Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
09/2000
09/26/2000US6124023 Prepreg for laminate and process for producing printed wiring-board using the same
09/26/2000CA2014017C Cationically electrodepositable resin composition
09/21/2000WO2000055254A1 Hardenable composition with a particular combination of characteristics
09/21/2000WO2000055238A1 Fluorinated polymer and coating composition
09/21/2000WO2000055234A1 Epoxy resin compositions having a long shelf life
09/21/2000WO2000055231A1 High solid epoxy, melamine and isocyanate compositions
09/21/2000WO2000055228A1 Radiation curable resin composition
09/21/2000CA2365510A1 Hardenable composition with a particular combination of characteristics
09/21/2000CA2361302A1 High solid epoxy, melamine and isocyanate compositions
09/20/2000EP1037111A1 Ultraviolet curable resin composition and photo solder resist ink using the same
09/20/2000EP1036811A1 Prepreg and laminated board
09/20/2000EP1036790A1 Perfluoro group-containing compounds and hardened polymer of the same
09/20/2000EP1036789A1 Novel aromatic sulfonium compounds, photoacid generators comprising the same, photopolymerizable compositions containing the same, stereolithographic resin compositions, and stereolithographic process
09/20/2000EP1036108A2 Storage-stable cationically polymerised preparations with improved hardening characteristics
09/20/2000EP1036106A1 Condensation polymer containing hydroxyalkylamide groups
09/20/2000CN1267317A Conductive epoxy resin compositions anisotropically conductive adhesive films and electrical connecting methods
09/20/2000CN1267314A Flame retardant epoxy resin composition
09/20/2000CN1267312A Coating composition comprising compound comprising at least one bicyclo-orthoester group and at least one other functional group
09/20/2000CN1056624C Process for preparing adhesive block copolymer
09/19/2000US6121405 Method for preparing a high-heat-resistant-epoxy-resin composition comprising pyrazinium salt containing a benzyl group
09/19/2000US6121398 High modulus polymers and composites from plant oils
09/19/2000US6121389 An epichlorohydrin-modified polyester based on a dicarboxylic acid and a dihydroxy(tertiary-aliphatic)monocarboxylic acid; coatings; castings; low temperature curing; low viscosity;high epoxy functionality
09/19/2000US6121386 Resin compositions for coating
09/19/2000US6121350 Single package ionic emulsion polymers and their preparation
09/19/2000US6121348 Powderable reactive resin compositions
09/19/2000US6121339 Adhesive
09/19/2000US6120696 Proton conductors in liquid form
09/19/2000CA2299705A1 Nanocomposites formed by onium ion-intercalated clay and rigid anhydride-cured epoxy resins
09/19/2000CA2081210C Glass-reinforced grafted branched higher alpha-olefins
09/14/2000WO2000053654A1 Epoxy resin composition, epoxy resin composition for fiber-reinforced composite, and fiber-reinforced composite containing the same
09/14/2000WO2000053650A1 Compositions for protecting cable strands for highway structures
09/14/2000WO2000053645A1 Hydroxy-epoxide thermally cured undercoat for 193 nm lithography
09/14/2000DE19916201C1 Combustion engine piston shafts are at least partially coated with epoxy based resin comprising bisphenol A resin containing specified range of novolac resin
09/14/2000CA2365581A1 Compositions for protecting cable strands for highway structures
09/13/2000EP1035440A1 Photosensitive resin and photosensitive resin composition
09/13/2000EP1035158A1 Resin composition with biodegradability and foamability
09/13/2000EP1035148A1 Aqueous solution of water-soluble epoxy resin, solid obtained therefrom, and processes for producing these
09/13/2000EP1034193A1 Phenol-novolacs with improved optical properties
09/13/2000EP0929592A4 Thermosetting resin compositions useful as underfill sealants
09/13/2000EP0813521B1 Energy-activatable salts with fluorocarbon anions
09/13/2000CN1056399C Electrically conductive adhesive compositions
09/12/2000US6117953 Blends
09/12/2000US6117952 Curable
09/12/2000US6117931 Hydrophobic carbamate-functional compound, especially metallic pigments,
09/12/2000US6117923 Resin for optical material
09/08/2000WO2000052086A2 Heat-curable, thermally expandable epoxy resin moulded part
09/08/2000WO2000052016A1 Phosphorus-comprising materials, their preparation and use
09/08/2000WO2000022024A3 High strength epoxy adhesive and uses thereof
09/08/2000CA2362894A1 Heat-curable, thermally expandable epoxy resin moulded part
09/08/2000CA2362806A1 Phosphorus-comprising materials, their preparation and use
09/07/2000DE19909270A1 Hitzehärtbarer, thermisch expandierbarer Formkörper The hot-curing, thermally expandable moldings
09/07/2000DE10004442A1 New epoxide compounds, useful for the production of epoxy resins for adhesives and components, have liquid crystal properties
09/06/2000EP0711146B1 Osmotic device having a vapor-permeable coating
09/06/2000CN1265695A Aqueous dispersions of epoxy resins
09/06/2000CN1056159C Catalytic compositions and coating made therefrom
08/2000
08/31/2000WO2000050512A1 Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device
08/30/2000EP1031574A1 Phosphorylated polyol, oligomer therefrom, polymer therefrom, processes for preparing them and their uses
08/30/2000EP1030894A1 Conductive organic coatings
08/30/2000EP1030885A1 Water compatible curing agents for epoxy resins
08/30/2000EP0970520A4 Mounting structure and mounting process from semiconductor devices
08/30/2000EP0730493B1 Use of a polymer material based on modified hydrocolloids as encapsulating material
08/30/2000CN1265122A Polyamidoamine/epichlorohydrin resins bearing polyol sidechains as dry strength agents
08/30/2000CN1265103A Process for mfg. epoxy compounds
08/29/2000US6111061 Polymer compositions
08/29/2000US6111050 Comprising perfluoro compound having two secondary amino groups per molecule and a divalent perfluoroalkylene or perfluoropolyether structure and a fluorinated compound having three functional groups crosslinkable with amine groups
08/29/2000US6111044 Thermosetting compositions, coating compositions method of coating, and coated articles
08/29/2000US6111030 A latent activatable composite comprising a base system chosen from the group consisting of epoxies, polysulfides and polycyanoacrylates which cures upon activation by the reaction of base system and amine terminated polyamide curative
08/29/2000US6111015 Core/shell polymer toughener suspended in epoxy resin
08/29/2000US6110996 Building composition and method for making the same
08/29/2000US6110993 Thermosetting epoxy resin composition
08/29/2000CA2005477C Polyether resins, and process for preparing the same
08/24/2000WO2000049087A1 Epoxy resin composition
08/24/2000WO2000049080A1 Photo curable liquid resin composition and photofabricated cured product
08/24/2000WO2000049064A1 Epoxy compounds for dental medical and/or dental technical applications
08/24/2000WO2000049061A1 Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same
08/23/2000EP1029880A1 Epoxy resin composition suitable for dental applications
08/23/2000EP1029000A1 Crystallization resistant amidoamine compositions
08/23/2000EP1028989A1 Hydroxy ether polymers as thermoplastic barrier resins
08/23/2000EP0906352B1 Novolak compounds useful as adhesion promoters for epoxy resins
08/23/2000CN1264396A Hydroxy-functional oligomers for high solids coatings
08/23/2000CN1264373A Polyglycidyl spirocompounds and their use in epoxy resins
08/22/2000US6107451 Hardener for anhydride group-containing polymers
08/22/2000US6107442 Powder coating material
08/22/2000US6107437 Curing agents
08/22/2000US6107419 Reacting divalent epoxy resin with a bisphenol compound in the presence of a catalyst and a solvent
08/22/2000US6107369 Crosslinked thick film with no pin hole is formed by curing a curable monomer and tris-pyrrolidonyl triazine crosslinker
08/22/2000US6107362 Consists of acrylic or mathacrylic compounds of epoxide(meth) acrylates, obtained by reacting acrylic acid or methacrylic acid with an epoxide in presence of an esterification product of hydroxy compound with same acrylic or methacrylic acid
08/22/2000US6106891 Applying a curable fill to an aperture, peeling a layer of polymer, applying heat and pressure
08/17/2000WO2000047663A1 Compositions and methods for controlling stickies
08/17/2000WO2000047654A1 Highly resistant polymeric resin
08/17/2000DE19905877A1 Hochfestes Polymerharz High-strength polymer resin
08/17/2000CA2359732A1 Compositions and methods for controlling stickies
08/16/2000EP1028144A2 Curable compositions comprising cyanate resins and epoxy compounds
08/15/2000US6103853 Amine curing agents and epoxy coatings produced using same
08/15/2000US6103835 Epoxy-functional polyester advanced with carboxyl-functional polyester or dicarboxylic acid (anhydride)
08/15/2000US6103825 Epoxy resin pre-advanced with carboxyl-containing polyester and advanced with bisphenol
08/15/2000CA2015044C Copolymers containing hydroxyl, epoxide and anhydride groups, a process for their production and their use as binders or binder components
08/10/2000WO2000046296A1 Polyester molding composition
08/10/2000WO2000046171A1 Novel crystalline ion-association substance, process for producing the same, and polymerization initiator
08/10/2000WO2000032351A3 Weldable, coated metal substrates and methods for preparing and inhibiting corrosion of the same