Patents
Sitemap › B81 - Micro-structural technology › B81B - Micro-structural devices or systems, e.g. micro-mechanical devices › B81B 7 - Micro-structural systems
Patents for B81B 7 - Micro-structural systems (8,983)
11/2013
11/20/2013CN103395737A Nonvolatile non-reversibility multi-logic reused logic device based on MEMS technology
11/20/2013CN103395736A MEMS glass size bonding structure and manufacturing method thereof
11/20/2013CN103395735A Packaging structure of micro electro mechanical system device
11/20/2013CN102175909B Micro-electro-mechanical system (MEMS) cantilever type microwave power automatic detection system and detection method and preparation method thereof
11/19/2013USRE44605 Integrated spectroscopy system
11/19/2013US8587102 Vertical system integration
11/19/2013CA2732738C Efficient inkjet nozzle assembly
11/14/2013DE19800574B4 Mikromechanisches Bauelement Micromechanical component
11/14/2013DE102012208053A1 Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung Hybrid integrated component and method for its production
11/14/2013DE102012208033A1 Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung Hybrid integrated component and method for its production
11/14/2013DE102012208032A1 Hybrid integriertes Bauteil Hybrid integrated component
11/14/2013DE102012208031A1 +Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung + Hybrid integrated component and method for its production
11/14/2013DE102012208030A1 Mikromechanischer Inertialsensor und Verfahren zu dessen Herstellung Micromechanical inertial sensor and method for its production
11/14/2013DE102012207937A1 Drehratensensor Rotation rate sensor
11/13/2013EP2661413A1 Method for encapsulating a micro-component
11/13/2013CN1974372B Monolithic integrated sensor chip for measing three parameters of pressure difference, absolute pressure and temperature and making process thereof
11/13/2013CN102117946B Radio frequency micro electro mechanical system switch with spring plate contact and manufacturing method thereof
11/13/2013CN102107845B Micron sensing element, and preparation method and application thereof
11/07/2013WO2013166021A1 Transparent through - glass conductive via in a transparent substrate
11/07/2013WO2013081458A4 Mems scanning micromirror
11/07/2013US20130293432 Mems module, variable reactance circuit and antenna device
11/07/2013US20130292247 Method and microsystem for the determination of clausius-mossotti factors for colloidal particles
11/07/2013DE112011104873T5 MEMS-Vorrichtung, umfassend eine Under-Bump-Metallisierung MEMS device comprising an under-bump metallization
11/07/2013DE102013104463A1 Chip-Einbettungsgehäuse und Verfahren zum Bilden eines Chip-Einbettungsgehäuses Chip embedding housing and method of forming a chip embedding housing
11/07/2013DE102012206042B4 Verfahren und Vorrichtung zur gezielten Prozessführung in einem Mikrofluidik-Prozessor mit integrierten aktiven Elementen Method and apparatus for selective process control in a microfluidic processor with integrated active elements
11/07/2013DE102012001769B4 Gebondete gestapelte wafer Bonded wafer stacked
11/07/2013DE102004058879B4 MEMS-Mikrophon und Verfahren zur Herstellung MEMS microphone and methods for preparing
11/06/2013EP2660191A2 Housing for encapsulating a micro-scanner mirror
11/06/2013EP2660190A1 Encapsulated component with active element and implantable medical device comprising said component
11/06/2013CN203269551U Integrated chip of MEMS and integrated circuit
11/06/2013CN203269550U Tower-type anchor of uncooled infrared detector
11/06/2013CN103384639A Mems device comprising an under bump metallization
11/06/2013CN103382016A BioMEMS employing integrated package member and planar optical circuit
11/06/2013CN102252665B Packaging structure for all-solid-state oscillating micro gyroscope
10/2013
10/31/2013US20130285175 Micromechanical component and method for manufacturing a micromechanical component
10/31/2013US20130285170 Multiple bonding in wafer level packaging
10/31/2013US20130285165 Method for manufacturing a hybrid integrated component
10/31/2013US20130285162 Integrated getter area for wafer level encapsulated microelectromechanical systems
10/31/2013US20130285059 Micromachine and method for manufacturing the same
10/31/2013DE102012207165A1 Micro-electromechanical device e.g. micro-electromechanical sensor such as inertial sensor, has electrically conductive metallization portion which is arranged on surface of substrate and is partially formed of chemically active getter
10/31/2013DE102012206875A1 Verfahren zum Herstellen eines hybrid integrierten Bauteils A method for manufacturing a hybrid integrated component
10/31/2013DE102012206869A1 Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements Micromechanical component and process for producing a micromechanical component
10/31/2013DE102012206858A1 Verfahren zum Herstellen einer optischen Fenstervorrichtung für eine MEMS-Vorrichtung A method of manufacturing an optical window apparatus for a MEMS device
10/31/2013DE102012206854A1 Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung Hybrid integrated component and method for its production
10/31/2013DE102012206042A1 Verfahren und Vorrichtung zur gezielten Prozessführung in einem Mikrofluidik-Prozessor mit integrierten aktiven Elementen Method and apparatus for selective process control in a microfluidic processor with integrated active elements
10/30/2013EP2656506A1 Sensor and a sensor system
10/30/2013CN203255964U MEMS (Micro Electro Mechanical Systems) module and control system based on same
10/30/2013CN203255963U 集成器件组件 Integrated Device Components
10/30/2013CN103378061A Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
10/30/2013CN103377983A SOI Wafer, manufacturing method therefor, and MEMS device
10/30/2013CN103373701A Method for producing an optical window device for a mems device
10/30/2013CN103373700A Methods for producing a cavity within a semiconductor substrate
10/30/2013CN103373697A Hybrid integrated component and method for the manufacture thereof
10/30/2013CN103373696A Packaged MEMS device and method of calibrating a packaged mems device
10/30/2013CN103373695A MEMS device structure and methods of forming same
10/30/2013CN102620814B Orange-peel encapsulating structure for bionic vector hydrophone of micro-electro-mechanical system
10/30/2013CN102268256B Fluorescent material able to emit red and green lights under excitation of blue lights and preparation method thereof
10/30/2013CN101925530B Package method for manufacturing semiconductor device
10/24/2013WO2013158805A1 Thin film bi-material lattice structures and methods of making the same
10/24/2013US20130279137 Energy storage structure, method of manufacturing a support structure for same, and microelectronic assembly and system containing same
10/24/2013US20130277774 Method for manufacturing a hybrid integrated component
10/24/2013DE112008001648B4 Mikroelektromechanisches optisches System und verteilte Rechenplattform mit optischem Datenstrahl Micro-electromechanical optical system and distributed computing platform with optical data beam
10/24/2013DE102013207233A1 Gekapselte mems-vorrichtung und verfahren zur kalibrierung einer gekapselten mems-vorrichtung Encapsulated mems device and method for calibration of an encapsulated mems device
10/24/2013DE102012206732A1 Verfahren zum Herstellen eines hybrid integrierten Bauteils A method for manufacturing a hybrid integrated component
10/24/2013DE102012206719A1 Mikromechanisches Sensorelement und Sensoreinrichtung mit einem derartigen Sensorelement The micromechanical sensor element and sensor means with such a sensor element
10/24/2013CA2775297A1 Methods and apparatuses for evaluating water pollution
10/23/2013EP2653443A2 Stress isolated mems structures and methods of manufacture
10/23/2013CN103369441A MEMS device, MEMS structure and method of making MEMS device
10/23/2013CN103364636A Micro-machinery cantilever capacitance type power sensor-based phase detector and manufacturing method of phase detector
10/23/2013CN103359681A Sensor, method for producing sensor and method for mounting sensor
10/23/2013CN103359680A Vacuum-packaged ultrathin MEMS chip and processing method thereof
10/23/2013CN103359679A Electronic device and manufacturing method thereof, electronic apparatus, and moving body
10/23/2013CN103359678A Semiconductor device and method of manufacturing same
10/23/2013CN103359677A Infrared detector packaging structure and manufacturing method thereof
10/23/2013CN102279414B Machine core of MEMS (Micro Electro Mechanical System) simulation detector
10/23/2013CN101970098B Micropump device
10/22/2013US8562805 Method of actuating and an actuator
10/17/2013US20130271807 Micromechanical component and method for producing a micromechanical component
10/17/2013US20130271806 Micromechanical component and method for producing a micromechanical component
10/17/2013US20130269413 Mems quadrature cancellation and signal demodulation
10/17/2013DE102012206531A1 Verfahren zur Erzeugung einer Kavität innerhalb eines Halbleitersubstrats A method for generating a cavity within a semiconductor substrate
10/17/2013DE102012206291A1 Micromechanical component for use in various optical applications, has driving structure and actuating element arranged relative to each other, such that rotational axis is spaced from center of gravity of drive structure
10/17/2013DE102012206280A1 Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil Micromechanical element and manufacturing method for a micromechanical component
10/17/2013DE102012206269A1 Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil Micromechanical element and manufacturing method for a micromechanical component
10/17/2013DE102012205921A1 Membrananordnung für einen mikro-elektromechanischen Messumformer und Verfahren zum Herstellen einer Membrananordnung Membrane assembly for a micro-electro-mechanical transducer and method for producing a membrane assembly
10/17/2013DE102012205878A1 Mikromechanischer Drucksensor The micromechanical pressure sensor
10/17/2013DE102012103256A1 Mikrostrukturapparat mit optischer Oberflächengüte sowie Verfahren zur Herstellung desselben The same microstructure apparatus with optical surface quality and methods of making
10/17/2013DE102007063742B4 Sensor für eine physikalische Größe Sensor for a physical quantity
10/16/2013EP2649005A1 Process for manufacturing electro-mechanical systems
10/16/2013CN203241308U Structure for testing Young modulus of top silicon layer of silicon-on-insulator material
10/16/2013CN203238029U MEMS element provided with structure reducing packaging stress
10/16/2013CN203236987U SIP (System In package)-based automobile tire pressure monitoring multichip sensor module
10/16/2013CN103350983A Integrated wafer-level vacuum packaged MEMS device and manufacturing method thereof
10/16/2013CN102198924B Electronic device
10/10/2013WO2013149547A1 Multi-silicon trench forming method and etching mask structure thereof for mems sealing cap silicon chip
10/10/2013US20130264662 Electronic device, system, and method comprising differential sensor mems devices and drilled substrates
10/10/2013US20130263996 Venting array and manufacturing method
10/10/2013US20130263663 Wide G Range Accelerometer
10/10/2013DE112010006074T5 HF-Vorrichtung und Verfahren zum Abstimmen einer HF-Vorrichtung RF device and method for tuning an RF device
10/10/2013DE102013205527A1 Mems-bauelement und verfahren zur herstellung eines mems-bauelements MEMS device and method of manufacturing a MEMS device
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