| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 06/21/2012 | US20120157572 Curable composition comprising imidazolium monocarboxylate salt |
| 06/21/2012 | CA2821878A1 Masterbatch-type latent curing agent for epoxy resin, and epoxy resin composition using the same |
| 06/20/2012 | EP2466378A2 Radiation curable resin composition and rapid prototyping process using the same |
| 06/20/2012 | EP2465887A1 Thermosetting resin composition for surface protection layers |
| 06/20/2012 | EP2465843A1 Polyamines with secondary aliphatic amines |
| 06/20/2012 | EP2465842A1 Amines with secondary aliphatic amines |
| 06/20/2012 | EP2161292B1 Epoxy resin composition |
| 06/20/2012 | CN102510870A Process for preparing episulfide resins |
| 06/20/2012 | CN102510856A 芳香族锍盐化合物 The aromatic sulfonium salt compound |
| 06/20/2012 | CN102504743A Single-component underfill capable of being stored at room temperature and preparation method thereof |
| 06/20/2012 | CN102504671A Anticorrosion energy-saving type curing agent for rapidly curing epoxy powder coating at low temperature and preparation method thereof |
| 06/20/2012 | CN102504495A Epoxy resin composite wave-absorbing material and preparation method thereof |
| 06/20/2012 | CN102504494A Single-component epoxy resin potting compound and preparation method thereof |
| 06/20/2012 | CN102504493A Epoxy resin composition applicable to pre-encapsulation of inner interconnection framework system |
| 06/20/2012 | CN102504491A Preparation method for waste circuit board non-metal powder modified epoxy glass fiber reinforced plastic composite material |
| 06/20/2012 | CN102504490A Injection moldable electric epoxy molding plastic and preparation method thereof |
| 06/20/2012 | CN102504489A Thermosetting resin composition, preparation method thereof and laminate |
| 06/20/2012 | CN102504486A Halogen-free flame-retardant epoxy resin and preparation method thereof |
| 06/20/2012 | CN102504483A Environmentally-friendly low-temperature-cured epoxy powder encapsulating material |
| 06/20/2012 | CN102504282A Preparation method of waterborne epoxy resin emulsion |
| 06/20/2012 | CN102504205A Preparation method for epoxy hardener resistant to boiling water boiling |
| 06/20/2012 | CN102504204A Organic polymer and carborundum composite wear-resistant material and preparation method thereof |
| 06/20/2012 | CN102504203A Encapsulation material used for encapsulating DG4 iron core coils, preparation method and encapsulation method |
| 06/20/2012 | CN102504202A Liquid crystal epoxy resin with shape memory effect and preparation method and application thereof |
| 06/20/2012 | CN102504201A Epoxy resin composition and high-frequency circuit board manufactured thereby |
| 06/20/2012 | CN102504200A High-performance high-heat-resistance modified epoxy resin and preparation method and use thereof |
| 06/20/2012 | CN102504199A Preparation method of room-temperature self-crosslinking water-based epoxy resin |
| 06/20/2012 | CN102504198A Method for preparing modified epoxy acrylate |
| 06/20/2012 | CN102504197A Halogen-free epoxy resin composition with high proof tracking index and application thereof |
| 06/20/2012 | CN102503982A Phosphonitrilic chloride trimer epoxy compound with flame-retardant property and preparation and application thereof |
| 06/20/2012 | CN101910241B Thermosetting resin composition and prepreg and laminate both made with the same |
| 06/20/2012 | CN101389682B Branched polyglycols and branched polyether functional organopolysiloxanes and coatings containing same |
| 06/19/2012 | US8202948 Phosphorus-containing compounds useful for making halogen-free ignition-resistant polymers |
| 06/19/2012 | CA2650528C Composite surfacing film with ultraviolet light and abrasion resistance |
| 06/14/2012 | WO2012077806A1 Optical adhesive resin composition, optical adhesive sheet, image display device, method for producing optical adhesive sheet, and method for producing image display device |
| 06/14/2012 | WO2012077636A1 Method for producing porous epoxy resin sheet |
| 06/14/2012 | WO2012077572A1 Sealing material for liquid-crystal dropping process, material for vertical conduction, and liquid-crystal display element |
| 06/14/2012 | WO2012077377A1 Resin composition |
| 06/14/2012 | US20120149932 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 06/14/2012 | US20120148840 Long-fiber-reinforced polymer material and method and installation for its manufacture |
| 06/13/2012 | EP1456286B1 Expandable epoxy resin-based systems modified with thermoplastic polymers |
| 06/13/2012 | CN102498161A Process for production of cured molded article, and cured molded article |
| 06/13/2012 | CN102498147A Epoxy resin curing indicator composition |
| 06/13/2012 | CN102498146A Polymer compositions and methods of making and using same |
| 06/13/2012 | CN102498141A 固化性树脂组合物 Curable resin composition |
| 06/13/2012 | CN102492349A Aqueous epoxy antistatic coating with nano-core-shell structural conductive polyaniline and preparation method thereof |
| 06/13/2012 | CN102492265A Synthetic resin composition for medium voltage bus of stub cable |
| 06/13/2012 | CN102492264A Low-voltage bus synthetic resin composition for connecting cable |
| 06/13/2012 | CN102492263A Epoxy under-fill adhesive capable of quickly curing at low temperature and preparation method thereof |
| 06/13/2012 | CN102492261A Adhesive for producing common Tg lead-free copper foil-coated plates and preparation method for adhesive |
| 06/13/2012 | CN102492149A Preparation method of nonionic aqueous epoxy resin curing agent |
| 06/13/2012 | CN102492140A Bi-phthalonitrile prepolymer as well as preparation method and application thereof, bi-phthalonitrile prepolymer/epoxy resin copolymer and preparation method thereof as well as bi-phthalonitrile prepolymer/epoxy resin cured material |
| 06/13/2012 | CN102492116A Epoxy resin and polyhedral silsesquioxane nano hybrid material and its preparation method |
| 06/13/2012 | CN102492100A Water-dispersed fluorine-containing hydroxyl acrylic-epoxy ester heterozygous body resin and coating thereof |
| 06/13/2012 | CN102060978B Pyridine polyether ionic liquid toughened epoxy resin and preparation method thereof |
| 06/13/2012 | CN101985515B Refrigerant-resistant sealing glue for high-voltage motor and preparation method thereof |
| 06/13/2012 | CN101910235B Epoxy compound and manufacturing method thereof |
| 06/13/2012 | CN101805505B PC/PMMA alloy and preparation method thereof |
| 06/13/2012 | CN101679604B Transparent composite sheet |
| 06/13/2012 | CN101578315B Epoxy resins comprising a cycloalphatic diamine curing agent |
| 06/13/2012 | CN101544879B Preparation method for high strength solventless epoxy adhesive |
| 06/13/2012 | CN101084252B Epoxy resin, epoxy resin composition, and cured object obtained therefrom |
| 06/12/2012 | US8198395 Alkylated aminopropylated ethylenediamines and uses thereof |
| 06/12/2012 | US8198347 High thermal-conductive, halogen-free, flame-retardant resin composition, and prepreg and coating thereof |
| 06/07/2012 | WO2012073703A1 Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet |
| 06/07/2012 | WO2012073672A1 Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet |
| 06/07/2012 | WO2012073666A1 Curable epoxy resin composition |
| 06/07/2012 | WO2012073633A1 Cationically polymerizable resin composition, optical material obtained using same, and laminate |
| 06/07/2012 | US20120142828 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 06/07/2012 | US20120142816 Novel epoxy hardeners with improved cure and polymers with enhanced coating properties |
| 06/07/2012 | US20120141793 Method of making a particulate epoxy resin |
| 06/06/2012 | EP2461350A1 Composition for forming resist underlayer film for nanoimprint lithography |
| 06/06/2012 | EP2459619A1 Impact resistant modified compositions |
| 06/06/2012 | EP2459613A1 Epoxy resin-based compositions modified for impact resistance |
| 06/06/2012 | CN102485764A Synthesis process for epoxy resin |
| 06/06/2012 | CN101400716B Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film |
| 06/06/2012 | CN101379109B Paint composition, in particular anti-corrosive paint for rare earth permanent magnets |
| 06/06/2012 | CN101370845B Aromatic ether polymer, method for producing same and polymer composition |
| 06/06/2012 | CN101166778B Composite, prepreg, laminated plate clad with metal foil, circuit board connecting member, and multilayer printed wiring board and method for manufacture thereof |
| 06/05/2012 | US8193297 Catalyst for curing epoxides |
| 06/05/2012 | US8193280 For example, 1,3-bis(glycidyl)imidazolium trifluoromethanesulfonimide; curing with 1,3-bis(3-aminophenoxy)benzene ; adhesives, coatings, composites; high tensile and adhesive strengths at extremely low temperatures and are stable at elevated temperatures; use in harsh environments such as aerospace |
| 06/05/2012 | CA2523755C Curable resin composition |
| 05/31/2012 | WO2012071261A1 Compositions and articles containing an active liquid in a polymeric matrix and methods of making and using the same |
| 05/31/2012 | WO2012071028A1 Epoxy resin comprising an adduct of dvbdo as toughener |
| 05/31/2012 | WO2012070529A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 05/31/2012 | WO2012070402A1 Epoxy resin based molding material for sealing and electronic part or device provided with element sealed with this molding material |
| 05/31/2012 | WO2012070387A1 Epoxy resin and resin composition |
| 05/31/2012 | WO2012070202A1 High-heat-resistant epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board |
| 05/31/2012 | WO2010062709A3 Phosphorus-containing silsesquioxane derivatives as flame retardants |
| 05/31/2012 | US20120136126 Deformable shape-memory polymer |
| 05/31/2012 | US20120136125 Self-repairing polymer |
| 05/31/2012 | DE102011119238A1 Selbstreparierendes Polymer Self-repairing polymer |
| 05/31/2012 | CA2817152A1 Compositions and articles containing an active liquid in a polymeric matrix and methods of making and using the same |
| 05/30/2012 | EP2458667A1 Fuel cell separator |
| 05/30/2012 | EP2456805A1 Two part epoxy adhesive system having improved open time |
| 05/30/2012 | EP2456804A1 Catalysis of epoxy resin formulations having sparingly soluble catalysts |
| 05/30/2012 | CN202246506U Waste polymer treatment system for basic epoxy resin production process |
| 05/30/2012 | CN202246505U System for removing epichlorohydrin in production technology of basic epoxy resins |
| 05/30/2012 | CN202246504U Phase separation system for epoxy chloropropane phase and water phase during production of base resin |
| 05/30/2012 | CN202246503U Dissolving system in halogen-free epoxy resin production process |