoxy resin polyalcohol emulsion and preparation method and application |
| 05/23/2012 | CN101891902B Method for recycling waste epoxy resin |
| 05/23/2012 | CN101851396B Waterborne epoxy ester resin composition and preparation method thereof and water-based paint prepared from same |
| 05/23/2012 | CN101824152B Preparation method and application of resin having double curing groups |
| 05/23/2012 | CN101775194B Carbon nano tube/epoxide resin composite material and preparation method thereof |
| 05/23/2012 | CN101072807B Thermosetting epoxy resin composition and use thereof |
| 05/18/2012 | WO2012064724A2 Curable and cured compositions |
| 05/18/2012 | WO2012062853A1 Condensation products of aminofunctional polymers |
| 05/17/2012 | US20120123061 Composite Materials and Method for Making High-Performance Carbon Nanotube Reinforced Polymer Composites |
| 05/17/2012 | US20120121898 Polymer material, method for in situ functionalisation of polymer materials and also use thereof |
| 05/17/2012 | CA2758420A1 Process for continuous preparation of a prepolymer based on phenolic resins, oxazolines and epoxides |
| 05/16/2012 | EP2452984A1 Degassing Compositions for Curable Coatings |
| 05/16/2012 | EP2452964A1 Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these |
| 05/16/2012 | EP2452963A1 Condensation products of aminofunctional polymers |
| 05/16/2012 | EP2251742B1 Composition for forming resist underlayer film and method for forming resist pattern using the same |
| 05/16/2012 | EP2206745B1 Radiation curable composition and method for producing the same |
| 05/16/2012 | EP2144953B1 Cross-linked silicone particles and method of manufacturing thereof |
| 05/16/2012 | CN102460644A Resin composition for nanoimprint, and method for forming structure |
| 05/16/2012 | CN102459406A Cationically polymerizable resin composition and cured object obtained therefrom |
| 05/16/2012 | CN102459397A Resin composition for sealing semiconductors, and semiconductor device |
| 05/16/2012 | CN102459396A Carbon nanotubes comprising hydroxy groups, method for the production thereof and polyurethane polymers comprising said carbon nanotubes |
| 05/16/2012 | CN102459395A Resin composition and organic-electrolyte battery |
| 05/16/2012 | CN102459394A Latent hardener for epoxy compositions |
| 05/16/2012 | CN102459354A Photosensitive composition |
| 05/16/2012 | CN102459155A 酰肼化合物及其制造方法、以及使用它的固化剂、树脂组合物及固化体 Hydrazide compound and its manufacturing method, and the use of its curing agent, the resin composition and a cured body |
| 05/16/2012 | CN102459144A 多元羧酸及其组合物、固化性树脂组合物、固化物以及多元羧酸的制造方法 The method of producing a polycarboxylic acid, and combinations thereof, the curable resin composition and a cured product of polycarboxylic acids |
| 05/16/2012 | CN102453308A Epoxy resin composition for electronic product encapsulation and manufacturing method thereof |
| 05/16/2012 | CN102453226A Resin composition, and prepreg and printed circuit board made from same |
| 05/16/2012 | CN102453225A Thermosetting resin composition and its application in prepreg film or laminated plate |
| 05/16/2012 | CN101277994B Rubber-modified polyamide resin, epoxy resin composition, and cured object obtained therefrom |
| 05/15/2012 | US8178599 Composition of epoxy resin, spherical alumina, ultrafine silica polyorganosiloxane and phenolic resin |
| 05/15/2012 | US8178598 Polyoxyalkylene polyamide-glycidyl ether adduct epoxy resin curing agent |
| 05/10/2012 | WO2012060916A1 Biodegradable film for flexographic printing plate manufacture and method of using the same |
| 05/10/2012 | WO2012060449A1 Cation-curable resin composition |
| 05/10/2012 | WO2012059558A1 Epoxy-thiol compositions with improved stability |