| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 07/04/2012 | CN102532924A Normal temperature solidified thermosetting epoxy bitumen material and preparation method thereof |
| 07/04/2012 | CN102532809A Organosilicon-epoxy resin composition and preparation method thereof |
| 07/04/2012 | CN102532807A Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the same |
| 07/04/2012 | CN102532806A Method for preparing epoxy resin composite material through SMC process |
| 07/04/2012 | CN102532490A Phosphorus phenolic resin, resin composition and condensate |
| 07/04/2012 | CN102532489A Process for continuous preparation of a prepolymer based on phenolic resins, oxazolines and epoxides |
| 07/04/2012 | CN102532488A Transparent silicone epoxy composition |
| 07/04/2012 | CN102532487A Modification of thermosetting phenolic resin |
| 07/04/2012 | CN102532486A Liquid aromatic amine epoxy resin curing agent and preparation method thereof |
| 07/04/2012 | CN102532485A High-heat conduction and high-toughness epoxy resin compound and preparation method thereof |
| 07/04/2012 | CN102532484A Epoxy resin composition and method for preparing prepreg and composite material by using same |
| 07/04/2012 | CN102532483A Thermosetting resin compound containing carboxyl modified polyurethane resin |
| 07/04/2012 | CN102532482A Epoxy resin organosilicon modifier and preparation method thereof |
| 07/04/2012 | CN102532481A Carboxyl functional group containing epoxy resin capable of chemically bonding with steel base material and preparation method thereof |
| 07/04/2012 | CN102532480A Providing an epoxy resin cured article capable of giving excellent high thermal decomposition stability, high heat tolerance, low thermal expansibility, flame retardancy, and low hygroscopicity |
| 07/04/2012 | CN102532479A Novel aliphatic hyperbranched epoxy resin |
| 07/04/2012 | CN102532449A Preparation method of mixed cresol modified meta-xylylene diamine epoxy resin curing agent |
| 07/04/2012 | CN102532429A Energy ray-curable resin composition for optical lens sheet and cured product thereof, and the optical lens sheet |
| 07/04/2012 | CN102532427A Synthesizing method for tough epoxy vinyl ester resin |
| 07/04/2012 | CN102229701B Non-ionic aqueous epoxy resin emulsion and its preparation method |
| 07/04/2012 | CN102108185B Epoxy matrix resin and prepreg and preparation method thereof and device for preparation thereof |
| 07/04/2012 | CN101974237B Epoxy bitumen material for highway and road bridge and preparation method thereof |
| 07/04/2012 | CN101974162B Low-VOC (Volatile Organic Compound) self-emulsifying solid epoxy resin water-based emulsion and preparation method thereof |
| 07/04/2012 | CN101948610B Low-viscosity bi-component epoxy resin potting adhesive and preparation method thereof |
| 07/04/2012 | CN101935387B Modified UV photocuring pure acrylic resin and preparation method thereof |
| 07/04/2012 | CN101891936B Preparation method of composite material based on epoxy resin and phosphazene nanotubes |
| 07/04/2012 | CN101821677B Composition for forming resist underlayer film and method of forming resist pattern from the same |
| 07/04/2012 | CN101796132B Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board |
| 07/04/2012 | CN101792576B Epoxy acrylate prepolymer resin, preparation method thereof and application thereof in bicomponent structural adhesive |
| 07/04/2012 | CN101747490B Fluorine-containing resin and preparation method thereof, conformal coating and printed circuit board |
| 07/04/2012 | CN101679609B Epoxy resin composition, prepreg, and fiber-reinforced composite material |
| 07/04/2012 | CN101663286B Process for producing tetraglycidylamino compound |
| 07/04/2012 | CN101611068B Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition |
| 07/04/2012 | CN101560323B Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound |
| 07/04/2012 | CN101541411B Universal wetting agents and dispersants based on isocyanate monoadducts |
| 07/04/2012 | CN101522751B Liquid resin composition for electronic part sealing and electronic part apparatus utilizing the same |
| 07/04/2012 | CN101522747B Modified liquid epoxy resin, epoxy resin composition using the same, and cured product thereof |
| 07/04/2012 | CN101460537B New epoxy compound and method for producing the same |
| 07/04/2012 | CN101379118B Epoxy resin curable composition for prepreg |
| 07/04/2012 | CN101341212B Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability |
| 07/04/2012 | CN101044185B Photosensitive compositions based on polycyclic polymers |
| 07/03/2012 | US8211330 particles of an adduct formed through the reaction of an epoxy resin with imidazole compounds and an ethyl cellulose films crosslinked with a polyfunctional isocyanate covering the surfaces of the particles, having excellent solvent resistance, low temperature quick setting ability and storage stability |
| 06/28/2012 | WO2012088163A2 Method for preparing a conformally sealed printed wiring board using a coated substrate comprising a curable epoxy composition comprising imidazolium salts |
| 06/28/2012 | WO2012088160A2 A coated substrate comprising a curable epoxy composition comprising imidazolium salts and method for preparing same |
| 06/28/2012 | WO2012088158A2 Curable epoxy composition comprising imidazolium salts and method for curing same |
| 06/28/2012 | WO2012088148A2 Latent cure catalyst based upon imidazolium salts useful for epoxy compositions |
| 06/28/2012 | WO2012087546A1 Curable adhesive composition |
| 06/28/2012 | WO2012087307A1 Economical, food-safe extraction of bisphenols |
| 06/28/2012 | WO2012086840A1 Diepoxy compound and process for producing same |
| 06/28/2012 | WO2012086463A1 Curable epoxy resin composition and photosemiconductor device using same |
| 06/28/2012 | WO2012086445A1 Anaerobically curable composition |
| 06/28/2012 | WO2012086219A1 Flexible printed wiring board, and laminate for use in production of flexible printed wiring board |
| 06/28/2012 | WO2012085120A2 Use of thiocarbonates in epoxy resin formulations for surface improvement |
| 06/28/2012 | WO2012084959A1 Storage-stable heat-curable granular material mixture |
| 06/28/2012 | WO2012084807A1 Heat-curing sealing compound compositions having fast skin formation and good storage stability |
| 06/28/2012 | WO2012084569A1 Epoxy resin compositions containing epoxy and vinyl ester groups |
| 06/28/2012 | WO2012083728A1 Halogen-free resin composition and method for fabricating halogen-free copper clad laminate using the same |
| 06/28/2012 | WO2012083727A1 Halogen-free high-tg resin composition and prepreg and laminate fabricated by using the same |
| 06/28/2012 | US20120165502 Molded body production device, molded body production method, and molded body |
| 06/28/2012 | US20120165429 Novel methods for producing thermosetting epoxy resins |
| 06/28/2012 | CA2822578A1 Epoxy resin system containing insoluble and partially soluble or swellable toughening particles for use in prepreg and structural component applications |
| 06/27/2012 | EP2468816A1 Photocurable fluorinated polymer composition |
| 06/27/2012 | EP2468795A1 Adhesive compositions for optical fibers |
| 06/27/2012 | EP2468794A1 Storage-stable and heat -curable mixture of granulates |
| 06/27/2012 | EP2468793A1 Resin composition for fiber-reinforced composite materials, cured product thereof, fiber-reinforced composite materials, moldings of fiber-reinforced resin, and process for production thereof |
| 06/27/2012 | EP2468792A1 Curable adhesive composition |
| 06/27/2012 | EP2468791A1 Use of thiocarbonates in formulations based on epoxide resins for enhancement of surfaces |
| 06/27/2012 | EP2468785A1 Heat-curing sealant compositions with fast skinning and high storage stability |
| 06/27/2012 | EP2226347B1 Epoxy resin curing agent, method for producing the same, and epoxy resin composition |
| 06/27/2012 | EP1914811B1 Light-emitting device, method for manufacturing same, molded body and sealing member |
| 06/27/2012 | CN102516912A Method for preparing composite curing agent modified bisphenol F thermosetting adhesive repairing agent special for ballastless track gap and crack damage |
| 06/27/2012 | CN102516718A Resin composition and metal-based copper-clad plate using resin composition as heat conducting insulation layer |
| 06/27/2012 | CN102516714A Preparation method of nano epoxy resin composite material |
| 06/27/2012 | CN102516712A Heat curable resin composition for light reflection, optical semiconductor element mounting substrate and optical semiconductor device using the resin composition |
| 06/27/2012 | CN102516561A Anionic terpenyl epoxy resin polyolamine aqueous dispersion, its preparation method and application |
| 06/27/2012 | CN102516502A Preparation method of novel Mannich water-based epoxy curing agent |
| 06/27/2012 | CN102516501A Photo-curing material for manufacturing light-emitting diode (LED) lens |
| 06/27/2012 | CN102516500A Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof |
| 06/27/2012 | CN102516499A Epoxy resin composition for encapsulating semiconductor and semiconductor device |
| 06/27/2012 | CN102516498A Preparation method of polymer mixed network-based polymer dispersed liquid crystal (PDLC) film material |
| 06/27/2012 | CN102516497A Fluorine-containing resin, preparation method thereof, conformal coating and printed circuit board |
| 06/27/2012 | CN102514304A Common Tg lead-free copper clad laminate and preparation method thereof |
| 06/27/2012 | CN102101935B Halogen-free epoxy resin composition and flexible copper clad plate prepared from same |
| 06/27/2012 | CN102020830B Halogen-free fire resistance resin composite and application thereof |
| 06/27/2012 | CN101973986B Benzimidazole structure-containing diamine benzoxazine intermediate and preparation method thereof |
| 06/27/2012 | CN101921460B Epoxy asphalt deck crack repairing agent capable of being cured at normal temperature |
| 06/27/2012 | CN101861545B Liquid crystal sealing agent and liquid crystal display cell using the same |
| 06/27/2012 | CN101595152B Latent curing agent |
| 06/27/2012 | CN101560380B Preparation method of depolymerized and dispersed viscosity reducer of heavy oil |
| 06/27/2012 | CN101535450B Granular solid wax particle |
| 06/27/2012 | CN101525439B Modified epoxide resin for structural adhesive of wind generating blades and preparation method thereof |
| 06/27/2012 | CN101346415B Curable composition |
| 06/27/2012 | CN101292004B Coating compositions and methods |
| 06/27/2012 | CN101233452B Photosensitive resin composition and cured article thereof |
| 06/26/2012 | US8207278 Process for preparing stable photoresist compositions |
| 06/21/2012 | WO2012082224A1 Curable compositions |
| 06/21/2012 | WO2012081966A1 Heat curable polymer matrix and method of preparation thereof |
| 06/21/2012 | WO2012081192A1 Masterbatch-type latent curing agent for epoxy resin, and epoxy resin composition using the same |
| 06/21/2012 | WO2012080265A1 Polyamines having secondary aliphatic amino groups |
| 06/21/2012 | WO2012080264A1 Amines having secondary aliphatic amino groups |